XC2220U Data Sheet

16/32-Bit
Architecture
XC2220U
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family / Compact Line
Data Sheet
V1.2 2012-07
Microcontrollers
Edition 2012-07
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2012 Infineon Technologies AG
All Rights Reserved.
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Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
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be endangered.
16/32-Bit
Architecture
XC2220U
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2000 Family / Compact Line
Data Sheet
V1.2 2012-07
Microcontrollers
XC2220U
XC2000 Family / Compact Line
XC2220U Data Sheet
Revision History: V1.2 2012-07
Previous Versions: V1.0 2010-12, V1.1 2011-09
Page
Subjects (major changes since last revision)
50, 51
The value of absolute sum of overload currents parameter in absolute
maximum rating parameter and operating conditions tables are switched.
72
Table description on coding of bit field LEVxV is updated.
Trademarks
C166™, TriCore™ and DAVE™ are trademarks of Infineon Technologies AG.
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Data Sheet
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Table of Contents
Table of Contents
1
1.1
1.2
1.3
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Basic Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Special Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2
2.1
2.2
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.15
3.16
3.17
3.18
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Subsystem and Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Central Processing Unit (CPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection Unit (MPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Checker Module (MCHK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support (OCDS) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Unit (CC2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Capture/Compare Units CCU6x . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer (GPT12E) Unit . . . . . . . . . . . . . . . . . . . . . . . . . . .
Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A/D Converters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Universal Serial Interface Channel Modules (USIC) . . . . . . . . . . . . . . . . .
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Window Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parallel Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
21
22
25
27
27
28
29
30
33
35
39
41
42
43
43
44
45
46
47
4
4.1
4.1.1
4.2
4.2.1
4.3
4.3.1
4.3.2
4.3.3
4.4
4.5
4.6
4.7
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage Range definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters for Upper Voltage Area . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters for Lower Voltage Area . . . . . . . . . . . . . . . . . . . . . . . .
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog/Digital Converter Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
50
50
51
53
53
54
56
58
60
64
70
73
75
Data Sheet
1
3
6
7
8
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Table of Contents
4.7.1
4.7.2
4.7.2.1
4.7.2.2
4.7.2.3
4.7.3
4.7.4
4.7.5
4.7.6
5
5.1
5.2
5.3
Data Sheet
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Definition of Internal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Wakeup Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Selecting and Changing the Operating Frequency . . . . . . . . . . . . . .
External Clock Input Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Synchronous Serial Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . .
Debug Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
76
77
80
80
81
83
86
90
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Thermal Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
2
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Summary of Features
16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance
XC2220U (XC2000 Family)
1
Summary of Features
For a quick overview and easy reference, the features of the XC2220U are summarized
here.
•
•
•
•
•
•
High-performance CPU with five-stage pipeline and MPU
– 15.2 ns instruction cycle @ 66 MHz CPU clock (single-cycle execution)
– One-cycle 32-bit addition and subtraction with 40-bit result
– One-cycle multiplication (16 × 16 bit)
– Background division (32 / 16 bit) in 21 cycles
– One-cycle multiply-and-accumulate (MAC) instructions
– Enhanced Boolean bit manipulation facilities
– Zero-cycle jump execution
– Additional instructions to support HLL and operating systems
– Register-based design with multiple variable register banks
– Fast context switching support with two additional local register banks
– 16 Mbytes total linear address space for code and data
– 1,024 Bytes on-chip special function register area (C166 Family compatible)
– Integrated Memory Protection Unit (MPU)
Interrupt system with 16 priority levels providing 46 interrupt nodes
– Selectable external inputs for interrupt generation and wake-up
– Fastest sample-rate 15.2 ns
Eight-channel interrupt-driven single-cycle data transfer with
Peripheral Event Controller (PEC), 24-bit pointers cover total address space
Clock generation from internal or external clock sources,
using on-chip PLL or prescaler
Hardware CRC-Checker with Programmable Polynomial to Supervise On-Chip
Memory Areas
On-chip memory modules
– 2 Kbytes on-chip dual-port RAM (DPRAM)
– 2 Kbytes on-chip data SRAM (DSRAM)
– 4 Kbytes on-chip program/data SRAM (PSRAM)
– Up to 64 Kbytes on-chip program memory (Flash memory)
– Memory content protection through Error Correction Code (ECC) for Flash
memory and through parity for RAMs
Data Sheet
3
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Summary of Features
•
•
•
•
•
•
•
•
•
On-Chip Peripheral Modules
– Synchronizable 12-bit A/D Converter with up to 10 channels,
conversion time below 1 μs, optional data preprocessing (data reduction, range
check), broken wire detection
– 16-channel general purpose capture/compare unit (CC2)
– Capture/compare unit for flexible PWM signal generation (CCU60)
– Multi-functional general purpose timer unit with 5 timers
– Up to 2 serial interface channels to be used as UART, LIN, high-speed
synchronous channel (SPI/QSPI), IIC bus interface (10-bit addressing, 400 kbit/s),
IIS interface
– On-chip system timer and on-chip real time clock
Single power supply from 3.0 V to 5.5 V
Power reduction and wake-up modes with flexible power management
Programmable window watchdog timer and oscillator watchdog
Up to 33 general purpose I/O lines
On-chip bootstrap loaders
Supported by a full range of development tools including C compilers, macroassembler packages, emulators, evaluation boards, HLL debuggers, simulators,
logic analyzer disassemblers, programming boards
On-chip debug support via Device Access Port (DAP), Single-Pin DAP (SPD) or
JTAG interface
48-pin Green VQFN package, 0.5 mm (10.7 mil) pitch
Ordering Information
The ordering code for an Infineon microcontroller provides an exact reference to a
specific product. This ordering code identifies:
•
•
•
the function set of the corresponding product type
the temperature range1):
– SAF-…: -40°C to 85°C
– SAH-…: -40°C to 110°C
– SAK-…: -40°C to 125°C
the package and the type of delivery.
For ordering codes for the XC2220U please contact your sales representative or local
distributor.
This document describes several derivatives of the XC2220U group:
Basic Device Types are readily available and
Special Device Types are only available on request.
1) Not all derivatives are offered in all temperature ranges.
Data Sheet
4
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Summary of Features
As this document refers to all of these derivatives, some descriptions may not apply to a
specific product, in particular to the special device types.
For simplicity the term XC2220U is used for all derivatives throughout this document.
Data Sheet
5
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Summary of Features
1.1
Basic Device Types
Basic device types are available and can be ordered through Infineon’s direct and/or
distribution channels.
Table 1
Synopsis of XC2220U Basic Device Types
1)
Derivative
Flash
Memory2)
PSRAM
DSRAM3)
Capt./Comp. ADC4) Interfaces4)
Modules
Chan.
XC2220U-8FxV
64 Kbytes
4 Kbytes
2 Kbytes
CC2
CCU60
10
2 Serial Chan.
1) x is a placeholder for available speed grade in MHz. Can be 40 or 66.
2) Specific information about the on-chip Flash memory in Table 3.
3) All derivatives additionally provide 2 Kbytes DPRAM.
4) Specific information about the available channels in Table 5.
Data Sheet
6
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Summary of Features
1.2
Special Device Types
Special device types are only available for high-volume applications on request.
Table 2
Synopsis of XC2220U Special Device Types
Derivative1)
Flash
Memory2)
PSRAM
DSRAM3)
Capt./Comp. ADC4) Interfaces4)
Modules
Chan.
XC2220U-4FxV
32 Kbytes
4 Kbytes
2 Kbytes
CC2
CCU60
10
2 Serial Chan.
1) x is a placeholder for available speed grade in MHz. Can be 40 or 66.
2) Specific information about the on-chip Flash memory in Table 3.
3) All derivatives additionally provide 2 Kbytes DPRAM.
4) Specific information about the available channels in Table 5.
Data Sheet
7
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Summary of Features
1.3
Definition of Feature Variants
The XC2220U types are offered with several Flash memory sizes. Table 3 and Table 4
describe the location of the available Flash memory.
Table 3
Continuous Flash Memory Ranges
Total Flash Size
1st Range1)
2nd Range
3rd Range
64 Kbytes
C0’0000H …
C0’EFFFH
C1’0000H …
C1’0FFFH
n.a.
32 Kbytes
C0’0000H …
C0’7FFFH
n.a.
n.a.
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
Table 4
Flash Memory Module Allocation (in Kbytes)
Total Flash Size
Flash 01)
Flash 1
64
64
n.a.
32
32
n.a.
1) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
The XC2220U types are offered with different interface options. Table 5 lists the
available channels for each option.
Table 5
Interface Channel Association
Total Number
Available Channels / Message Objects
10 ADC0 channels
CH0, CH2, CH3, CH4, CH8, CH9, CH16, CH17, CH19,
CH20
2 serial channels
U0C0, U0C1
Data Sheet
8
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
2
General Device Information
The XC2220U series (16/32-Bit Single-Chip Microcontroller
with 32-Bit Performance) is a part of the Infineon XC2000 Family of full-feature singlechip CMOS microcontrollers. These devices extend the functionality and performance of
the C166 Family in terms of instructions (MAC unit), peripherals, and speed. They
combine high CPU performance (up to 66 million instructions per second) with extended
peripheral functionality and enhanced IO capabilities. Optimized peripherals can be
adapted flexibly to meet the application requirements. These derivatives utilize clock
generation via PLL and internal or external clock sources. On-chip memory modules
include program Flash, program RAM, and data RAM.
VAREF VAGND
(1)
VDDIMVDDPB VSS
(1)
(2)
(3)
(3)
XTAL1
XTAL2
Port 10
12 bit
Port 2
12 bit
Port 5
6 bit
Port 6
3 bit
PORST
TRST SPD/DAP/ Debug
JTAG
2 bit
TESTM
1 / 2 / 4 bit
via Port Pins
MC_XY _LOGSYMB 48
Figure 1
Data Sheet
XC2220U Logic Symbol
9
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
2.1
Pin Configuration and Definition
48
47
46
45
44
43
42
41
40
39
38
37
PORST
XTAL1
XTAL2
P10.12
P10.10
VDDIM
VSS
VDDPB
P10.9
P10.8
P10.7
P10.6
The pins of the XC2220U are described in detail in Table 6, which includes all alternate
functions. For further explanations please refer to the footnotes at the end of the table.
The following figure summarizes all pins, showing their locations on the four sides of the
package.
1
2
3
4
5
6
7
8
9
10
11
12
VQFN48
36
35
34
33
32
31
30
29
28
27
26
25
P10.5
P10.4
P10.3
P10.2
P10.1
P10.0
P2.13
P2.10
P2.9
P2.8
P2.7
P2.6
P5.4
P5.8
P5.9
P2.0
P2.1
VDDIM
VSS
VDDPB
P2.2
P2.3
P2.4
P2.5
13
14
15
16
17
18
19
20
21
22
23
24
TESTM
TRST
P6.3
P6.1
P6.0
VSS
VDDPB
VAREF
VAGND
P5.0
P5.2
P5.3
MC_XY_PIN48
Figure 2
Data Sheet
XC2220U Pin Configuration (top view)
10
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Key to Pin Definitions
•
•
Ctrl.: The output signal for a port pin is selected by bit field PC in the associated
register Px_IOCRy. Output O0 is selected by setting the respective bit field PC to
1x00B, output O1 is selected by 1x01B, etc.
Output signal OH is controlled by hardware.
Type: Indicates the pad type and its power supply domain (B, M).
– St: Standard pad
– Sp: Special pad e.g. XTALx
– DA: Digital IO and analog input
– In: Input only pad
– PS: Power supply pad
Table 6
Pin Definitions and Functions
Pin
Symbol
Ctrl.
Type Function
1
TESTM
I
In/B
Testmode Enable
Enables factory test modes, must be held HIGH for
normal operation (connect to VDDPB).
An internal pullup device will hold this pin high
when nothing is driving it.
2
TRST
I
In/B
Test-System Reset Input
For normal system operation, pin TRST should be
held low. A high level at this pin at the rising edge
of PORST activates the XC2220U’s debug
system. In this case, pin TRST must be driven low
once to reset the debug system.
An internal pulldown device will hold this pin low
when nothing is driving it.
3
P6.3
O0 / I St/B
Bit 3 of Port 6, General Purpose Input/Output
T3OUT
O2
St/B
GPT12E Timer T3 Toggle Latch Output
St/B
External Request Trigger Input for ADC0/1
ADC0_REQT I
RyF
4
P6.1
O0 / I DA/B Bit 1 of Port 6, General Purpose Input/Output
ADC0_CH17
I
DA/B Analog Input Channel 17 for ADC0
EMUX1
O1
DA/B External Analog MUX Control Output 1 (ADC0)
T3OUT
O2
DA/B GPT12E Timer T3 Toggle Latch Output
ADC0_REQT I
RyE
DA/B External Request Trigger Input for ADC0
ESR1_6
DA/B ESR1 Trigger Input 6
Data Sheet
I
11
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
5
P6.0
O0 / I DA/B Bit 0 of Port 6, General Purpose Input/Output
10
11
12
13
14
15
16
Type Function
ADC0_CH16
I
DA/B Analog Input Channel 16 for ADC0
EMUX0
O1
DA/B External Analog MUX Control Output 0 (ADC0)
BRKOUT
O3
DA/B OCDS Break Signal Output
ADC0_REQG I
TyG
DA/B External Request Gate Input for ADC0
P5.0
I
In/B
Bit 0 of Port 5, General Purpose Input
ADC0_CH0
I
In/B
Analog Input Channel 0 for ADC0
P5.2
I
In/B
Bit 2 of Port 5, General Purpose Input
ADC0_CH2
I
In/B
Analog Input Channel 2 for ADC0
TDI_A
I
In/B
JTAG Test Data Input
P5.3
I
In/B
Bit 3 of Port 5, General Purpose Input
ADC0_CH3
I
In/B
Analog Input Channel 3 for ADC0
T3INA
I
In/B
GPT12E Timer T3 Count/Gate Input
P5.4
I
In/B
Bit 4 of Port 5, General Purpose Input
ADC0_CH4
I
In/B
Analog Input Channel 4 for ADC0
T3EUDA
I
In/B
GPT12E Timer T3 External Up/Down Control
Input
TMS_A
I
In/B
JTAG Test Mode Selection Input
P5.8
I
In/B
Bit 8 of Port 5, General Purpose Input
ADC0_CH8
I
In/B
Analog Input Channel 8 for ADC0
CCU60_T12
HRC
I
In/B
External Run Control Input for T12 of CCU60
CCU60_T13
HRC
I
In/B
External Run Control Input for T13 of CCU60
P5.9
I
In/B
Bit 9 of Port 5, General Purpose Input
ADC0_CH9
I
In/B
Analog Input Channel 9 for ADC0
CC2_T7IN
I
In/B
CAPCOM2 Timer T7 Count Input
P2.0
O0 / I DA/B Bit 0 of Port 2, General Purpose Input/Output
ADC0_CH19
I
DA/B Analog Input Channel 19 for ADC0
T5INB
I
DA/B GPT12E Timer T5 Count/Gate Input
Data Sheet
12
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
17
P2.1
O0 / I DA/B Bit 1 of Port 2, General Purpose Input/Output
21
22
ADC0_CH20
I
DA/B Analog Input Channel 20 for ADC0
T5EUDB
I
DA/B GPT12E Timer T5 External Up/Down Control
Input
ESR1_5
I
DA/B ESR1 Trigger Input 5
ERU_0A0
I
DA/B External Request Unit Channel 0 Input A0
P2.2
O0 / I St/B
Bit 2 of Port 2, General Purpose Input/Output
ESR2_5
I
St/B
ESR2 Trigger Input 5
ERU_1A0
I
St/B
External Request Unit Channel 1 Input A0
P2.3
O0 / I St/B
U0C0_DOUT O1
23
St/B
Bit 3 of Port 2, General Purpose Input/Output
USIC0 Channel 0 Shift Data Output
CC2_CC16
O3 / I St/B
CAPCOM2 CC16IO Capture Inp./ Compare Out.
ESR2_0
I
St/B
ESR2 Trigger Input 0
U0C0_DX0E
I
St/B
USIC0 Channel 0 Shift Data Input
U0C1_DX0D
I
St/B
USIC0 Channel 1 Shift Data Input
P2.4
O0 / I St/B
U0C1_DOUT O1
24
Type Function
St/B
Bit 4 of Port 2, General Purpose Input/Output
USIC0 Channel 1 Shift Data Output
CC2_CC17
O3 / I St/B
CAPCOM2 CC17IO Capture Inp./ Compare Out.
