INTERSIL ISL81485

ISL81485
®
Data Sheet
December 2003
FN6061
5V, 30Mbps, RS-485/RS-422 Transceiver
Features
The Intersil ISL81485 is a BiCMOS, 5V powered, single
transceiver that meets both the RS-485 and RS-422
standards for balanced communication, and features a
larger output voltage and higher data rate to benefit high
speed applications.
• Specified for 10% Tolerance Supplies
Unlike competitive devices, this Intersil transceiver is
specified for 10% tolerance supplies (4.5V to 5.5V), and it
delivers a much larger worst case differential output voltage
(2.0V compared to the typical 1.5V) over the full supply
range. The increased output voltage translates into longer
reach, or better data integrity, at the 30Mbps data rate.
• One Unit Load Allows up to 32 Devices on the Bus
• Large Differential Output Voltage. . . . 2.0V(min.) into 54Ω
• Drop-In Replacement for the ADM1485
• Low Quiescent Current . . . . . . . . . . . . . . . . . . . . . 800µA
• -7V to +12V Common Mode Input Voltage Range
• Three State Rx and Tx Outputs
• 15ns (Max) Propagation Delays, 5ns (Max) Skew
This device presents a “1 unit load” to the RS-485 bus,
which allows up to 32 transceivers on the network.
• Operates from a Single +5V Supply (10% Tolerance)
• Current Limiting and Thermal Shutdown for driver
Overload Protection
Receiver (Rx) inputs feature a “fail-safe if open” design,
which ensures a logic high Rx output if Rx inputs are
floating.
Applications
Driver (Tx) outputs are short circuit protected, even for
voltages exceeding the power supply voltage. Additionally,
on-chip thermal shutdown circuitry disables the Tx outputs to
prevent damage if power dissipation becomes excessive.
Ordering Information
PART NO.
(BRAND)
• High Data Rates. . . . . . . . . . . . . . . . . . . . . up to 30Mbps
• SCSI “Fast 20” Drivers and Receivers
• Factory Automation
• Field Bus Networks
• Security Networks
• Building Environmental Control Systems
TEMP.
RANGE (oC)
PACKAGE
PKG. DWG. #
ISL81485IB
(81485IB)
-40 to 85
8 Ld SOIC
M8.15
ISL81485IB-T
(81485IB)
-40 to 85
8 Ld SOIC
(Tape and Reel)
M8.15
ISL81485IU
(1485)
-40 to 85
8 Ld MSOP
M8.118
ISL81485IU-T
(1485)
-40 to 85
8 Ld MSOP
(Tape and Reel)
M8.118
• Industrial/Process Control Networks
Pinout
ISL81485 (SOIC, MSOP)
TOP VIEW
RO 1
8
VCC
RE 2
7
B/Z
DE 3
6
A/Y
5
GND
DI 4
1
R
D
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL81485
Truth Table
Truth Table
TRANSMITTING
RECEIVING
INPUTS
OUTPUTS
INPUTS
OUTPUT
RE
DE
DI
B/Z
A/Y
RE
DE
A-B
RO
X
1
1
0
1
0
0
≥ +0.2V
1
X
1
0
1
0
0
0
≤ -0.2V
0
X
0
X
High-Z
High-Z
0
0
Inputs Open
1
1
X
X
High-Z
Pin Descriptions
PIN
FUNCTION
RO
Receiver output: If A > B by at least 0.2V, RO is high; If A < B by 0.2V or more, RO is low; RO = High if A and B are unconnected (floating).
RE
Receiver output enable. RO is enabled when RE is low; RO is high impedance when RE is high.
DE
Driver output enable. The driver outputs, Y and Z, are enabled by bringing DE high. They are high impedance when DE is low.
DI
Driver input. A low on DI forces output Y low and output Z high. Similarly, a high on DI forces output Y high and output Z low.
GND
Ground connection.
A/Y
RS-485/422 level, noninverting receiver input and noninverting driver output. Pin is an input (A) if DE = 0; pin is an output (Y) if DE = 1.
B/Z
RS-485/422 level, inverting receiver input and inverting driver output. Pin is an input (B) if DE = 0; pin is an output (Z) if DE = 1.
VCC
System power supply input (4.5V to 5.5V).