ESR1_0
I
St/B
ESR1 Trigger Input 0
U0C0_DX0F
I
St/B
USIC0 Channel 0 Shift Data Input
P2.5
O0 / I St/B
Bit 5 of Port 2, General Purpose Input/Output
U0C0_SCLK
OUT
O1
USIC0 Channel 0 Shift Clock Output
CC2_CC18
O3 / I St/B
CAPCOM2 CC18IO Capture Inp./ Compare Out.
U0C0_DX1D
I
St/B
USIC0 Channel 0 Shift Clock Input
ESR1_10
I
St/B
ESR1 Trigger Input 10
Data Sheet
St/B
13
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
25
P2.6
O0 / I St/B
Bit 6 of Port 2, General Purpose Input/Output
U0C0_SELO
0
O1
St/B
USIC0 Channel 0 Select/Control 0 Output
U0C1_SELO
1
O2
St/B
USIC0 Channel 1 Select/Control 1 Output
CC2_CC19
O3 / I St/B
CAPCOM2 CC19IO Capture Inp./ Compare Out.
CLKIN1
I
St/B
Clock Signal Input 1
26
27
28
Type Function
U0C0_DX2D
I
St/B
USIC0 Channel 0 Shift Control Input
ESR2_6
I
St/B
ESR2 Trigger Input 6
P2.7
O0 / I St/B
Bit 7 of Port 2, General Purpose Input/Output
U0C1_SELO
0
O1
St/B
USIC0 Channel 1 Select/Control 0 Output
U0C0_SELO
1
O2
St/B
USIC0 Channel 0 Select/Control 1 Output
CC2_CC20
O3 / I St/B
CAPCOM2 CC20IO Capture Inp./ Compare Out.
U0C1_DX2C
I
St/B
USIC0 Channel 1 Shift Control Input
ESR2_7
I
St/B
ESR2 Trigger Input 7
P2.8
O0 / I St/B
Bit 8 of Port 2, General Purpose Input/Output
U0C1_SCLK
OUT
O1
St/B
USIC0 Channel 1 Shift Clock Output
EXTCLK
O2
St/B
Programmable Clock Signal Output
CC2_CC21
O3 / I St/B
CAPCOM2 CC21IO Capture Inp./ Compare Out.
U0C1_DX1D
I
USIC0 Channel 1 Shift Clock Input
P2.9
O0 / I St/B
U0C1_DOUT O1
St/B
St/B
Bit 9 of Port 2, General Purpose Input/Output
USIC0 Channel 1 Shift Data Output
CC2_CC22
O3 / I St/B
CAPCOM2 CC22IO Capture Inp./ Compare Out.
C1
I
St/B
Configuration Pin 1
TCK_A
I
St/B
DAP0/JTAG Clock Input
Data Sheet
14
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
29
P2.10
O0 / I St/B
Type Function
Bit 10 of Port 2, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
U0C0_SELO
3
O2
St/B
USIC0 Channel 0 Select/Control 3 Output
CC2_CC23
O3 / I St/B
CAPCOM2 CC23IO Capture Inp./ Compare Out.
U0C1_DX0E
I
St/B
USIC0 Channel 1 Shift Data Input
CAPINA
I
St/B
GPT12E Register CAPREL Capture Input
30,
P2.13
O0 / I St/B
Bit 13 of Port 2, General Purpose Input/Output
31
P10.0
O0 / I St/B
Bit 0 of Port 10, General Purpose Input/Output
32
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
CCU60_CC6
0
O2
St/B
CCU60 Channel 0 Output
CCU60_CC6
0INA
I
St/B
CCU60 Channel 0 Input
ESR1_2
I
St/B
ESR1 Trigger Input 2
U0C0_DX0A
I
St/B
USIC0 Channel 0 Shift Data Input
U0C1_DX0A
I
St/B
USIC0 Channel 1 Shift Data Input
P10.1
O0 / I St/B
Bit 1 of Port 10, General Purpose Input/Output
U0C0_DOUT O1
St/B
USIC0 Channel 0 Shift Data Output
CCU60_CC6
1
O2
St/B
CCU60 Channel 1 Output
CCU60_CC6
1INA
I
St/B
CCU60 Channel 1 Input
U0C0_DX0B
I
St/B
USIC0 Channel 0 Shift Data Input
U0C0_DX1A
I
St/B
USIC0 Channel 0 Shift Clock Input
Data Sheet
15
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
33
P10.2
O0 / I St/B
Bit 2 of Port 10, General Purpose Input/Output
U0C0_SCLK
OUT
O1
St/B
USIC0 Channel 0 Shift Clock Output
CCU60_CC6
2
O2
St/B
CCU60 Channel 2 Output
CCU60_CC6
2INA
I
St/B
CCU60 Channel 2 Input
U0C0_DX1B
I
St/B
USIC0 Channel 0 Shift Clock Input
P10.3
O0 / I St/B
34
35
36
37
Type Function
Bit 3 of Port 10, General Purpose Input/Output
CCU60_COU O2
T60
St/B
CCU60 Channel 0 Output
U0C0_DX2A
I
St/B
USIC0 Channel 0 Shift Control Input
U0C1_DX2A
I
St/B
USIC0 Channel 1 Shift Control Input
P10.4
O0 / I St/B
Bit 4 of Port 10, General Purpose Input/Output
U0C0_SELO
3
O1
St/B
USIC0 Channel 0 Select/Control 3 Output
CCU60_COU O2
T61
St/B
CCU60 Channel 1 Output
U0C0_DX2B
St/B
USIC0 Channel 0 Shift Control Input
I
U0C1_DX2B
I
St/B
USIC0 Channel 1 Shift Control Input
ESR1_9
I
St/B
ESR1 Trigger Input 9
P10.5
O0 / I St/B
Bit 5 of Port 10, General Purpose Input/Output
U0C1_SCLK
OUT
O1
St/B
USIC0 Channel 1 Shift Clock Output
CCU60_COU O2
T62
St/B
CCU60 Channel 2 Output
U0C1_DX1B
I
St/B
USIC0 Channel 1 Shift Clock Input
P10.6
O0 / I St/B
Bit 6 of Port 10, General Purpose Input/Output
U0C0_DOUT O1
St/B
USIC0 Channel 0 Shift Data Output
U0C0_DX0C
I
St/B
USIC0 Channel 0 Shift Data Input
CCU60_CTR
APA
I
St/B
CCU60 Emergency Trap Input
Data Sheet
16
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
38
P10.7
O0 / I St/B
40
Bit 7 of Port 10, General Purpose Input/Output
U0C1_DOUT O1
St/B
USIC0 Channel 1 Shift Data Output
CCU60_COU O2
T63
St/B
CCU60 Channel 3 Output
U0C1_DX0B
39
Type Function
I
St/B
USIC0 Channel 1 Shift Data Input
CCU60_CCP I
OS0A
St/B
CCU60 Position Input 0
T4INB
I
St/B
GPT12E Timer T4 Count/Gate Input
P10.8
O0 / I St/B
Bit 8 of Port 10, General Purpose Input/Output
U0C0_MCLK
OUT
O1
St/B
USIC0 Channel 0 Master Clock Output
U0C1_SELO
0
O2
St/B
USIC0 Channel 1 Select/Control 0 Output
CCU60_CCP I
OS1A
St/B
CCU60 Position Input 1
U0C0_DX1C
St/B
USIC0 Channel 0 Shift Clock Input
I
BRKIN_B
I
St/B
OCDS Break Signal Input
T3EUDB
I
St/B
GPT12E Timer T3 External Up/Down Control
Input
ESR2_11
I
St/B
ESR2 Trigger Input 11
P10.9
O0 / I St/B
Bit 9 of Port 10, General Purpose Input/Output
U0C0_SELO
4
O1
St/B
USIC0 Channel 0 Select/Control 4 Output
U0C1_MCLK
OUT
O2
St/B
USIC0 Channel 1 Master Clock Output
CCU60_CCP I
OS2A
St/B
CCU60 Position Input 2
TCK_B
I
St/B
DAP0/JTAG Clock Input
T3INB
I
St/B
GPT12E Timer T3 Count/Gate Input
Data Sheet
17
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
44
P10.10
O0 / I St/B
Bit 10 of Port 10, General Purpose Input/Output
U0C0_SELO
0
O1
St/B
USIC0 Channel 0 Select/Control 0 Output
CCU60_COU O2
T63
St/B
CCU60 Channel 3 Output
45
Type Function
U0C0_DX2C
I
St/B
USIC0 Channel 0 Shift Control Input
TDI_B
I
St/B
JTAG Test Data Input
U0C1_DX1A
I
St/B
USIC0 Channel 1 Shift Clock Input
P10.12
O0 / I St/B
U0C0_DOUT O2
Bit 12 of Port 10, General Purpose Input/Output
St/B
USIC0 Channel 0 Shift Data Output
TDO_A
OH
St/B
DAP1/JTAG Test Data Output
SPD_0
I/OH
St/B
SPD Input/Output
C0
I
St/B
Configuration Pin 0
USIC0 Channel 0 Shift Data Input
U0C0_DX0D
I
St/B
46
XTAL2
O
Sp/M Crystal Oscillator Amplifier Output
47
XTAL1
I
Sp/M Crystal Oscillator Amplifier Input
To clock the device from an external source, drive
XTAL1, while leaving XTAL2 unconnected.
Voltages on XTAL1 must comply to the core
supply voltage VDDIM.
ESR2_9
I
St/B
ESR2 Trigger Input 9
48
PORST
I
In/B
Power On Reset Input
A low level at this pin resets the XC2220U
completely. A spike filter suppresses input pulses
<10 ns. Input pulses >100 ns safely pass the filter.
The minimum duration for a safe recognition
should be 120 ns.
An internal pullup device will hold this pin high
when nothing is driving it.
8
VAREF
VAGND
-
PS/B Reference Voltage for A/D Converters ADC0
-
PS/B Reference Ground for A/D Converters ADC0
9
Data Sheet
18
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
Table 6
Pin Definitions and Functions (cont’d)
Pin
Symbol
Ctrl.
Type Function
18,
43
VDDIM
-
PS/M Digital Core Supply Voltage for Domain M
Decouple with a ceramic capacitor, see Data
Sheet for details.
All VDDIM pins must be connected to each other.
7,
20,
41
VDDPB
-
PS/B Digital Pad Supply Voltage for Domain B
Connect decoupling capacitors to adjacent
VDDP/VSS pin pairs as close as possible to the pins.
6,
19,
42
VSS
-
PS/-- Digital Ground
All VSS pins must be connected to the ground-line
or ground-plane.
Data Sheet
19
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
General Device Information
2.2
Identification Registers
The identification registers describe the current version of the XC2220U and of its
modules.
Table 7
XC2220U Identification Registers
Short Name
Value
Address
SCU_IDMANUF
1820H
00’F07EH
SCU_IDCHIP
5001H
00’F07CH
SCU_IDMEM
3010H
00’F07AH
SCU_IDPROG
1313H
00’F078H
JTAG_ID
001D’7083H
---
Data Sheet
20
Notes
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3
Functional Description
The architecture of the XC2220U combines advantages of RISC, CISC, and DSP
processors with an advanced peripheral subsystem in a well-balanced design. On-chip
memory blocks allow the design of compact systems-on-silicon with maximum
performance suited for computing, control, and communication.
The on-chip memory blocks (program code memory and SRAM, dual-port RAM, data
SRAM) and the generic peripherals are connected to the CPU by separate high-speed
buses. Another bus, the LXBus, connects additional on-chip resources and external
resources (see Figure 3). This bus structure enhances overall system performance by
enabling the concurrent operation of several subsystems of the XC2220U.
The block diagram gives an overview of the on-chip components and the advanced
internal bus structure of the XC2220U.
DPRAM
OCDS
Debug Support
DSRAM
CPU
DMU
Flash Memory
PMU
IMB
PSRAM
MAC Unit
LXBUS
Controller
WWD
System Functions
Clock, Reset, Power
Control
MPU
Interrupt & PEC
RTC
LXBus
MCHK
ADC0
Module
GPT
CC2
Module
CCU6 0
Module
8-/10- /
12 -Bit
5
Timers
16
Chan.
3+1
Chan.
Peripheral Data Bus
Interrupt Bus
USIC0
Module
2
Chan.
Analog and Digital General Purpose IO (GPIO) Ports
MC_U-SERIES_BLOCKDIAGRAM
Figure 3
Data Sheet
Block Diagram
21
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.1
Memory Subsystem and Organization
The memory space of the XC2220U is configured in the von Neumann architecture. In
this architecture all internal and external resources, including code memory, data
memory, registers and I/O ports, are organized in the same linear address space.
Table 8
XC2220U Memory Map 1)
Address Area
Start Loc. End Loc.
Area Size2)
IMB register space
FF’FF00H
FF’FFFFH
256 bytes
Reserved
F0’0000H
FF’FEFFH < 1 Mbyte
Minus IMB
registers.
Reserved for EPSRAM
E8’1000H
EF’FFFFH 508 Kbytes
Mirrors EPSRAM
Emulated PSRAM
E8’0000H
E8’0FFFH
up to 4 Kbytes With Flash timing.
Reserved for PSRAM
E0’1000H
E7’FFFFH
508 Kbytes
PSRAM
E0’0000H
E0’0FFFH
up to 4 Kbytes Program SRAM.
Reserved for Flash
C1’1000H
DF’FFFFH 1980 Kbytes
Flash 0
C0’0000H
C1’0FFFH
40’0000H
BF’FFFFH 8 Mbytes
External memory area
External IO area
4)
21’0000H
3F’FFFFH
1984 Kbytes
20’B400H
20’FFFFH
19 Kbytes
USIC0 alternate regs.
20’B000H
20’B3FFH
1 Kbytes
Reserved
20’4800H
20’AFFFH
26 Kbytes
USIC0 registers
20’4000H
20’47FFH
2 Kbytes
Reserved
20’0000H
20’3FFFH
16 Kbytes
External memory area
01’0000H
1F’FFFFH
1984 Kbytes
SFR area
00’FE00H
00’FFFFH
0.5 Kbytes
Dual-port RAM
(DPRAM)
00’F600H
00’FDFFH
2 Kbytes
Reserved for DPRAM
00’F200H
00’F5FFH
1 Kbytes
ESFR area
00’F000H
00’F1FFH
0.5 Kbytes
XSFR area
00’E000H
00’EFFFH
4 Kbytes
Data SRAM (DSRAM)
00’D800H
00’DFFFH
2 Kbytes
22
Mirrors PSRAM
68 Kbytes3)
Reserved
Data Sheet
Notes
Accessed via
LXBus controller
Accessed via
LXBus controller
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
Table 8
XC2220U Memory Map (cont’d)1) (cont’d)
Area Size2)
Address Area
Start Loc. End Loc.
Reserved for DSRAM
00’8000H
00’D7FFH
22 Kbytes
External memory area
00’0000H
00’7FFFH
32 Kbytes
Notes
1) Accesses to the shaded areas are reserved. In devices with external bus interface these accesses generate
external bus accesses.
2) The areas marked with “<” are slightly smaller than indicated, see column “Notes”.
3) The uppermost 4-Kbyte sector of the first Flash segment is reserved for internal use (C0’F000H to C0’FFFFH).
4) Several pipeline optimizations are not active within the external IO area.
This common memory space consists of 16 Mbytes organized as 256 segments of
64 Kbytes; each segment contains four data pages of 16 Kbytes. The entire memory
space can be accessed bytewise or wordwise. Portions of the on-chip DPRAM and the
register spaces (ESFR/SFR) additionally are directly bit addressable.
The internal data memory areas and the Special Function Register areas (SFR and
ESFR) are mapped into segment 0, the system segment.
The Program Management Unit (PMU) handles all code fetches and, therefore, controls
access to the program memories such as Flash memory and PSRAM.
The Data Management Unit (DMU) handles all data transfers and, therefore, controls
access to the DSRAM and the on-chip peripherals.
Both units (PMU and DMU) are connected to the high-speed system bus so that they can
exchange data. This is required if operands are read from program memory, code or
data is written to the PSRAM, code is fetched from external memory, or data is read from
or written to external resources. These include peripherals on the LXBus such as USIC
or MultiCAN. The system bus allows concurrent two-way communication for maximum
transfer performance.
4 Kbytes of on-chip Program SRAM (PSRAM) are provided to store user code or data.
The PSRAM is accessed via the PMU and is optimized for code fetches. A section of the
PSRAM with programmable size can be write-protected.
Data Sheet
23
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
2 Kbytes of on-chip Data SRAM (DSRAM) are used for storage of general user data.
The DSRAM is accessed via a separate interface and is optimized for data access.
2 Kbytes of on-chip Dual-Port RAM (DPRAM) provide storage for user-defined
variables, for the system stack, and for general purpose register banks. A register bank
can consist of up to 16 word-wide (R0 to R15) and/or byte-wide (RL0, RH0, …, RL7,
RH7) General Purpose Registers (GPRs).
The upper 256 bytes of the DPRAM are directly bit addressable. When used by a GPR,
any location in the DPRAM is bit addressable.
1024 bytes (2 × 512 bytes) of the address space are reserved for the Special Function
Register areas (SFR space and ESFR space). SFRs are word-wide registers which are
used to control and monitor functions of the different on-chip units. Unused SFR
addresses are reserved for future members of the XC2000 Family. In order to ensure
upward compatibility they should either not be accessed or written with zeros.
The on-chip Flash memory stores code, constant data, and control data. The on-chip
Flash memory consist of 1 module of 64 Kbytes. Each module is organized in 4-Kbyte
sectors.
The uppermost 4-Kbyte sector of segment 0 (located in Flash module 0) is used
internally to store operation control parameters and protection information.
Each sector can be separately write protected1), erased and programmed (in blocks of
128 Bytes). The complete Flash area can be read-protected. A user-defined password
sequence temporarily unlocks protected areas. The Flash modules combine 128-bit
read access with protected and efficient writing algorithms for programming and erasing.
Dynamic error correction provides extremely high read data security for all read access
operations. Access to different Flash modules can be executed in parallel.
For Flash parameters, please see Section 4.6.
Memory Content Protection
The contents of on-chip memories can be protected against soft errors (induced e.g. by
radiation) by activating the parity mechanism or the Error Correction Code (ECC).
The parity mechanism can detect a single-bit error and prevent the software from using
incorrect data or executing incorrect instructions.
The ECC mechanism can detect and automatically correct single-bit errors. This
supports the stable operation of the system.
It is strongly recommended to activate the ECC mechanism wherever possible because
this dramatically increases the robustness of an application against such soft errors.
1) To save control bits, sectors are clustered for protection purposes, they remain separate for
programming/erasing.
Data Sheet
24
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.2
Central Processing Unit (CPU)
The core of the CPU consists of a 5-stage execution pipeline with a 2-stage instructionfetch pipeline, a 16-bit arithmetic and logic unit (ALU), a 32-bit/40-bit multiply and
accumulate unit (MAC), a register-file providing three register banks, and dedicated
SFRs. The ALU features a multiply-and-divide unit, a bit-mask generator, and a barrel
shifter.
PSRAM
Flash/ROM
PMU
CPU
Prefetch
Unit
Branch
Unit
FIFO
CSP
IP
VECSEG
CPUCON1
CPUCON2
Return
Stack
IDX0
IDX1
QX0
QX1
QR0
QR1
+/-
+/-
Multiply
Unit
MRW
+/-
MCW
MSW
MAH
MAL
2-Stage
Prefetch
Pipeline
TFR
Injection/
Exception
Handler
5-Stage
Pipeline
IFU
DPP0
DPP1
DPP2
DPP3
DPRAM
IPIP
SPSEG
SP
STKOV
STKUN
ADU
Division Unit
Bit-Mask-Gen.
Multiply Unit
Barrel-Shifter
MDC
CP
R15
R15
R14
R15
R14
R14
R15
R14
GPRs
GPRs
GPRs
GPRs
R1
R1
R0
R0R1
R0
R1
R0
RF
+/-
PSW
MDH
MDL
ZEROS
ONES
MAC
Buffer
ALU
WB
DSRAM
EBC
Peripherals
DMU
mca04917_x.vsd
Figure 4
Data Sheet
CPU Block Diagram
25
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
With this hardware most XC2220U instructions are executed in a single machine cycle
of 15.2 ns @ 66-MHz CPU clock. For example, shift and rotate instructions are always
processed during one machine cycle, no matter how many bits are shifted. Also,
multiplication and most MAC instructions execute in one cycle. All multiple-cycle
instructions have been optimized so that they can be executed very fast; for example, a
32-/16-bit division is started within 4 cycles while the remaining cycles are executed in
the background. Another pipeline optimization, the branch target prediction, eliminates
the execution time of branch instructions if the prediction was correct.
The CPU has a register context consisting of up to three register banks with 16 wordwide GPRs each at its disposal. One of these register banks is physically allocated within
the on-chip DPRAM area. A Context Pointer (CP) register determines the base address
of the active register bank accessed by the CPU at any time. The number of these
register bank copies is only restricted by the available internal RAM space. For easy
parameter passing, a register bank may overlap others.
A system stack of up to 32 Kwords is provided for storage of temporary data. The system
stack can be allocated to any location within the address space (preferably in the on-chip
RAM area); it is accessed by the CPU with the stack pointer (SP) register. Two separate
SFRs, STKOV and STKUN, are implicitly compared with the stack pointer value during
each stack access to detect stack overflow or underflow.
The high performance of the CPU hardware implementation can be best utilized by the
programmer with the highly efficient XC2220U instruction set. This includes the following
instruction classes:
•
•
•
•
•
•
•
•
•
•
•
•
•
Standard Arithmetic Instructions
DSP-Oriented Arithmetic Instructions
Logical Instructions
Boolean Bit Manipulation Instructions
Compare and Loop Control Instructions
Shift and Rotate Instructions
Prioritize Instruction
Data Movement Instructions
System Stack Instructions
Jump and Call Instructions
Return Instructions
System Control Instructions
Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes
and words. A variety of direct, indirect or immediate addressing modes are provided to
specify the required operands.
Data Sheet
26
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.3
Memory Protection Unit (MPU)
The XC2220U’s Memory Protection Unit (MPU) protects user-specified memory areas
from unauthorized read, write, or instruction fetch accesses. The MPU can protect the
whole address space including the peripheral area. This completes established
mechanisms such as the register security mechanism or stack overrun/underrun
detection.
Four Protection Levels support flexible system programming where operating system,
low level drivers, and applications run on separate levels. Each protection level permits
different access restrictions for instructions and/or data.
Every access is checked (if the MPU is enabled) and an access violating the permission
rules will be marked as invalid and leads to a protection trap.
A set of protection registers for each protection level specifies the address ranges and
the access permissions. Applications requiring more than 4 protection levels can
dynamically re-program the protection registers.
3.4
Memory Checker Module (MCHK)
The XC2220U’s Memory Checker Module calculates a checksum (fractional polynomial
division) on a block of data, often called Cyclic Redundancy Code (CRC). It is based on
a 32-bit linear feedback shift register and may, therefore, also be used to generate
pseudo-random numbers.
The Memory Checker Module is a 16-bit parallel input signature compression circuitry
which enables error detection within a block of data stored in memory, registers, or
communicated e.g. via serial communication lines. It reduces the probability of error
masking due to repeated error patterns by calculating the signature of blocks of data.
The polynomial used for operation is configurable, so most of the commonly used
polynomials may be used. Also, the block size for generating a CRC result is
configurable via a local counter. An interrupt may be generated if testing the current data
block reveals an error.
An autonomous CRC compare circuitry is included to enable redundant error detection,
e.g. to enable higher safety integrity levels.
The Memory Checker Module provides enhanced fault detection (beyond parity or ECC)
for data and instructions in volatile and non volatile memories. This is especially
important for the safety and reliability of embedded systems.
Data Sheet
27
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.5
Interrupt System
The architecture of the XC2220U supports several mechanisms for fast and flexible
response to service requests; these can be generated from various sources internal or
external to the microcontroller. Any of these interrupt requests can be programmed to be
serviced by the Interrupt Controller or by the Peripheral Event Controller (PEC).
Using a standard interrupt service the current program execution is suspended and a
branch to the interrupt vector table is performed. With the PEC just one cycle is ‘stolen’
from the current CPU activity to perform the PEC service. A PEC service implies a single
byte or word data transfer between any two memory locations with an additional
increment of either the PEC source pointer, the destination pointer, or both. An individual
PEC transfer counter is implicitly decremented for each PEC service except when
performing in the continuous transfer mode. When this counter reaches zero, a standard
interrupt is performed to the corresponding source-related vector location. PEC services
are particularly well suited to supporting the transmission or reception of blocks of data.
The XC2220U has eight PEC channels, each with fast interrupt-driven data transfer
capabilities.
With a minimum interrupt response time of 7/111) CPU clocks, the XC2220U can react
quickly to the occurrence of non-deterministic events.
Interrupt Nodes and Source Selection
The interrupt system provides 46 physical nodes with separate control register
containing an interrupt request flag, an interrupt enable flag and an interrupt priority bit
field. Most interrupt sources are assigned to a dedicated node. A particular subset of
interrupt sources shares a set of nodes. The source selection can be programmed using
the interrupt source selection (ISSR) registers.
External Request Unit (ERU)
A dedicated External Request Unit (ERU) is provided to route and preprocess selected
on-chip peripheral and external interrupt requests. The ERU features 4 programmable
input channels with event trigger logic (ETL) a routing matrix and 4 output gating units
(OGU). The ETL features rising edge, falling edge, or both edges event detection. The
OGU combines the detected interrupt events and provides filtering capabilities
depending on a programmable pattern match or miss.
Trap Processing
The XC2220U provides efficient mechanisms to identify and process exceptions or error
conditions that arise during run-time, the so-called ‘Hardware Traps’. A hardware trap
causes an immediate system reaction similar to a standard interrupt service (branching
1) Depending if the jump cache is used or not.
Data Sheet
28
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
to a dedicated vector table location). The occurrence of a hardware trap is also indicated
by a single bit in the trap flag register (TFR). Unless another higher-priority trap service
is in progress, a hardware trap will interrupt any ongoing program execution. In turn,
hardware trap services can normally not be interrupted by standard or PEC interrupts.
Depending on the package option up to 3 External Service Request (ESR) pins are
provided. The ESR unit processes their input values and allows to implement user
controlled trap functions (System Requests SR0 and SR1). In this way reset, wakeup
and power control can be efficiently realized.
Software interrupts are supported by the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number. Alternatively to emulate an interrupt by software a
program can trigger interrupt requests by writing the Interrupt Request (IR) bit of an
interrupt control register.
3.6
On-Chip Debug Support (OCDS)
The On-Chip Debug Support system built into the XC2220U provides a broad range of
debug and emulation features. User software running on the XC2220U can be debugged
within the target system environment.
The OCDS is controlled by an external debugging device via the debug interface. This
consists of the 2-pin Device Access Port (DAP) or of the 1-pin Single Pin DAP (SPD) or
of the JTAG port conforming to IEEE-1149. The debug interface can be completed with
an optional break interface.
The debugger controls the OCDS with a set of dedicated registers accessible via the
debug interface (SPD, DAP or JTAG). In addition the OCDS system can be controlled
by the CPU, e.g. by a monitor program. An injection interface allows the execution of
OCDS-generated instructions by the CPU.
Multiple breakpoints can be triggered by on-chip hardware, by software, or by an
external trigger input. Single stepping is supported, as is the injection of arbitrary
instructions and read/write access to the complete internal address space. A breakpoint
trigger can be answered with a CPU halt, a monitor call, a data transfer, or/and the
activation of an external signal.
Tracing of data can be obtained via the debug interface, or via the external bus interface
for increased performance.
Tracing of program execution is supported by the XC2000 Family emulation device.
The SPD interface uses one interface signal, DAP interface uses two interface signals,
the JTAG interface uses four interface signals, to communicate with external circuitry.
The debug interface can be amended with two optional break lines.
Data Sheet
29
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.7
Capture/Compare Unit (CC2)
The CAPCOM unit supports generation and control of timing sequences on up to
16 channels with a maximum resolution of one system clock cycle (eight cycles in
staggered mode). The CAPCOM unit is typically used to handle high-speed I/O tasks
such as pulse and waveform generation, pulse width modulation (PWM), digital to
analog (D/A) conversion, software timing, or time recording with respect to external
events.
Two 16-bit timers with reload registers provide two independent time bases for the
capture/compare register array.
The input clock for the timers is programmable to several prescaled values of the internal
system clock, or may be derived from an overflow/underflow of timer T6 in module GPT2.
This provides a wide range of variation for the timer period and resolution and allows
precise adjustments to the application specific requirements. In addition, external count
inputs allow event scheduling for the capture/compare registers relative to external
events.
The capture/compare register array contains 16 dual purpose capture/compare
registers, each of which may be individually allocated to either CAPCOM timer and
programmed for capture or compare function.
All registers have each one port pin associated with it which serves as an input pin for
triggering the capture function, or as an output pin to indicate the occurrence of a
compare event.
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin which is associated with this
register. In addition, a specific interrupt request for this capture/compare register is
generated. Either a positive, a negative, or both a positive and a negative external signal
transition at the pin can be selected as the triggering event.
The contents of all registers which have been selected for one of the five compare modes
are continuously compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the selected compare mode.
Table 9
Compare Modes
Compare Modes
Function
Mode 0
Interrupt-only compare mode;
Several compare interrupts per timer period are possible
Mode 1
Pin toggles on each compare match;
Several compare events per timer period are possible
Data Sheet
30
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
Table 9
Compare Modes (cont’d)
Compare Modes
Function
Mode 2
Interrupt-only compare mode;
Only one compare interrupt per timer period is generated
Mode 3
Pin set ‘1’ on match; pin reset ‘0’ on compare timer overflow;
Only one compare event per timer period is generated
Double Register
Mode
Two registers operate on one pin;
Pin toggles on each compare match;
Several compare events per timer period are possible
Single Event Mode
Generates single edges or pulses;
Can be used with any compare mode
When a capture/compare register has been selected for capture mode, the current
contents of the allocated timer will be latched (‘captured’) into the capture/compare
register in response to an external event at the port pin associated with this register. In
addition, a specific interrupt request for this capture/compare register is generated.
Either a positive, a negative, or both a positive and a negative external signal transition
at the pin can be selected as the triggering event.
The contents of all registers selected for one of the five compare modes are continuously
compared with the contents of the allocated timers.
When a match occurs between the timer value and the value in a capture/compare
register, specific actions will be taken based on the compare mode selected.
Data Sheet
31
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
Reload Reg.
T7REL
fCC
T7IN
T6OUF
T7
Input
Control
Timer T7
CC16IO
CC17IO
CC16IRQ
CC17IRQ
Mode
Control
(Capture
or
Compare)
Sixteen
16-bit
Capture/
Compare
Registers
CC31IO
fCC
T6OUF
T7IRQ
CC31IRQ
T8
Input
Control
Timer T8
T8IRQ
Reload Reg.
T8REL
MC_CAPCOM2_BLOCKDIAG
Figure 5
Data Sheet
CAPCOM Unit Block Diagram
32
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.8
Capture/Compare Units CCU6x
The XC2220U types feature the CCU60 unit.
CCU6 is a high-resolution capture and compare unit with application-specific modes. It
provides inputs to start the timers synchronously, an important feature in devices with
several CCU6 modules.
The module provides two independent timers (T12, T13), that can be used for PWM
generation, especially for AC motor control. Additionally, special control modes for block
commutation and multi-phase machines are supported.
Timer 12 Features
•
•
•
•
•
•
•
•
•
•
Three capture/compare channels, where each channel can be used either as a
capture or as a compare channel.
Supports generation of a three-phase PWM (six outputs, individual signals for highside and low-side switches)
16-bit resolution, maximum count frequency = peripheral clock
Dead-time control for each channel to avoid short circuits in the power stage
Concurrent update of the required T12/13 registers
Center-aligned and edge-aligned PWM can be generated
Single-shot mode supported
Many interrupt request sources
Hysteresis-like control mode
Automatic start on a HW event (T12HR, for synchronization purposes)
Timer 13 Features
•
•
•
•
•
•
One independent compare channel with one output
16-bit resolution, maximum count frequency = peripheral clock
Can be synchronized to T12
Interrupt generation at period match and compare match
Single-shot mode supported
Automatic start on a HW event (T13HR, for synchronization purposes)
Additional Features
•
•
•
•
•
•
•
Block commutation for brushless DC drives implemented
Position detection via Hall sensor pattern
Automatic rotational speed measurement for block commutation
Integrated error handling
Fast emergency stop without CPU load via external signal (CTRAP)
Control modes for multi-channel AC drives
Output levels can be selected and adapted to the power stage
Data Sheet
33
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
CCU6 Module Kernel
fSYS
T13
Channel 3
com pare
1
3
2
2
2
trap i nput
st art
Trap
Control
output select
1
Multichannel
Control
Hal l i nput
Channel 2
Deadtime
Control
compa re
1
compa re
Interrupts
Channel 1
compa re
T12
1
capture
TxHR
Channel 0
output select
com pare
3
1
CTRAP
CCPOS0
CCPOS1
CCPOS2
COUT60
CC60
COUT61
CC61
COUT62
CC62
COUT63
Input / Output Control
m c_ccu6_blockdiagram . vsd
Figure 6
CCU6 Block Diagram
Timer T12 can work in capture and/or compare mode for its three channels. The modes
can also be combined. Timer T13 can work in compare mode only. The multi-channel
control unit generates output patterns that can be modulated by timer T12 and/or timer
T13. The modulation sources can be selected and combined for signal modulation.
Data Sheet
34
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.9
General Purpose Timer (GPT12E) Unit
The GPT12E unit is a very flexible multifunctional timer/counter structure which can be
used for many different timing tasks such as event timing and counting, pulse width and
duty cycle measurements, pulse generation, or pulse multiplication.
The GPT12E unit incorporates five 16-bit timers organized in two separate modules,
GPT1 and GPT2. Each timer in each module may either operate independently in a
number of different modes or be concatenated with another timer of the same module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for
one of four basic modes of operation: Timer, Gated Timer, Counter, and Incremental
Interface Mode. In Timer Mode, the input clock for a timer is derived from the system
clock and divided by a programmable prescaler. Counter Mode allows timer clocking in
reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the
operation of a timer is controlled by the ‘gate’ level on an external input pin. For these
purposes each timer has one associated port pin (TxIN) which serves as a gate or clock
input. The maximum resolution of the timers in module GPT1 is 4 system clock cycles.
The counting direction (up/down) for each timer can be programmed by software or
altered dynamically by an external signal on a port pin (TxEUD), e.g. to facilitate position
tracking.
In Incremental Interface Mode the GPT1 timers can be directly connected to the
incremental position sensor signals A and B through their respective inputs TxIN and
TxEUD. Direction and counting signals are internally derived from these two input
signals, so that the contents of the respective timer Tx corresponds to the sensor
position. The third position sensor signal TOP0 can be connected to an interrupt input.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer
overflow/underflow. The state of this latch may be output on pin T3OUT e.g. for time out
monitoring of external hardware components. It may also be used internally to clock
timers T2 and T4 for measuring long time periods with high resolution.
In addition to the basic operating modes, T2 and T4 may be configured as reload or
capture register for timer T3. A timer used as capture or reload register is stopped. The
contents of timer T3 is captured into T2 or T4 in response to a signal at the associated
input pin (TxIN). Timer T3 is reloaded with the contents of T2 or T4, triggered either by
an external signal or a selectable state transition of its toggle latch T3OTL. When both
T2 and T4 are configured to alternately reload T3 on opposite state transitions of T3OTL
with the low and high times of a PWM signal, this signal can be continuously generated
without software intervention.
Note: Signals T2IN, T2EUD, T4EUD, T6OUT, T6IN and T6EUD are not connected to
pins.
Data Sheet
35
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
T3CON.BPS1
fGPT
2n:1
Basic Clock
Interrupt
Request
(T2IRQ)
Aux. Timer T2
T2IN
T2EUD
U/D
T2
Mode
Reload
Control
Capture
Interrupt
Request
(T3IRQ)
T3IN
T3
Mode
Control
T3EUD
Core Timer T3
U/D
T3OTL
T3OUT
Toggle
Latch
Capture
T4IN
T4EUD
T4
Mode
Control
Reload
Aux. Timer T4
U/D
Interrupt
Request
(T4IRQ)
MC_GPT_BLOCK1
Figure 7
Data Sheet
Block Diagram of GPT1
36
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
With its maximum resolution of 2 system clock cycles, the GPT2 module provides
precise event control and time measurement. It includes two timers (T5, T6) and a
capture/reload register (CAPREL). Both timers can be clocked with an input clock which
is derived from the CPU clock via a programmable prescaler or with external signals. The
counting direction (up/down) for each timer can be programmed by software or altered
dynamically with an external signal on a port pin (TxEUD). Concatenation of the timers
is supported with the output toggle latch (T6OTL) of timer T6, which changes its state on
each timer overflow/underflow.
The state of this latch may be used to clock timer T5, and/or it may be output on pin
T6OUT. The overflows/underflows of timer T6 can also be used to clock the CAPCOM2
timers and to initiate a reload from the CAPREL register.
The CAPREL register can capture the contents of timer T5 based on an external signal
transition on the corresponding port pin (CAPIN); timer T5 may optionally be cleared
after the capture procedure. This allows the XC2220U to measure absolute time
differences or to perform pulse multiplication without software overhead.
The capture trigger (timer T5 to CAPREL) can also be generated upon transitions of
GPT1 timer T3 inputs T3IN and/or T3EUD. This is especially advantageous when T3
operates in Incremental Interface Mode.
Data Sheet
37
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
T6CON.BPS2
fGPT
2n:1
Basic Clock
Interrupt
Request
(T5IRQ)
GPT2 Timer T5
T5IN
T5EUD
T5
Mode
Control
U/D
Clear
Capture
CAPIN
T3IN/
T3EUD
CAPREL
Mode
Control
GPT2 CAPREL
Interrupt
Request
(CRIRQ)
Reload
Clear
Interrupt
Request
(T6IRQ)
Toggle
FF
T6IN
T6
Mode
Control
GPT2 Timer T6
T6OTL
T6OUT
T6OUF
U/D
T6EUD
MC_GPT_BLOCK2
Figure 8
Data Sheet
Block Diagram of GPT2
38
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.10
Real Time Clock
The Real Time Clock (RTC) module of the XC2220U can be clocked with a clock signal
selected from internal sources or external sources (pins).
The RTC basically consists of a chain of divider blocks:
•
•
•
Selectable 32:1 and 8:1 dividers (on - off)
The reloadable 16-bit timer T14
The 32-bit RTC timer block (accessible via registers RTCH and RTCL) consisting of:
– a reloadable 10-bit timer
– a reloadable 6-bit timer
– a reloadable 6-bit timer
– a reloadable 10-bit timer
All timers count up. Each timer can generate an interrupt request. All requests are
combined to a common node request.
fRTC
:32
M UX
RUN
M UX
Interrupt Sub Node
:8
PRE
REFCLK
CNT
INT0
CNT
INT1
CNT
INT2
RTCINT
CNT
INT3
REL-Register
f CNT
T14REL
10 Bits
6 Bits
6 Bits
10 Bits
T14
10 Bits
6 Bits
6 Bits
10 Bits
T14-Register
CNT-Register
M CB05568B
Figure 9
RTC Block Diagram
Note: The registers associated with the RTC are only affected by a power reset.
Data Sheet
39
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
The RTC module can be used for different purposes:
•
•
•
•
System clock to determine the current time and date
Cyclic time-based interrupt, to provide a system time tick independent of CPU
frequency and other resources
48-bit timer for long-term measurements
Alarm interrupt at a defined time
Data Sheet
40
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.11
A/D Converters
For analog signal measurement, a 12-bit A/D converters (ADC0) with 10 multiplexed
input channels and a sample and hold circuit have been integrated on-chip. Conversions
use the successive approximation method. The sample time (to charge the capacitors)
and the conversion time are programmable so that they can be adjusted to the external
circuit. The A/D converters can also operate in 8-bit and 10-bit conversion mode, further
reducing the conversion time.
Several independent conversion result registers, selectable interrupt requests, and
highly flexible conversion sequences provide a high degree of programmability to meet
the application requirements.
For applications that require more analog input channels, external analog multiplexers
can be controlled automatically. For applications that require fewer analog input
channels, the remaining channel inputs can be used as digital input port pins.
The A/D converters of the XC2220U support two types of request sources which can be
triggered by several internal and external events.
•
•
Parallel requests are activated at the same time and then executed in a predefined
sequence.
Queued requests are executed in a user-defined sequence.
In addition, the conversion of a specific channel can be inserted into a running sequence
without disturbing that sequence. All requests are arbitrated according to the priority
level assigned to them.
Data reduction features reduce the number of required CPU access operations allowing
the precise evaluation of analog inputs (high conversion rate) even at a low CPU speed.
Result data can be reduced by limit checking or accumulation of results. Two cascadable
filters build the hardware to generate a configurable moving average.
The Peripheral Event Controller (PEC) can be used to control the A/D converters or to
automatically store conversion results to a table in memory for later evaluation, without
requiring the overhead of entering and exiting interrupt routines for each data transfer.
Each A/D converter contains eight result registers which can be concatenated to build a
result FIFO. Wait-for-read mode can be enabled for each result register to prevent the
loss of conversion data.
In order to decouple analog inputs from digital noise and to avoid input trigger noise,
those pins used for analog input can be disconnected from the digital input stages. This
can be selected for each pin separately with the Port x Digital Input Disable registers.
The Auto-Power-Down feature of the A/D converters minimizes the power consumption
when no conversion is in progress.
Broken wire detection for each channel and a multiplexer test mode provide information
to verify the proper operation of the analog signal sources (e.g. a sensor system).
Data Sheet
41
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.12
Universal Serial Interface Channel Modules (USIC)
The XC2220U features the USIC module USIC0. The module provides two serial
communication channels.
The Universal Serial Interface Channel (USIC) module is based on a generic data shift
and data storage structure which is identical for all supported serial communication
protocols. Each channel supports complete full-duplex operation with a basic data buffer
structure (one transmit buffer and two receive buffer stages). In addition, the data
handling software can use FIFOs.
The protocol part (generation of shift clock/data/control signals) is independent of the
general part and is handled by protocol-specific preprocessors (PPPs).
The USIC’s input/output lines are connected to pins by a pin routing unit. The inputs and
outputs of each USIC channel can be assigned to different interface pins, providing great
flexibility to the application software. All assignments can be made during runtime.
Bus
Buffer & Shift Structure Protocol Preprocessors
Pins
Control 0
DBU
0
PPP_B
DSU
0
PPP_C
PPP_D
Control 1
PPP_A
DBU
1
Pin Routing Shell
Bus Interface
PPP_A
PPP_B
DSU
1
PPP_C
PPP_D
fsys
Fractional
Dividers
Baud rate
Generators
USIC_basic.vsd
Figure 10
General Structure of a USIC Module
The regular structure of the USIC module brings the following advantages:
•
•
•
Higher flexibility through configuration with same look-and-feel for data management
Reduced complexity for low-level drivers serving different protocols
Wide range of protocols with improved performances (baud rate, buffer handling)
Data Sheet
42
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
Target Protocols
Each USIC channel can receive and transmit data frames with a selectable data word
width from 1 to 16 bits in each of the following protocols:
•
•
•
•
•
UART (asynchronous serial channel)
– module capability: maximum baud rate = fSYS / 4
– data frame length programmable from 1 to 63 bits
– MSB or LSB first
LIN Support (Local Interconnect Network)
– module capability: maximum baud rate = fSYS / 16
– checksum generation under software control
– baud rate detection possible by built-in capture event of baud rate generator
SSC/SPI (synchronous serial channel with or without data buffer)
– module capability: maximum baud rate = fSYS / 2, limited by loop delay
– number of data bits programmable from 1 to 63, more with explicit stop condition
– MSB or LSB first
– optional control of slave select signals
IIC (Inter-IC Bus)
– supports baud rates of 100 kbit/s and 400 kbit/s
IIS (Inter-IC Sound Bus)
– module capability: maximum baud rate = fSYS / 2
Note: Depending on the selected functions (such as digital filters, input synchronization
stages, sample point adjustment, etc.), the maximum achievable baud rate can be
limited. Please note that there may be additional delays, such as internal or
external propagation delays and driver delays (e.g. for collision detection in UART
mode, for IIC, etc.).
3.13
System Timer
The System Timer consists of a programmable prescaler and two concatenated timers
(10 bits and 6 bits). Both timers can generate interrupt requests. The clock source can
be selected and the timers can also run during power reduction modes.
Therefore, the System Timer enables the software to maintain the current time for
scheduling functions or for the implementation of a clock.
3.14
Window Watchdog Timer
The Window Watchdog Timer is one of the fail-safe mechanisms which have been
implemented to prevent the controller from malfunctioning for longer periods of time.
The Window Watchdog Timer is always enabled after an application reset of the chip. It
can be disabled and enabled at any time by executing the instructions DISWDT and
ENWDT respectively. The software has to service the Window Watchdog Timer before
Data Sheet
43
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
it overflows. If this is not the case because of a hardware or software failure, the Window
Watchdog Timer overflows, generating a reset request.
The Window Watchdog Timer has a ‘programmable window boundary’, it disallows
refresh during the Window Watchdog Timer’s count-up. A refresh during this windowboundary will cause the Window Watchdog Timer to also generate a reset request.
The Window Watchdog Timer is a 16-bit timer clocked with either the system clock or the
independent wake-up oscillator clock, divided by 16,384 or 256. The Window Watchdog
Timer register is set to a prespecified reload value (stored in WDTREL) in order to allow
further variation of the monitored time interval. Each time it is serviced by the application
software, the Window Watchdog Timer is reloaded.
When clocked by fSYS = 66 MHz, time intervals between 15.2 ns and 16.3 s can be
monitored.
When clocked by fWU = 500 kHz, time intervals between 2.0 µs and 2147.5 s can be
monitored.
The default Watchdog Timer interval after power-up is 0.13 s (@ fWU = 500 kHz).
3.15
Clock Generation
The Clock Generation Unit can generate the system clock signal fSYS for the XC2220U
from a number of external or internal clock sources:
•
•
•
•
External clock signals with pad voltage or core voltage levels
External crystal or resonator using the on-chip oscillator
On-chip clock source for operation without crystal/resonator
Wake-up clock (ultra-low-power) to further reduce power consumption
The programmable on-chip PLL with multiple prescalers generates a clock signal for
maximum system performance from standard crystals, a clock input signal, or from the
on-chip clock source. See also Section 4.7.2.
The Oscillator Watchdog (OWD) generates an interrupt if the crystal oscillator frequency
falls below a certain limit or stops completely. In this case, the system can be supplied
with an emergency clock to enable operation even after an external clock failure.
All available clock signals can be output on the EXTCLK pin.
Data Sheet
44
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.16
Parallel Ports
The XC2220U provides up to 33 I/O lines which are organized into 3 input/output ports
and 1 input port. All port lines are bit-addressable, and all input/output lines can be
individually (bit-wise) configured via port control registers. This configuration selects the
direction (input/output), push/pull or open-drain operation, activation of pull devices, and
edge characteristics (shape) and driver characteristics (output current) of the port
drivers. The I/O ports are true bidirectional ports which are switched to high impedance
state when configured as inputs. During the internal reset, all port pins are configured as
inputs without pull devices active.
All port lines have alternate input or output functions associated with them. These
alternate functions can be programmed to be assigned to various port pins to support the
best utilization for a given application. For this reason, certain functions appear several
times in Table 10.
All port lines that are not used for alternate functions may be used as general purpose
I/O lines.
Table 10
Summary of the XC2220U’s Ports
Group
Width
I/O
Connected Modules
P2
12
I/O
Analog inputs, ADC, CC2, DAP/JTAG, GPT12E, SCU,
USIC
P5
6
I
Analog inputs, CCU6, JTAG, GPT12E, CC2
P6
3
I/O
Analog inputs, ADC, JTAG, GPT12E
P10
12
I/O
CCU6, GPT12E, DAP/JTAG, SPD, USIC
Data Sheet
45
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.17
Power Management
The XC2220U provides the means to control the power it consumes either at a given
time or averaged over a certain duration.
Two mechanisms can be used (and partly in parallel):
•
•
Clock Generation Management controls the frequency of internal and external
clock signals. Clock signals for currently inactive parts of logic are disabled
automatically. The user can drastically reduce the consumed power by reducing the
XC2220U system clock frequency.
External circuits can be controlled using the programmable frequency output
EXTCLK.
Peripheral Management permits temporary disabling of peripheral modules. Each
peripheral can be disabled and enabled separately. The CPU can be switched off
while the peripherals can continue to operate.
Wake-up from power reduction modes can be triggered either externally with signals
generated by the external system, or internally by the on-chip wake-up timer. This
supports intermittent operation of the XC2220U by generating cyclic wake-up signals.
Full performance is available to quickly react to action requests while the intermittent
sleep phases greatly reduce the average system power consumption.
Note: When selecting the supply voltage and the clock source and generation method,
the required parameters must be carefully written to the respective bit fields, to
avoid unintended intermediate states. Recommended sequences are provided
which ensure the intended operation of power supply system and clock system.
Please refer to the Programmer’s Guide.
Data Sheet
46
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
3.18
Instruction Set Summary
Table 11 lists the instructions of the XC2220U.
The addressing modes that can be used with a specific instruction, the function of the
instructions, parameters for conditional execution of instructions, and the opcodes for
each instruction can be found in the “Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Table 11
Instruction Set Summary
Mnemonic
Description
Bytes
ADD(B)
Add word (byte) operands
2/4
ADDC(B)
Add word (byte) operands with Carry
2/4
SUB(B)
Subtract word (byte) operands
2/4
SUBC(B)
Subtract word (byte) operands with Carry
2/4
MUL(U)
(Un)Signed multiply direct GPR by direct GPR
(16- × 16-bit)
2
DIV(U)
(Un)Signed divide register MDL by direct GPR (16-/16-bit) 2
DIVL(U)
(Un)Signed long divide reg. MD by direct GPR (32-/16-bit) 2
CPL(B)
Complement direct word (byte) GPR
2
NEG(B)
Negate direct word (byte) GPR
2
AND(B)
Bitwise AND, (word/byte operands)
2/4
OR(B)
Bitwise OR, (word/byte operands)
2/4
XOR(B)
Bitwise exclusive OR, (word/byte operands)
2/4
BCLR/BSET
Clear/Set direct bit
2
BMOV(N)
Move (negated) direct bit to direct bit
4
BAND/BOR/BXOR AND/OR/XOR direct bit with direct bit
4
BCMP
Compare direct bit to direct bit
4
BFLDH/BFLDL
Bitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)
Compare word (byte) operands
2/4
CMPD1/2
Compare word data to GPR and decrement GPR by 1/2
2/4
CMPI1/2
Compare word data to GPR and increment GPR by 1/2
2/4
PRIOR
Determine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
2
SHL/SHR
Shift left/right direct word GPR
2
Data Sheet
47
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
Table 11
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
ROL/ROR
Rotate left/right direct word GPR
2
ASHR
Arithmetic (sign bit) shift right direct word GPR
2
MOV(B)
Move word (byte) data
2/4
MOVBS/Z
Move byte operand to word op. with sign/zero extension
2/4
JMPA/I/R
Jump absolute/indirect/relative if condition is met
4
JMPS
Jump absolute to a code segment
4
JB(C)
Jump relative if direct bit is set (and clear bit)
4
JNB(S)
Jump relative if direct bit is not set (and set bit)
4
CALLA/I/R
Call absolute/indirect/relative subroutine if condition is met 4
CALLS
Call absolute subroutine in any code segment
4
PCALL
Push direct word register onto system stack and call
absolute subroutine
4
TRAP
Call interrupt service routine via immediate trap number
2
PUSH/POP
Push/pop direct word register onto/from system stack
2
SCXT
Push direct word register onto system stack and update
register with word operand
4
RET(P)
Return from intra-segment subroutine
(and pop direct word register from system stack)
2
RETS
Return from inter-segment subroutine
2
RETI
Return from interrupt service subroutine
2
SBRK
Software Break
2
SRST
Software Reset
4
IDLE
Enter Idle Mode
PWRDN
Unused instruction
4
1)
4
SRVWDT
Service Watchdog Timer
4
DISWDT/ENWDT
Disable/Enable Watchdog Timer
4
EINIT
End-of-Initialization Register Lock
4
ATOMIC
Begin ATOMIC sequence
2
EXTR
Begin EXTended Register sequence
2
EXTP(R)
Begin EXTended Page (and Register) sequence
2/4
EXTS(R)
Begin EXTended Segment (and Register) sequence
2/4
Data Sheet
48
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Functional Description
Table 11
Instruction Set Summary (cont’d)
Mnemonic
Description
Bytes
NOP
Null operation
2
CoMUL/CoMAC
Multiply (and accumulate)
4
CoADD/CoSUB
Add/Subtract
4
Co(A)SHR
(Arithmetic) Shift right
4
CoSHL
Shift left
4
CoLOAD/STORE
Load accumulator/Store MAC register
4
CoCMP
Compare
4
CoMAX/MIN
Maximum/Minimum
4
CoABS/CoRND
Absolute value/Round accumulator
4
CoMOV
Data move
4
CoNEG/NOP
Negate accumulator/Null operation
4
1) The Enter Power Down Mode instruction is not used in the XC2220U, due to the enhanced power control
scheme. PWRDN will be correctly decoded, but will trigger no action.
Data Sheet
49
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4
Electrical Parameters
The operating range for the XC2220U is defined by its electrical parameters. For proper
operation the specified limits must be respected when integrating the device in its target
environment.
4.1
General Parameters
These parameters are valid for all subsequent descriptions, unless otherwise noted.
Table 12
Absolute Maximum Rating Parameters
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Note /
Test Condition
Output current on a pin
when high value is driven
IOH SR
-15
−
−
mA
Output current on a pin
when low value is driven
IOL SR
−
−
15
mA
-5
−
5
mA
1)
−
−
50
mA
1)
IOV SR
Absolute sum of overload Σ|IOV|
Overload current
currents
SR
Junction Temperature
TJ SR
-40
TST SR -65
VDDP SR -0.5
−
150
°C
−
150
°C
−
6.0
V
VIN SR
−
Storage Temperature
Digital supply voltage for
IO pads and voltage
regulators
Voltage on any pin with
respect to ground (Vss)
-0.5
VDDP + V
VIN≤ VDDP(max)
0.5
1) Overload condition occurs if the input voltage VIN is out of the absolute maximum rating range. In this case the
current must be limited to the listed values by design measures.
Note: Stresses above the values listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only. Functional operation
of the device at these or any other conditions above those indicated in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for an extended time may affect device reliability.
During absolute maximum rating overload conditions (VIN > VDDP or VIN < VSS) the
voltage on VDDP pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Data Sheet
50
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.1.1
Operating Conditions
The following operating conditions must not be exceeded to ensure correct operation of
the XC2220U. All parameters specified in the following sections refer to these operating
conditions, unless otherwise noticed.
Note: Typical parameter values refer to room temperature and nominal supply voltage,
minimum/maximum
parameter
values
also
include
conditions
of
minimum/maximum temperature and minimum/maximum supply voltage.
Additional details are described where applicable.
Table 13
Operating Conditions
Parameter
Symbol
Voltage Regulator Buffer
Capacitance for DMP_M
CEVRM
External Load
Capacitance
CL SR
Values
Unit
Min.
Typ.
Max.
1.0
−
4.7
μF
−
203)
−
pF
Note /
Test Condition
1)2)
SR
pin out
driver= default
4)
System frequency
Overload current for
analog inputs6)
fSYS SR −
IOVA SR -2
Overload current for digital IOVD SR -5
inputs6)
Overload current coupling KOVA
factor for analog inputs7)
CC
−
−
Data Sheet
51
−
66
MHz
5)
−
5
mA
not subject to
production test
−
5
mA
not subject to
production test
2.5 x
10-4
1.5 x
10-3
-
IOV< 0 mA; not
1.0 x
10-6
1.0 x
10-4
-
subject to
production test
IOV> 0 mA; not
subject to
production test
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 13
Operating Conditions (cont’d)
Parameter
Symbol
Overload current coupling KOVD
factor for digital I/O pins
CC
Values
Unit
Typ.
Max.
−
1.0 x
10-2
3.0 x
10-2
IOV< 0 mA; not
1.0 x
10-4
5.0 x
10-3
IOV> 0 mA; not
−
subject to
production test
subject to
production test
Σ|IOV|
SR
−
−
30
mA
Digital core supply voltage VDDIM
for domain M8)
CC
−
1.5
−
V
−
5.5
V
0
−
V
Absolute sum of overload
currents
Note /
Test Condition
Min.
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 3.0
Digital ground voltage
VSS SR
−
not subject to
production test
1) To ensure the stability of the voltage regulators the EVRs must be buffered with ceramic capacitors. Separate
buffer capacitors with the recomended values shall be connected as close as possible to each VDDIM pin to
keep the resistance of the board tracks below 2 Ohm. Connect all VDDIM pins together. The minimum
capacitance value is required for proper operation under all conditions (e.g. temperature). Higher values
slightly increase the startup time.
2) Use one Capacitor for each pin.
3) This is the reference load. For bigger capacitive loads, use the derating factors listed in the PAD properties
section.
4) The timing is valid for pin drivers operating in default current mode (selected after reset). Reducing the output
current may lead to increased delays or reduced driving capability (CL).
5) The operating frequency range may be reduced for specific device types. This is indicated in the device
designation (...FxxL). 40 MHz devices are marked ...F40L.
6) Overload conditions occur if the standard operating conditions are exceeded, i.e. the voltage on any pin
exceeds the specified range: VOV > VIHmax (IOV > 0) or VOV < VILmin ((IOV < 0). The absolute sum of input
overload currents on all pins may not exceed 50 mA. The supply voltages must remain within the specified
limits. Proper operation under overload conditions depends on the application. Overload conditions must not
occur on pin XTAL1.
7) An overload current (IOV) through a pin injects a certain error current (IINJ) into the adjacent pins. This error
current adds to the respective pins leakage current (IOZ). The amount of error current depends on the overload
current and is defined by the overload coupling factor KOV. The polarity of the injected error current is inverse
compared to the polarity of the overload current that produces it.The total current through a pin is |ITOT| = |IOZ|
+ (|IOV| KOV). The additional error current may distort the input voltage on analog inputs.
Data Sheet
52
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
8) Value is controlled by on-chip regulator.
4.2
Voltage Range definitions
The XC2220U timing depends on the supply voltage. If such a dependency exists the
timing values are given for 2 voltage areas commonly used. The voltage areas are
defined in the following tables.
Table 14
Upper Voltage Range Definition
Parameter
Symbol
Values
Min.
Digital supply voltage for
IO pads and voltage
regulators
Table 15
VDDP SR 4.5
Max.
5.0
5.5
Note /
Test Condition
V
Lower Voltage Range Definition
Parameter
Symbol
Digital supply voltage for
IO pads and voltage
regulators
VDDP SR 3.0
Values
Min.
4.2.1
Unit
Typ.
Unit
Typ.
Max.
3.3
4.5
Note /
Test Condition
V
Parameter Interpretation
The parameters listed in the following include both the characteristics of the XC2220U
and its demands on the system. To aid in correctly interpreting the parameters when
evaluating them for a design, they are marked accordingly in the column “Symbol”:
CC (Controller Characteristics):
The logic of the XC2220U provides signals with the specified characteristics.
SR (System Requirement):
The external system must provide signals with the specified characteristics to the
XC2220U.
Data Sheet
53
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.3
DC Parameters
These parameters are static or average values that may be exceeded during switching
transitions (e.g. output current).
The XC2220U can operate within a wide supply voltage range from 3.0 V to 5.5 V.
However, during operation this supply voltage must remain within 10 percent of the
selected nominal supply voltage. It cannot vary across the full operating voltage range.
Because of the supply voltage restriction and because electrical behavior depends on
the supply voltage, the parameters are specified separately for the upper and the lower
voltage range.
During operation, the supply voltages may only change with a maximum speed of
dV/dt < 1 V/ms.
Leakage current is strongly dependent on the operating temperature and the voltage
level at the respective pin. The maximum values in the following tables apply under worst
case conditions, i.e. maximum temperature and an input level equal to the supply
voltage.
The value for the leakage current in an application can be determined by using the
respective leakage derating formula (see tables) with values from that application.
The pads of the XC2220U are designed to operate in various driver modes. The DC
parameter specifications refer to the pad current limits specified in Section 4.7.4.
Data Sheet
54
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Pullup/Pulldown Device Behavior
Most pins of the XC2220U feature pullup or pulldown devices. For some special pins
these are fixed; for the port pins they can be selected by the application.
The specified current values indicate how to load the respective pin depending on the
intended signal level. Figure 11 shows the current paths.
The shaded resistors shown in the figure may be required to compensate system pull
currents that do not match the given limit values.
VDDP
Pullup
Pulldown
VSS
MC_XC2X_PULL
Figure 11
Data Sheet
Pullup/Pulldown Current Definition
55
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.3.1
DC Parameters for Upper Voltage Area
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 16 is valid under the following conditions: VDDP≤ 5.5 V; VDDPtyp. 5 V; VDDP≥ 4.5 V
Table 16
DC Characteristics for Upper Voltage Range
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
10
pF
not subject to
production test
−
−
V
RS= 0 Ohm
Pin capacitance (digital
inputs/outputs).
CIO CC
Input Hysteresis1)
HYS CC 0.11 x
VDDP
Absolute input leakage
current on pins of analog
ports2)
|IOZ1|
CC
−
10
200
nA
VIN> VSS ;
VIN< VDDP
Absolute input leakage
current for all other pins.
|IOZ2|
CC
−
0.2
5
μA
−
0.2
10
μA
−
−
μA
−
−
30
μA
TJ≤ 110 °C;
VIN> VSS ;
VIN< VDDP
TJ≤ 150 °C;
VIN> VSS ;
VIN< VDDP
VIN≥ VIHmin
(pulldown_ena
bled);
VIN≤ VILmax
(pullup_enable
d)
VIN≥ VIHmin
(pullup_enable
d);
VIN≤ VILmax
(pulldown_ena
bled)
0.7 x
−
2)3)
Pull Level Force Current4) |IPLF| SR 220
Pull Level Keep Current5)
|IPLK|
SR
Input high voltage (all
except XTAL1)
VIH SR
Data Sheet
VDDP
56
VDDP + V
0.3
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 16
DC Characteristics for Upper Voltage Range (cont’d)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
-0.3
−
0.3 x
Input low voltage
(all except XTAL1)
VIL SR
Output High voltage6)
VOH CC VDDP - −
Note /
Test Condition
V
VDDP
−
V
IOH≥ IOHmax
−
V
IOH≥ IOHnom 7)
IOL≤ IOLnom 8)
IOL≤ IOLmax
1.0
VDDP - −
0.4
Output Low Voltage6)
VOL CC
−
−
0.4
V
−
−
1.0
V
1) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
2) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
3) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
4) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device.
5) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level.
6) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
7) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Data Sheet
57
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.3.2
DC Parameters for Lower Voltage Area
Keeping signal levels within the limits specified in this table ensures operation without
overload conditions. For signal levels outside these specifications, also refer to the
specification of the overload current IOV.
Note: Operating Conditions apply.
Table 17 is valid under the following conditions: VDDP≥ 3.0 V; VDDPtyp. 3.3 V;
VDDP≤ 4.5 V
Table 17
DC Characteristics for Lower Voltage Range
Parameter
Symbol
Values
Pin capacitance (digital
inputs/outputs).
CIO CC
Input Hysteresis1)
HYS CC 0.07 x
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
10
pF
not subject to
production test
−
−
V
RS= 0 Ohm
VDDP
Absolute input leakage
current on pins of analog
ports2)
|IOZ1|
CC
−
10
200
nA
VIN> VSS ;
VIN< VDDP
Absolute input leakage
current for all other pins.
|IOZ2|
CC
−
0.2
2
μA
−
0.2
6
μA
−
−
μA
−
10
μA
TJ≤ 110 °C;
VIN> VSS ;
VIN< VDDP
TJ≤ 150 °C;
VIN> VSS ;
VIN< VDDP
VIN≥ VIHmin
(pulldown_ena
bled);
VIN≤ VILmax
(pullup_enable
d) ;
VIN≥ VIHmin
(pullup_enable
d);
VIN≤ VILmax
(pulldown_ena
bled)
2)3)
Pull Level Force Current4) |IPLF| SR 150
Pull Level Keep Current5)
Data Sheet
|IPLK|
SR
−
58
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 17
DC Characteristics for Lower Voltage Range (cont’d)
Parameter
Symbol
Values
Min.
Typ.
0.7 x
−
Input high voltage (all
except XTAL1)
VIH SR
Input low voltage
(all except XTAL1)
VIL SR
Output High voltage6)
VOH CC VDDP - −
VDDP
Note /
Test Condition
VDDP + V
0.3
−
-0.3
Unit
Max.
0.3 x
V
VDDP
−
V
IOH≥ IOHmax
−
V
IOH≥ IOHnom 7)
IOL≤ IOLnom 8)
IOL≤ IOLmax
1.0
VDDP - −
0.4
Output Low Voltage6)
VOL CC
−
−
0.4
V
−
−
1.0
V
1) Not subject to production test - verified by design/characterization. Hysteresis is implemented to avoid
metastable states and switching due to internal ground bounce. It cannot suppress switching due to external
system noise under all conditions.
2) If the input voltage exceeds the respective supply voltage due to ground bouncing (VIN < VSS) or supply ripple
(VIN > VDDP), a certain amount of current may flow through the protection diodes. This current adds to the
leakage current. An additional error current (IINJ) will flow if an overload current flows through an adjacent pin.
Please refer to the definition of the overload coupling factor KOV.
3) The given values are worst-case values. In production test, this leakage current is only tested at 125 °C; other
values are ensured by correlation. For derating, please refer to the following descriptions: Leakage derating
depending on temperature (TJ = junction temperature [°C]): IOZ = 0.05 x e(1.5 + 0.028 x TJ>) [μA]. For example, at
a temperature of 95 °C the resulting leakage current is 3.2 μA. Leakage derating depending on voltage level
(DV = VDDP - VPIN [V]): IOZ = IOZtempmax - (1.6 x DV) (μA]. This voltage derating formula is an approximation
which applies for maximum temperature.
4) Drive the indicated minimum current through this pin to change the default pin level driven by the enabled pull
device.
5) Limit the current through this pin to the indicated value so that the enabled pull device can keep the default
pin level.
6) The maximum deliverable output current of a port driver depends on the selected output driver mode. This
specification is not valid for outputs which are switched to open drain mode. In this case the respective output
will float and the voltage is determined by the external circuit.
7) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
8) As a rule, with decreasing output current the output levels approach the respective supply level (VOL->VSS,
VOH->VDDP). However, only the levels for nominal output currents are verified.
Data Sheet
59
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.3.3
Power Consumption
The power consumed by the XC2220U depends on several factors such as supply
voltage, operating frequency, active circuits, and operating temperature. The power
consumption specified here consists of two components:
•
•
The switching current IS depends on the device activity
The leakage current ILK depends on the device temperature
To determine the actual power consumption, always both components, switching current
IS and leakage current ILK must be added:
IDDP = IS + ILK.
Note: The power consumption values are not subject to production test. They are
verified by design/characterization.
To determine the total power consumption for dimensioning the external power
supply, also the pad driver currents must be considered.
The given power consumption parameters and their values refer to specific operating
conditions:
•
•
Active mode:
Regular operation, i.e. peripherals are active, code execution out of Flash.
Stopover mode:
Crystal oscillator and PLL stopped, Flash switched off, clock in most parts of domain
DMP_M stopped.
Note: The maximum values cover the complete specified operating range of all
manufactured devices.
The typical values refer to average devices under typical conditions, such as
nominal supply voltage, room temperature, application-oriented activity.
After a power reset, the decoupling capacitors for VDDIM are charged with the
maximum possible current.
For additional information, please refer to Section 5.2, Thermal Considerations.
Note: Operating Conditions apply.
Data Sheet
60
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 18
Parameter
Switching Power Consumption
Symbol
Power supply current
ISACT
(active) with all peripherals CC
active and EVVRs on
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
5.5 +
0.4 x
7 + 0.6 mA
x fSYS1)
power_mode=
active ;
voltage_range=
both 2)3)4)
2.0
power_mode=
stopover ;
voltage_range=
both
fSYS1)
Power supply current in
ISSO CC −
stopover mode, EVVRs on
0.7
mA
1) fSYS in MHz
2) The pad supply voltage pins (VDDPB) provide the input current for the on-chip EVVRs and the current
consumed by the pin output drivers. A small current is consumed because the drivers input stages are
switched.
3) Please consider the additional conditions described in section "Active Mode Power Supply Current".
4) The pad supply voltage only has a minor influence on this parameter.
Active Mode Power Supply Current
The actual power supply current in active mode not only depends on the system
frequency but also on the configuration of the XC2220U’s subsystem.
Besides the power consumed by the device logic the power supply pins also provide the
current that flows through the pin output drivers.
A small current is consumed because the drivers’ input stages are switched.
Data Sheet
61
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
IS [mA]
ISACTmax
60
50
ISACTtyp
40
30
20
10
20
60
40
80
fSYS [MHz]
MC_XC2XU_IS
Figure 12
Supply Current in Active Mode as a Function of Frequency
Note: Operating Conditions apply.
Table 19
Leakage Power Consumption
Parameter
Leakage supply current
Symbol
1)2)
ILK1 CC
Values
Unit
Note /
Test Condition
TJ= 25 °C
TJ= 85 °C
TJ= 125 °C
TJ= 150 °C
Min.
Typ.
Max.
−
0.03
0.04
mA
−
0.4
0.95
mA
−
1.5
4.6
mA
−
3.3
10.1
mA
1) The supply current caused by leakage depends mainly on the junction temperature and the supply voltage.
The temperature difference between the junction temperature TJ and the ambient temperature TA must be
taken into account. As this fraction of the supply current does not depend on device activity, it must be added
to other power consumption values.
2) All inputs (including pins configured as inputs) are set at 0 V to 0.1 V or at VDDP - 0.1 V to VDDP and all outputs
(including pins configured as outputs) are disconnected.
Leakage Power Consumption Calculation
The leakage power consumption can be calculated according to the following formulas:
Data Sheet
62
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
ILK1 = 440,000 + e-α with α = 5000 / (273 + B×TJ)
Parameter B must be replaced by
•
•
1.0 for typical values
1.3 for maximum values
ILK [mA]
ILK1max
12
10
8
6
ILK1typ
4
2
-50
0
100
50
125
150
TJ [°C]
MC_XC2XU_ILKN
Figure 13
Leakage Supply Current as a Function of Temperature
Data Sheet
63
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.4
Analog/Digital Converter Parameters
These parameters describe the conditions for optimum ADC performance.
Note: Operating Conditions apply.
Table 20
ADC Parameters for All Voltage Ranges
Parameter
Symbol
Switched capacitance at
an analog input
CAINSW
Values
Min.
Typ.
Max.
−
9
20
Unit
Note /
Test Condition
pF
not subject to
production test
CC
1)
Total capacitance at an
analog input
CAINT
−
20
30
pF
CC
not subject to
production test
1)
Switched capacitance at
the reference input
CAREFSW −
15
30
pF
CC
not subject to
production test
1)
Total capacitance at the
reference input
CAREFT
−
20
40
pF
CC
not subject to
production test
1)
Broken wire detection
delay against VAGND2)
tBWG CC −
−
503)
Broken wire detection
delay against VAREF2)
tBWR CC −
−
504)
Conversion time for 8-bit
result2)
tc8 CC
tSYS
Conversion time for 10-bit tc10 CC
result2)
Conversion time for 12-bit tc12 CC
result2)
Analog reference ground
Analog input voltage
range
Analog reference voltage
(10 + STC x tADCI + 2 x
(12 + STC x tADCI + 2 x
tSYS
(16 + STC x tADCI + 2 x
VAGND
tSYS
VSS -
SR
0.05
−
1.5
V
VAIN SR VAGND
−
VAREF
V
VAREF
VAGND
−
VDDPB
V
SR
+ 1.0
5)
+ 0.05
1) These parameter values cover the complete operating range. Under relaxed operating conditions
(temperature, supply voltage) typical values can be used for calculation.
Data Sheet
64
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
2) This parameter includes the sample time (also the additional sample time specified by STC), the time to
determine the digital result and the time to load the result register with the conversion result. Values for the
basic clock tADCI depend on programming.
3) The broken wire detection delay against VAGND is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 500 µs. Result below 10% (66H)
4) The broken wire detection delay against VAREF is measured in numbers of consecutive precharge cycles at a
conversion rate of not more than 10 µs. This function is influenced by leakage current, in particular at high
temperature. Result above 80% (332H)
5) VAIN may exceed VAGND or VAREF up to the absolute maximum ratings. However, the conversion result in these
cases will be X000H or X3FFH, respectively.
Table 21
ADC Parameters for Upper Voltage Range
Parameter
Symbol
Values
Input resistance of the
selected analog channel
RAIN CC −
Min.
Typ.
Max.
0.9
1.5
Unit
Note /
Test Condition
kOh
m
not subject to
production test
1)
Input resistance of the
reference input
RAREF
−
0.5
1
CC
kOh
m
not subject to
production test
1)
Differential Non-Linearity
Error2)3)4)5)
|EADNL|
CC
−
2.5
5.0
LSB
Gain Error2)3)4)5)
|EAGAIN| −
CC
2.5
6.0
LSB
Integral NonLinearity2)3)4)5)
|EAINL|
CC
−
2.0
4.0
LSB
Offset Error2)3)4)5)
|EAOFF|
CC
−
2.0
4.0
LSB
Analog clock frequency
fADCI SR 2
−
20
MHz Std. reference
input (VAREF)
2
−
17.5
MHz Alt. reference
input (CH0)
−
2.5
5.5
LSB
Wakeup time from analog tWAF CC −
powerdown, fast mode
−
7.0
μs
Wakeup time from analog tWAS CC −
powerdown, slow mode
−
11.5
μs
Total Unadjusted Error3)4)
Data Sheet
|TUE|
CC
65
6)7)
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
1) These parameter values cover the complete operating range. Under relaxed operating conditions
(temperature, supply voltage) typical values can be used for calculation.
2) The sum of DNL/INL/GAIN/OFF errors does not exceed the related TUE total unadjusted error.
3) If a reduced analog reference voltage between 1V and VDDPB / 2 is used, then there are additional decrease
in the ADC speed and accuracy.
4) If the analog reference voltage range is below VDDPB but still in the defined range of VDDPB / 2 and VDDPB is
used, then the ADC converter errors increase. If the reference voltage is reduced by the factor k (k<1), TUE,
DNL, INL, Gain and Offset errors increase also by the factor 1/k.
5) If the analog reference voltage is > VDDPB, then the ADC converter errors increase.
6) TUE is based on 12-bit conversion.
7) TUE is tested at VAREF = VDDPB = 5.0 V, VAGND = 0 V. It is verified by design for all other voltages within the
defined voltage range. The specified TUE is valid only if the absolute sum of input overload currents on analog
port pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the
measurement time.
Table 22
ADC Parameters for Lower Voltage Range
Parameter
Symbol
Values
Min.
Input resistance of the
selected analog channel
RAIN CC −
Typ.
Max.
1.4
2.5
Unit
Note /
Test Condition
kOh
m
not subject to
production test
1)
Input resistance of the
reference input
RAREF
−
1.0
2.0
CC
kOh
m
not subject to
production test
1)
Differential Non-Linearity
Error2)3)4)5)
|EADNL|
CC
−
2.5
5.5
LSB
Gain Error2)3)4)5)
|EAGAIN| −
CC
3.0
8.0
LSB
Integral NonLinearity2)3)4)5)
|EAINL|
CC
−
2.5
7.5
LSB
Offset Error2)3)4)5)
|EAOFF|
CC
−
2.0
5.5
LSB
Analog clock frequency
fADCI SR 2
−
16.7
MHz Std. reference
input (VAREF)
2
−
12.1
MHz Alt. reference
input (CH0)
−
2.5
7.5
LSB
Total Unadjusted Error3)4)
Data Sheet
|TUE|
CC
66
6)7)
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 22
ADC Parameters for Lower Voltage Range (cont’d)
Parameter
Symbol
Values
Min.
Unit
Typ.
Max.
Wakeup time from analog tWAF CC −
powerdown, fast mode
−
8.5
μs
Wakeup time from analog tWAS CC −
powerdown, slow mode
−
15.0
μs
Note /
Test Condition
1) These parameter values cover the complete operating range. Under relaxed operating conditions
(temperature, supply voltage) typical values can be used for calculation.
2) The sum of DNL/INL/GAIN/OFF errors does not exceed the related TUE total unadjusted error.
3) If a reduced analog reference voltage between 1V and VDDPB / 2 is used, then there are additional decrease
in the ADC speed and accuracy.
4) If the analog reference voltage range is below VDDPB but still in the defined range of VDDPB / 2 and VDDPB is
used, then the ADC converter errors increase. If the reference voltage is reduced by the factor k (k<1), TUE,
DNL, INL, Gain and Offset errors increase also by the factor 1/k.
5) If the analog reference voltage is > VDDPB, then the ADC converter errors increase.
6) TUE is based on 12-bit conversion.
7) TUE is tested at VAREF = VDDPB = 3.3 V, VAGND = 0 V. It is verified by design for all other voltages within the
defined voltage range. The specified TUE is valid only if the absolute sum of input overload currents on analog
port pins (see IOV specification) does not exceed 10 mA, and if VAREF and VAGND remain stable during the
measurement time.
RSource
V AIN
R AIN, On
C AINT - C AINS
C Ext
A/D Converter
CAINS
MCS05570
Figure 14
Equivalent Circuitry for Analog Inputs
Sample time and conversion time of the XC2220U’s A/D converters are programmable.
The timing above can be calculated using Table 23.
The limit values for fADCI must not be exceeded when selecting the prescaler value.
Data Sheet
67
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 23
A/D Converter Computation Table
GLOBCTR.5-0
(DIVA)
A/D Converter
Analog Clock fADCI
INPCRx.7-0
(STC)
000000B
fSYS
fSYS / 2
fSYS / 3
fSYS / (DIVA+1)
fSYS / 63
fSYS / 64
00H
000001B
000010B
:
111110B
111111B
01H
02H
:
FEH
FFH
Sample Time1)
tS
tADCI × 2
tADCI × 3
tADCI × 4
tADCI × (STC+2)
tADCI × 256
tADCI × 257
1) The selected sample time is doubled if broken wire detection is active (due to the presampling phase).
Converter Timing Example A:
Assumptions:
Analog clock
Sample time
fSYS
fADCI
tS
= 66 MHz (i.e. tSYS = 15.2 ns), DIVA = 03H, STC = 00H
= fSYS / 4 = 16.5 MHz, i.e. tADCI = 60.6 ns
= tADCI × 2 = 121.2 ns
Conversion 12-bit:
tC12
= 16 × tADCI + 2 × tSYS = 16 × 60.6 ns + 2 × 15.2 ns = 1.0 μs
Conversion 10-bit:
tC10
= 12 × tADCI + 2 × tSYS = 12 × 60.6 ns + 2 × 15.2 ns = 0.758 μs
Conversion 8-bit:
tC8
= 10 × tADCI + 2 × tSYS = 10 × 60.6 ns + 2 × 15.2 ns = 0.636 μs
Converter Timing Example B:
Assumptions:
Analog clock
Sample time
fSYS
fADCI
tS
= 40 MHz (i.e. tSYS = 25 ns), DIVA = 01H, STC = 00H
= fSYS / 2 = 20 MHz, i.e. tADCI = 50 ns
= tADCI × 2 = 100 ns
Conversion 12-bit:
tC12
= 16 × tADCI + 2 × tSYS = 16 × 50 ns + 2 × 25 ns = 0.85 μs
Conversion 10-bit:
tC10
Data Sheet
= 12 × tADCI + 2 × tSYS = 12 × 50 ns + 2 × 25 ns = 0.65 μs
68
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Conversion 8-bit:
tC8
Data Sheet
= 10 × tADCI + 2 × tSYS = 10 × 50 ns + 2 × 25 ns = 0.55 μs
69
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.5
System Parameters
The following parameters specify several aspects which are important when integrating
the XC2220U into an application system.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 24
Various System Parameters
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Condition
ΔTJ = ≤ 10°C
Short-term deviation of
internal clock source
frequency1)
ΔfINT CC -1
−
1
%
Internal clock source
frequency
fINT CC
4.8
5.0
5.2
MHz
Wakeup clock source
frequency2)
fWU CC
400
−
700
kHz
FREQSEL= 00
210
−
390
kHz
FREQSEL= 01
140
−
260
kHz
FREQSEL= 10
110
−
200
kHz
FREQSEL= 11
1.9
2.4
ms
fWU = 500 kHz
−
12 /
μs
Startup time from poweron with code execution
from Flash
tSPO CC 1.4
Startup time from stopover tSSO CC 11 /
mode with code execution
fWU3)
from PSRAM
Core voltage (PVC)
supervision level
VPVC CC VLV -
Supply watchdog (SWD)
supervision level
VSWD
fWU3)
VLV
0.03
CC
VLV +
0.07
V
5)
4)
VLV -
VLV
VLV +
0.15
V
voltage_range=
lower 5)
VLV 0.15
VLV
VLV +
0.15
V
voltage_range=
upper 5)
0.106)
1) The short-term frequency deviation refers to a timeframe of a few hours and is measured relative to the current
frequency at the beginning of the respective timeframe. This parameter is useful to determine a time span for
re-triggering a LIN synchronization.
2) This parameter is tested for the fastest and the slowest selection. The medium selections are not subject to
production test - verified by design/characterization.
3) fWU in MHz.
Data Sheet
70
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4) This value includes a hysteresis of approximately 50 mV for rising voltage.
5) VLV = selected SWD voltage level
6) The limit VLV - 0.10 V is valid for the OK1 level. The limit for the OK2 level is VLV - 0.15 V.
Conditions for tSPO Timing Measurement
The time required for the transition from Power-On to Base mode is called tSPO. It is
measured under the following conditions:
Precondition: The pad supply is valid, i.e. VDDPB is above 3.0 V and remains above 3.0 V
even though the XC2220U is starting up. No debugger is attached.
Start condition: Power on reset is removed (PORST = 1).
End condition: External pin toggle caused by first user instruction executed from Flash
after startup.
Conditions for tSSO Timing Measurement
The time required for the transition from Stopover to Stopover Waked-Up mode is
called tSSO. It is measured under the following conditions:
Precondition: The Stopover mode has been entered using the procedure defined in the
Programmer’s Guide.
Start condition: Pin toggle on ESR pin triggering the startup sequence.
End condition: External pin toggle caused by first user instruction executed from PSRAM
after startup.
Data Sheet
71
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Coding of bit fields LEVxV in SWD Configuration Registers
After power-on the supply watch dog is preconfigured to operate in the lower voltage
range.
Table 25
Coding of bit fields LEVxV in Register SWDCON0
Code
Default Voltage Level
Notes1)
0000B
-
out of valid operation range
0001B
3.0 V
LEV1V: reset request
0010B - 0101B
3.1 V - 3.4 V
step width is 0.1 V
0110B
3.6 V
0111B
4.0 V
1000B
4.2 V
1001B
4.5 V
LEV2V: no request
1010B - 1110B
4.6 V - 5.0 V
step width is 0.1 V
1111B
5.5 V
1) The indicated default levels are selected automatically after a power reset.
Coding of bit fields LEVxV in PVC Configuration Registers
The core voltages are controlled internally to the nominal value of 1.5 V; a variation of
±10 % is allowed. These operation conditions limit the possible PVC monitoring values
to the predefined reset values shown in Table 26.
Table 26
Coding of bit fields LEVxV in Registers PVCyCONz
Code
Default Voltage Level
Notes1)
000B - 011B
-
out of valid operation range
100B
1.35 V
LEV1V: reset request
101B
1.45 V
LEV2V: interrupt request2)
110B - 111B
-
out of valid operation range
1) The indicated default levels are selected automatically after a power reset.
2) Due to variations of the tolerance of both the Embedded Voltage Regulators (EVR) and PVC levels, this
interrupt can be triggered inadvertently, even though the core voltage is within the normal range. It is,
therefore, recommended not to use this warning level.
Data Sheet
72
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.6
Flash Memory Parameters
The XC2220U is delivered with all Flash sectors erased and with no protection installed.
The data retention time of the XC2220U’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 27
Flash Parameters
Parameter
Symbol
Min.
Values
Typ.
Max.
Unit
Note /
Test Condition
−
−
11)
NFL_RD≤ 1
Parallel Flash module
program/erase limit
depending on Flash read
activity
NPP SR
Flash erase endurance
for security pages
NSEC SR 10
−
−
Flash wait states2)
NWSFLASH 1
−
−
SR
2
−
−
3
−
−
4
−
cycle tRET≥ 20 years
s
fSYS≤ 8 MHz
fSYS≤ 13 MHz
fSYS≤ 17 MHz
fSYS> 17 MHz
−
Erase time per
sector/page
tER CC
−
7
8.0
ms
Programming time per
page
tPR CC
−
33)
3.5
ms
Data retention time
tRET CC
20
−
−
year
s
Drain disturb limit
Data Sheet
NDD SR
−
32
73
3)
−
NER≤ 1,000 cycl
es
cycle
s
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 27
Flash Parameters (cont’d)
Parameter
Number of erase cycles
Symbol
NER SR
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
15000 cycle tRET≥ 5 years;
s
Valid for up to
64 user
selected
sectors (data
storage)
−
−
1000
cycle tRET≥ 20 years
s
1) All Flash module(s) can be erased/programmed while code is executed and/or data is read from only one Flash
module or from PSRAM. The Flash module that delivers code/data can, of course, not be erased/programmed.
2) Value of IMB_IMBCTRL.WSFLASH.
3) Programming and erase times depend on the internal Flash clock source. The control state machine needs a
few system clock cycles. This increases the stated durations noticably only at extremely low system clock
frequencies.
Access to the XC2220U Flash modules is controlled by the IMB. Built-in prefetch
mechanisms optimize the performance for sequential access.
Flash access waitstates only affect non-sequential access. Due to prefetch
mechanisms, the performance for sequential access (depending on the software
structure) is only partially influenced by waitstates.
Data Sheet
74
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.7
AC Parameters
These parameters describe the dynamic behavior of the XC2220U.
4.7.1
Testing Waveforms
These values are used for characterization and production testing (except pin XTAL1).
O utput delay
O utput delay
H old tim e
H old tim e
0.8 V DDP
0.7 V DDP
Input Signal
(driven by tester)
0.3 V DDP
0.2 V DDP
O utput S ignal
(m easured)
O utput tim ings refer to the rising edge of C LKO U T.
Input tim ings are calculated from the tim e, w hen the input signal reaches
V IH or V IL , respectively.
M C D05556C
Figure 15
Input Output Waveforms
VLoad + 0.1 V
V OH - 0.1 V
Timing
Reference
Points
V Load - 0.1 V
V OL + 0.1 V
For timing purposes a port pin is no longer floating when a 100 mV
change from load voltage occurs, but begins to float when a 100 mV
change from the loaded V OH /V OL level occurs (IOH / IOL = 20 mA).
MCA05565
Figure 16
Data Sheet
Floating Waveforms
75
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.7.2
Definition of Internal Timing
The internal operation of the XC2220U is controlled by the internal system clock fSYS.
Because the system clock signal fSYS can be generated from a number of internal and
external sources using different mechanisms, the duration of the system clock periods
(TCSs) and their variation (as well as the derived external timing) depend on the
mechanism used to generate fSYS. This must be considered when calculating the timing
for the XC2220U.
Phase Locked Loop Operation (1:N)
fI N
f SYS
TCS
Direct Clock Drive (1:1)
fI N
f SYS
TCS
Prescaler Operation (N:1)
fI N
f SYS
TCS
M C_XC2X_CLOCKGEN
Figure 17
Generation Mechanisms for the System Clock
Note: The example of PLL operation shown in Figure 17 uses a PLL factor of 1:4; the
example of prescaler operation uses a divider factor of 2:1.
The specification of the external timing (AC Characteristics) depends on the period of the
system clock (TCS).
Data Sheet
76
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Direct Drive
When direct drive operation is selected (SYSCON0.CLKSEL = 11B), the system clock is
derived directly from the input clock signal CLKIN1:
fSYS = fIN.
The frequency of fSYS is the same as the frequency of fIN. In this case the high and low
times of fSYS are determined by the duty cycle of the input clock fIN.
Selecting Bypass Operation from the XTAL11) input and using a divider factor of 1 results
in a similar configuration.
Prescaler Operation
When prescaler operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY =
1B), the system clock is derived either from the crystal oscillator (input clock signal
XTAL1) or from the internal clock source through the output prescaler K1 (= K1DIV+1):
fSYS = fOSC / K1.
If a divider factor of 1 is selected, the frequency of fSYS equals the frequency of fOSC. In
this case the high and low times of fSYS are determined by the duty cycle of the input
clock fOSC (external or internal).
The lowest system clock frequency results from selecting the maximum value for the
divider factor K1:
fSYS = fOSC / 1024.
4.7.2.1
Phase Locked Loop (PLL)
When PLL operation is selected (SYSCON0.CLKSEL = 10B, PLLCON0.VCOBY = 0B),
the on-chip phase locked loop is enabled and provides the system clock. The PLL
multiplies the input frequency by the factor F (fSYS = fIN × F).
F is calculated from the input divider P (= PDIV+1), the multiplication factor N (=
NDIV+1), and the output divider K2 (= K2DIV+1):
(F = N / (P × K2)).
The input clock can be derived either from an external source at XTAL1 or from the onchip clock source.
The PLL circuit synchronizes the system clock to the input clock. This synchronization is
performed smoothly so that the system clock frequency does not change abruptly.
Adjustment to the input clock continuously changes the frequency of fSYS so that it is
locked to fIN. The slight variation causes a jitter of fSYS which in turn affects the duration
of individual TCSs.
1) Voltages on XTAL1 must comply to the core supply voltage VDDIM.
Data Sheet
77
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
The timing in the AC Characteristics refers to TCSs. Timing must be calculated using the
minimum TCS possible under the given circumstances.
The actual minimum value for TCS depends on the jitter of the PLL. Because the PLL is
constantly adjusting its output frequency to correspond to the input frequency (from
crystal or oscillator), the accumulated jitter is limited. This means that the relative
deviation for periods of more than one TCS is lower than for a single TCS (see formulas
and Figure 18).
This is especially important for bus cycles using waitstates and for the operation of
timers, serial interfaces, etc. For all slower operations and longer periods (e.g. pulse train
generation or measurement, lower baudrates, etc.) the deviation caused by the PLL jitter
is negligible.
The value of the accumulated PLL jitter depends on the number of consecutive VCO
output cycles within the respective timeframe. The VCO output clock is divided by the
output prescaler K2 to generate the system clock signal fSYS. The number of VCO cycles
is K2 × T, where T is the number of consecutive fSYS cycles (TCS).
The maximum accumulated jitter (long-term jitter) DTmax is defined by:
DTmax [ns] = ±(220 / (K2 × fSYS) + 4.3)
This maximum value is applicable, if either the number of clock cycles T > (fSYS / 1.2) or
the prescaler value K2 > 17.
In all other cases for a timeframe of T × TCS the accumulated jitter DT is determined by:
DT [ns] = DTmax × [(1 - 0.058 × K2) × (T - 1) / (0.83 × fSYS - 1) + 0.058 × K2]
fSYS in [MHz] in all formulas.
Example, for a period of 3 TCSs @ 33 MHz and K2 = 4:
Dmax = ±(220 / (4 × 33) + 4.3) = 5.97 ns (Not applicable directly in this case!)
D3 = 5.97 × [(1 - 0.058 × 4) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 4]
= 5.97 × [0.768 × 2 / 26.39 + 0.232]
= 1.7 ns
Example, for a period of 3 TCSs @ 33 MHz and K2 = 2:
Dmax = ±(220 / (2 × 33) + 4.3) = 7.63 ns (Not applicable directly in this case!)
D3 = 7.63 × [(1 - 0.058 × 2) × (3 - 1) / (0.83 × 33 - 1) + 0.058 × 2]
= 7.63 × [0.884 × 2 / 26.39 + 0.116]
= 1.4 ns
Data Sheet
78
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Acc. jitter DT
ns
±9
fSYS = 33 MHz fSYS = 66 MHz
fVCO = 66 MHz
±8
±7
f VCO = 132 MHz
±6
±5
±4
±3
±2
±1
Cycles T
0
1
20
40
60
80
100
MC_XC2X_JITTER
Figure 18
Approximated Accumulated PLL Jitter
Note: The specified PLL jitter values are valid if the capacitive load per pin does not
exceed CL = 20 pF.
The maximum peak-to-peak noise on the pad supply voltage (measured between
VDDPB pin and VSS pin) is limited to a peak-to-peak voltage of VPP = 50 mV. This
can be achieved by appropriate blocking of the supply voltage as close as possible
to the supply pins and using PCB supply and ground planes.
PLL frequency band selection
Different frequency bands can be selected for the VCO so that the operation of the PLL
can be adjusted to a wide range of input and output frequencies:
Data Sheet
79
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 28
System PLL Parameters
Parameter
Symbol
Values
Min.
VCO output frequency
4.7.2.2
Unit
Note /
Test Condition
Typ.
Max.
fVCO CC 50
−
110
MHz VCOSEL= 00B;
VCOmode=
controlled
10
−
40
MHz VCOSEL= 00B;
VCOmode= free
running
100
−
160
MHz VCOSEL= 01B;
VCOmode=
controlled
20
−
80
MHz VCOSEL= 01B;
VCOmode= free
running
Wakeup Clock
When wakeup operation is selected (SYSCON0.CLKSEL = 00B), the system clock is
derived from the low-frequency wakeup clock source:
fSYS = fWU.
In this mode, a basic functionality can be maintained without requiring an external clock
source and while minimizing the power consumption.
4.7.2.3
Selecting and Changing the Operating Frequency
When selecting a clock source and the clock generation method, the required
parameters must be carefully written to the respective bit fields, to avoid unintended
intermediate states.
Many applications change the frequency of the system clock (fSYS) during operation in
order to optimize system performance and power consumption. Changing the operating
frequency also changes the switching currents, which influences the power supply.
To ensure proper operation of the on-chip EVRs while they generate the core voltage,
the operating frequency shall only be changed in certain steps. This prevents overshoots
and undershoots of the supply voltage.
To avoid the indicated problems, recommended sequences are provided which ensure
the intended operation of the clock system interacting with the power system.
Please refer to the Programmer’s Guide.
Data Sheet
80
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.7.3
External Clock Input Parameters
These parameters specify the external clock generation for the XC2220U. The clock can
be generated in two ways:
•
•
By connecting a crystal or ceramic resonator to pins XTAL1/XTAL2.
By supplying an external clock signal. This clock signal can be supplied either to
pin XTAL1 (core voltage domain) or to pin CLKIN1 (IO voltage domain).
If connected to CLKIN1, the input signal must reach the defined input levels VIL and VIH.
If connected to XTAL1, a minimum amplitude VAX1 (peak-to-peak voltage) is sufficient for
the operation of the on-chip oscillator.
Note: The given clock timing parameters (t1 … t4) are only valid for an external clock
input signal.
Note: Operating Conditions apply.
Table 29
External Clock Input Characteristics
Parameter
Symbol
Values
Min.
Oscillator frequency
XTAL1 input current
absolute value
XTAL11)
fOSC SR 4
−
40
MHz Input= Clock
Signal
4
−
16
MHz Input= Crystal
or Resonator
−
−
20
μA
6
−
−
ns
6
−
−
ns
−
8
8
ns
−
8
8
ns
0.3 x
−
−
V
−
−
V
−
−
V
−
1.7
V
|IIL| CC
VDDIM
0.4 x
VDDIM
0.5 x
VDDIM
Input voltage range limits
for signal on XTAL1
Note /
Test Condition
Max.
t1 SR
Input clock low time
t2 SR
Input clock rise time
t3 SR
t4 SR
Input clock fall time
Input voltage amplitude on VAX1 SR
Input clock high time
Unit
Typ.
VIX1 SR -1.7 +
VDDIM
fOSC≥ 4 MHz;
fOSC≤ 16 MHz
fOSC≥ 16 MHz;
fOSC≤ 25 MHz
fOSC≥ 25 MHz;
fOSC≤ 40 MHz
2)
1) The amplitude voltage VAX1 refers to the offset voltage VOFF. This offset voltage must be stable during the
operation and the resulting voltage peaks must remain within the limits defined by VIX1.
Data Sheet
81
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
2) Overload conditions must not occur on pin XTAL1.
Note: For crystal/resonator operation, it is strongly recommended to measure the
oscillation allowance (negative resistance) in the final target system (layout) to
determine the optimum parameters for oscillator operation.
The manufacturers of crystals and ceramic resonators offer an oscillator
evaluation service. This evaluation checks the crystal/resonator specification
limits to ensure a reliable oscillatior operation.
t1
VOFF
t3
0.9 V AX1
0.1 V AX1
VAX1
t2
t4
tOSC = 1/fOSC
MC_ EXTCLOCK
Figure 19
External Clock Drive XTAL1
Data Sheet
82
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.7.4
Pad Properties
The output pad drivers of the XC2220U can operate in several user-selectable modes.
Strong driver mode allows controlling external components requiring higher currents
such as power bridges or LEDs. Reducing the driving power of an output pad reduces
electromagnetic emissions (EME). In strong driver mode, selecting a slower edge
reduces EME.
The dynamic behavior, i.e. the rise time and fall time, depends on the applied external
capacitance that must be charged and discharged. Timing values are given for a
capacitance of 20 pF, unless otherwise noted.
In general, the performance of a pad driver depends on the available supply voltage
VDDP. Therefore the following tables list the pad parameters for the upper voltage range
and the lower voltage range, respectively.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 30 is valid under the following conditions: VDDP≤ 5.5 V; VDDPtyp. 5 V; VDDP≥ 4.5 V
Table 30
Standard Pad Parameters for Upper Voltage Range
Parameter
Maximum output driver
current (absolute value)1)
Nominal output driver
current (absolute value)
Data Sheet
Symbol
IOmax
Values
Unit
Note /
Test Condition
3.0
mA
Driver_Strength
= Medium
−
5.0
mA
Driver_Strength
= Strong
−
−
0.5
mA
Driver_Strength
= Weak
−
−
1.0
mA
Driver_Strength
= Medium
−
−
1.6
mA
Driver_Strength
= Strong
−
−
0.25
mA
Driver_Strength
= Weak
Min.
Typ.
Max.
−
−
−
CC
IOnom
CC
83
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 30
Standard Pad Parameters for Upper Voltage Range (cont’d)
Parameter
Symbol
Rise and Fall times (10% - tRF CC
90%)
Values
Min.
Typ.
Max.
−
−
38 +
0.6 x
Unit
Note /
Test Condition
ns
CL≥ 20 pF;
CL≤ 100 pF;
CL
−
−
1+
0.45 x
Driver_Strength
= Medium
ns
CL
−
−
16 +
0.45 x
Driver_Strength
= Strong ;
Driver_Edge=
Soft
ns
CL
−
−
200 +
2.5 x
CL≥ 20 pF;
CL≤ 100 pF;
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Strong ;
Driver_Edge=
Slow
ns
CL
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Weak
1) The total output current that may be drawn at a given time must be limited to protect the supply rails from
damage. For any group of 16 neighboring output pins, the total output current in each direction (ΣIOL and ΣIOH) must remain below 25 mA.
Table 31
Standard Pad Parameters for Lower Voltage Range
Parameter
Symbol
Maximum output driver
current (absolute value)1)
IOmax
Data Sheet
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
−
−
1.8
mA
Driver_Strength
= Medium
−
−
3.0
mA
Driver_Strength
= Strong
−
−
0.3
mA
Driver_Strength
= Weak
CC
84
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 31
Standard Pad Parameters for Lower Voltage Range (cont’d)
Parameter
Nominal output driver
current (absolute value)
Symbol
IOnom
Values
Unit
Note /
Test Condition
0.8
mA
Driver_Strength
= Medium
−
1.0
mA
Driver_Strength
= Strong
−
−
0.15
mA
Driver_Strength
= Weak
−
−
73 +
0.85 x
ns
CL≥ 20 pF;
CL≤ 100 pF;
Min.
Typ.
Max.
−
−
−
CC
Rise and Fall times (10% - tRF CC
90%)
−
−
CL
Driver_Strength
= Medium
6 + 0.6 ns
x CL
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Strong ;
Driver_Edge=
Soft
−
−
33 +
0.6 x
ns
CL
−
−
385 +
3.25 x
CL
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Strong ;
Driver_Edge=
Slow
ns
CL≥ 20 pF;
CL≤ 100 pF;
Driver_Strength
= Weak
1) The total output current that may be drawn at a given time must be limited to protect the supply rails from
damage. For any group of 16 neighboring output pins, the total output current in each direction (ΣIOL and ΣIOH) must remain below 25 mA.
Data Sheet
85
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.7.5
Synchronous Serial Interface Timing
The following parameters are applicable for a USIC channel operated in SSC mode.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 32
is valid under the following conditions: CL= 20 pF; SSC= master ;
voltage_range= upper
Table 32
USIC SSC Master Mode Timing for Upper Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
tSYS -
−
−
ns
Slave select output SELO t1 CC
active to first SCLKOUT
transmit edge
81)
Slave select output SELO t2 CC
inactive after last
SCLKOUT receive edge
tSYS -
−
−
ns
61)
t3 CC
-6
−
9
ns
Receive data input setup t4 SR
time to SCLKOUT receive
edge
31
−
−
ns
t5 SR
-4
−
−
ns
Data output DOUT valid
time
Data input DX0 hold time
from SCLKOUT receive
edge
Note /
Test Condition
1) tSYS = 1 / fSYS
Data Sheet
86
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 33
is valid under the following conditions: CL= 20 pF; SSC= master ;
voltage_range= lower
Table 33
USIC SSC Master Mode Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
tSYS -
−
−
ns
tSYS -
−
−
ns
t3 CC
-7
−
11
ns
Receive data input setup t4 SR
time to SCLKOUT receive
edge
40
−
−
ns
t5 SR
-5
−
−
ns
Slave select output SELO t1 CC
active to first SCLKOUT
transmit edge
101)
Slave select output SELO t2 CC
inactive after last
SCLKOUT receive edge
91)
Data output DOUT valid
time
Data input DX0 hold time
from SCLKOUT receive
edge
Note /
Test Condition
1) tSYS = 1 / fSYS
Table 34
is valid under the following conditions: CL= 20 pF; SSC= slave ;
voltage_range= upper
Table 34
USIC SSC Slave Mode Timing for Upper Voltage Range
Parameter
Symbol
Select input DX2 setup to
first clock input DX1
transmit edge1)
t10 SR
Values
Unit
Min.
Typ.
Max.
10
−
−
ns
Select input DX2 hold after t11 SR
last clock input DX1
receive edge1)
7
−
−
ns
t12 SR
7
−
−
ns
Receive data input setup
time to shift clock receive
edge1)
Data Sheet
87
Note /
Test Condition
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 34
USIC SSC Slave Mode Timing for Upper Voltage Range (cont’d)
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR
5
−
−
ns
Data output DOUT valid
time
t14 CC
7
−
33
ns
Note /
Test Condition
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Table 35
is valid under the following conditions: CL= 20 pF; SSC= slave ;
voltage_range= lower
Table 35
USIC SSC Slave Mode Timing for Lower Voltage Range
Parameter
Symbol
Values
Unit
Min.
Typ.
Max.
10
−
−
ns
Select input DX2 hold after t11 SR
last clock input DX1
receive edge1)
7
−
−
ns
Receive data input setup
time to shift clock receive
edge1)
t12 SR
7
−
−
ns
Data input DX0 hold time
from clock input DX1
receive edge1)
t13 SR
5
−
−
ns
Data output DOUT valid
time
t14 CC
8
−
41
ns
Select input DX2 setup to
first clock input DX1
transmit edge1)
t10 SR
Note /
Test Condition
1) These input timings are valid for asynchronous input signal handling of slave select input, shift clock input, and
receive data input (bits DXnCR.DSEN = 0).
Data Sheet
88
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Master Mode Timing
t1
Select Output
SELOx
t2
Inactive
Inactive
Active
Clock Output
SCLKOUT
Receive
Edge
First Transmit
Edge
t3
Last Receive
Edge
Transmit
Edge
t3
Data Output
DOUT
t4
Data Input
DX0
t4
t5
Data
valid
t5
Data
valid
Slave Mode Timing
t10
Select Input
DX2
Clock Input
DX1
t11
Active
Inactive
Receive
Edge
First Transmit
Edge
t12
Data Input
DX0
Inactive
t12
t13
Data
valid
t 14
Last Receive
Edge
Transmit
Edge
t 13
Data
valid
t14
Data Output
DOUT
Transmit Edge: with this clock edge, transmit data is shifted to transmit data output.
Receive Edge: with this clock edge, receive data at receive data input is latched
.
Drawn for BRGH .SCLKCFG = 00B. Also valid for for SCLKCFG = 01B with inverted SCLKOUT signal.
USIC_SSC_TMGX.VSD
Figure 20
USIC - SSC Master/Slave Mode Timing
Note: This timing diagram shows a standard configuration where the slave select signal
is low-active and the serial clock signal is not shifted and not inverted.
Data Sheet
89
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
4.7.6
Debug Interface Timing
The debugger can communicate with the XC2220U via 1-pin SPD interface, via the 2pin DAP interface or via the standard JTAG interface.
Debug via DAP
The following parameters are applicable for communication through the DAP debug
interface.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 36 is valid under the following conditions: CL= 20 pF; voltage_range= upper
Table 36
DAP Interface Timing for Upper Voltage Range
Parameter
DAP0 clock period
DAP0 high time
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
Symbol
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
1001)
−
−
ns
8
−
−
ns
8
−
−
ns
−
−
4
ns
−
−
4
ns
6
−
−
ns
pad_type= stan
dard
DAP1 hold after DAP0
rising edge
t17 SR
6
−
−
ns
pad_type= stan
dard
DAP1 valid per DAP0
clock period2)
t19 CC
92
95
−
ns
pad_type= stan
dard
1) The debug interface cannot operate faster than the overall system, therefore t11 ≥ tSYS.
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
Data Sheet
90
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 37 is valid under the following conditions: CL= 20 pF; voltage_range= lower
Table 37
DAP Interface Timing for Lower Voltage Range
Parameter
Symbol
Values
Min.
t11 SR
t12 SR
t13 SR
t14 SR
t15 SR
t16 SR
DAP0 clock period
DAP0 high time
DAP0 low time
DAP0 clock rise time
DAP0 clock fall time
DAP1 setup to DAP0
rising edge
Unit
Typ.
Max.
100
−
−
ns
8
−
−
ns
1)
Note /
Test Condition
8
−
−
ns
−
−
4
ns
−
−
4
ns
6
−
−
ns
pad_type= stan
dard
DAP1 hold after DAP0
rising edge
t17 SR
6
−
−
ns
pad_type= stan
dard
DAP1 valid per DAP0
clock period2)
t19 CC
87
92
−
ns
pad_type= stan
dard
1) The debug interface cannot operate faster than the overall system, therefore t11 ≥ tSYS.
2) The Host has to find a suitable sampling point by analyzing the sync telegram response.
t 11
0.9 VDDP
0.5 VDDP
t15
t12
t 14
0.1 VDDP
t13
MC_DAP0
Figure 21
Data Sheet
Test Clock Timing (DAP0)
91
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
DAP0
t1 6
t1 7
DAP1
MC_ DAP1_RX
Figure 22
DAP Timing Host to Device
t1 1
DAP1
t1 9
MC_ DAP1_TX
Figure 23
DAP Timing Device to Host
Note: The transmission timing is determined by the receiving debugger by evaluating the
sync-request synchronization pattern telegram.
Data Sheet
92
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Debug via JTAG
The following parameters are applicable for communication through the JTAG debug
interface. The JTAG module is fully compliant with IEEE1149.1-2000.
Note: These parameters are not subject to production test but verified by design and/or
characterization.
Note: Operating Conditions apply.
Table 38 is valid under the following conditions: CL= 20 pF; voltage_range= upper
Table 38
JTAG Interface Timing for Upper Voltage Range
Parameter
Symbol
TCK clock period
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
t7 SR
Values
Unit
Min.
Typ.
Max.
1001)
−
−
ns
16
−
−
ns
16
−
−
ns
−
−
8
ns
−
−
8
ns
6
−
−
ns
6
−
−
ns
TDO valid from TCK falling t8 CC
edge (propagation delay)3)
−
29
32
ns
TDO high impedance to
valid output from TCK
falling edge4)3)
t9 CC
−
29
32
ns
TDO valid output to high
impedance from TCK
falling edge3)
t10 CC
−
29
32
ns
TDO hold after TCK falling t18 CC
edge3)
5
−
−
ns
TCK high time
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup to TCK
rising edge
TDI/TMS hold after TCK
rising edge
Note /
Test Condition
2)
1) The debug interface cannot operate faster than the overall system, therefore t1 ≥ tSYS.
2) Under typical conditions, the JTAG interface can operate at transfer rates up to 10 MHz.
3) The falling edge on TCK is used to generate the TDO timing.
4) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
93
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Table 39 is valid under the following conditions: CL= 20 pF; voltage_range= lower
Table 39
JTAG Interface Timing for Lower Voltage Range
Parameter
Symbol
Values
Min.
TCK clock period
TCK high time
t1 SR
t2 SR
t3 SR
t4 SR
t5 SR
t6 SR
Unit
Typ.
Max.
−
−
ns
16
−
−
ns
100
1)
16
−
−
ns
−
−
8
ns
−
−
8
ns
6
−
−
ns
t7 SR
6
−
−
ns
TDO valid from TCK falling t8 CC
edge (propagation delay)2)
−
39
43
ns
TDO high impedance to
valid output from TCK
falling edge3)2)
t9 CC
−
39
43
ns
TDO valid output to high
impedance from TCK
falling edge2)
t10 CC
−
39
43
ns
TDO hold after TCK falling t18 CC
edge2)
5
−
−
ns
TCK low time
TCK clock rise time
TCK clock fall time
TDI/TMS setup to TCK
rising edge
TDI/TMS hold after TCK
rising edge
Note /
Test Condition
1) The debug interface cannot operate faster than the overall system, therefore t1 ≥ tSYS.
2) The falling edge on TCK is used to generate the TDO timing.
3) The setup time for TDO is given implicitly by the TCK cycle time.
Data Sheet
94
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
t1
0.9 VD D P
0.5 VDD P
t5
t2
0.1 VD D P
t4
t3
MC_ JTAG_ TCK
Figure 24
Test Clock Timing (TCK)
TCK
t6
t7
t6
t7
TMS
TDI
t9
t8
t1 0
TDO
t18
MC_JTAG
Figure 25
Data Sheet
JTAG Timing
95
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Electrical Parameters
Debug via SPD
The SPD interface will work with standard SPD tools having a sample/output clock
frequency deviation of +/- 5% or less.
Note: For further details please refer to application note AP24004 in section SPD Timing
Requirements.
Note: Operating Conditions apply.
Data Sheet
96
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Package and Reliability
5
Package and Reliability
The XC2000 Family devices use the package type:
•
PG-VQFN (Plastic Green - Very Thin Profile Quad Flat Non-Leaded Package)
The following specifications must be regarded to ensure proper integration of the
XC2220U in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Table 40
Package Parameters (PG-VQFN-48-54)
Parameter
Symbol
Limit Values
Min.
Exposed Pad Dimension
Ex × Ey –
5.2 x 5.2
Power Dissipation
PDISS
RΘJA
–
–
Thermal resistance
Junction-Ambient
Unit Notes
Max.
mm
–
0.6
W
–
75
K/W No thermal via,
2-layer1)
51
K/W No thermal via,
4-layer2)
46
K/W 4-layer, no pad3)
36
K/W 4-layer, pad4)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) without thermal vias; exposed pad not
soldered.
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) without thermal vias; exposed pad not
soldered.
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
4) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC2220U is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
differences between packages of the same pin-count but for different device types. In
Data Sheet
97
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Package and Reliability
particular, the size of the Exposed Pad (if present) may vary.
If different device types are considered or planned for an application, it must be ensured
that the board layout fits all packages under consideration.
Package Outlines
0.9 MAX.
(0.65)
0.5
0.4 x 45˚
Index Marking
24
3
0.0
5±
(0.2)
0.05 MAX.
(6.2)
48
13
12
0.1
C
37
6
48x
0.08
36
25
(5.2)
0.5
+0.03
0.2
6.8
7 ±0.1
B
SEATING PLANE
6.8
11 x 0.5 = 5.5
0.4 ±0.07
A
11 x 0.5 = 5.5
7 ±0.1
1
0.23 ±0.05
(5.2)
Index Marking
48x
0.1 M A B C
(6.2)
PG-VQFN-48-15, -19, -20, -22, -24, -48, -51, -52, -53, -55, -56-PO V12
Figure 26
PG-VQFN-48-54 (Plastic Green Thin Quad Flat Package)
All dimensions in mm.
You can find complete information about Infineon packages, packing and marking in our
Infineon Internet Page “Packages”: http://www.infineon.com/packages
Data Sheet
98
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Package and Reliability
5.2
Thermal Considerations
When operating the XC2220U in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (PINT + PIOSTAT + PIODYN) × RΘJA
The internal power consumption is defined as
PINT = VDDP × IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
PIOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
The dynamic external power consumption caused by the output drivers (PIODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
•
•
•
•
Reduce VDDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
Data Sheet
99
V1.2, 2012-07
XC2220U
XC2000 Family / Compact Line
Package and Reliability
5.3
Quality Declarations
The operation lifetime of the XC2220U depends on the applied temperature profile in
application. For a typical example, please refer to Table 42; for other profiles, please
contact your Infineon counterpart to calculate the specific lifetime within your application.
Table 41
Quality Parameters
Parameter
Symbol
Operation lifetime
Table 42
Unit
Note /
Test Condition
20
a
See Table 42
and Table 43
−
2000
V
EIA/JESD22A114-B
−
3
−
JEDEC
J-STD-020C
Typ.
Max.
−
−
−
MSL CC −
tOP CC
ESD susceptibility
VHBM
according to Human Body SR
Model (HBM)
Moisture sensitivity level
Values
Min.
Typical Usage Temperature Profile
Operating Time
(Sum = 20 years)
Operating Temperature
Notes
1200 h
TJ = 150°C
TJ = 125°C
TJ = 110°C
TJ = 100°C
TJ = 0…10°C, …,
Normal operation
3600 h
7200 h
12000 h
7 × 21600 h
Normal operation
Normal operation
Normal operation
Power reduction
60…70°C
Table 43
Long Time Maximum Storage Temperature Profile
Operating Time
(Sum = 20 years)
Operating Temperature
Notes
2000 h
TJ = 150°C
TJ = 125°C
TJ = 110°C
TJ ≤ 150°C
Normal operation
16000 h
6000 h
151200 h
Data Sheet
Normal operation
Normal operation
No operation
100
V1.2, 2012-07
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