Typical Operating Circuit
ISL81485
+5v
+5v
+
8
0.1µF
0.1µF
+
8
VCC
1 RO
VCC
R
D
2 RE
B/Z 7
3 DE
A/Y 6
4 DI
RT
RT
7 B/Z
DE 3
6 A/Y
RE 2
R
D
GND
GND
5
5
2
DI 4
RO 1
ISL81485
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7V
Input Voltages
DI, DE, RE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Input / Output Voltages
A/Y, B/Z . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -8V to +12.5V
RO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to (VCC +0.5V)
Short Circuit Duration
Y, Z. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
Thermal Resistance (Typical, Note 1)
θJA (oC/W)
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
105
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
140
Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL81485IX. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25oC,
Note 2
Electrical Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
TEMP
(oC)
MIN
TYP
MAX
UNITS
Full
-
-
VCC
V
Full
2.5
3
-
V
DC CHARACTERISTICS
Driver Differential VOUT (no load)
VOD1
Driver Differential VOUT (with load)
VOD2
Change in Magnitude of Driver
Differential VOUT for
Complementary Output States
Driver Common-Mode VOUT
Change in Magnitude of Driver
Common-Mode VOUT for
Complementary Output States
R = 50Ω (RS-422) (Figure 1A)
R = 27Ω (RS-485) (Figure 1A)
Full
2
2.5
5
V
RD = 60Ω, -7V ≤ VCM ≤ 12V (Figure 1B)
Full
1.5
-
-
V
∆VOD
R = 27Ω or 50Ω (Figure 1A)
Full
-
0.01
0.2
V
VOC
R = 27Ω or 50Ω (Figure 1A)
Full
-
-
3
V
∆VOC
R = 27Ω or 50Ω (Figure 1A)
Full
-
0.01
0.2
V
Logic Input High Voltage
VIH
DE, DI, RE
Full
2
-
-
V
Logic Input Low Voltage
VIL
DE, DI, RE
Full
-
-
0.8
V
Logic Input Current
IIN1
DE, DI, RE
Full
-1
-
1
µA
Input Current (A/Y, B/Z) (Note 5)
IIN2
DE = 0V, VCC = 0V or
4.5 to 5.5V
Receiver Differential Threshold
Voltage
VTH
VIN = 12V
Full
-
-
1
mA
VIN = -7V
Full
-0.8
-
-
mA
-7V ≤ VCM ≤ 12V
Full
-0.2
-
0.2
V
Receiver Input Hysteresis
∆VTH
VCM = 0V
25
-
40
-
mV
Receiver Output High Voltage
VOH
IO = -4mA, VID = 200mV
Full
4
-
-
V
Receiver Output Low Voltage
VOL
IO = -4mA, VID = 200mV
Full
-
-
0.4
V
Three-State (high impedance)
Receiver Output Current
IOZR
0.4V ≤ VO ≤ 2.4V
Full
-
-
±1
µA
Receiver Input Resistance
RIN
-7V ≤ VCM ≤ 12V
Full
12
-
-
kΩ
No-Load Supply Current, Note 3
ICC
DI, RE = 0V or VCC
DE = VCC
Full
-
1
2.2
mA
DE = 0V
Full
-
0.8
1
mA
Full
60
-
250
mA
Driver Short-Circuit Current,
VO = High or Low
IOSD1
3
DE = VCC, -7V ≤ VY or VZ ≤ 12V (Note 4)
ISL81485
Test Conditions: VCC = 4.5V to 5.5V; Unless Otherwise Specified. Typicals are at VCC = 5V, TA = 25oC,
Note 2 (Continued)
Electrical Specifications
PARAMETER
TEMP
(oC)
MIN
TYP
MAX
UNITS
Full
7
-
85
mA
tPLH, tPHL RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
2
9
15
ns
tSKEW
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
1
5
ns
tR, tF
RDIFF = 54Ω, CL = 100pF (Figure 2)
Full
-
5
15
ns
SYMBOL
Receiver Short-Circuit Current
TEST CONDITIONS
0V ≤ VO ≤ VCC
IOSR
SWITCHING CHARACTERISTICS
Driver Input to Output Prop Delay
Driver Prop Delay Skew
Driver Differential Rise or Fall Time
Driver Enable to Output High
tZH
CL = 50pF, SW = GND (Figure 3)
Full
-
9
25
ns
Driver Enable to Output Low
tZL
CL = 50pF, SW = VCC (Figure 3)
Full
-
9
25
ns
Matched Enable Switching
|tAZH - tBZL| or |tBZH - tAZL|
∆tEN
(Figure 3)
Full
-
1
3
ns
Driver Disable from Output High
tHZ
CL = 50pF, SW = GND (Figure 3)
Full
-
9
25
ns
Driver Disable from Output Low
tLZ
CL = 50pF, SW = VCC (Figure 3)
Full
-
9
25
ns
Matched Disable Switching
|tAHZ - tBLZ| or |tBHZ - tALZ|
∆tDIS
(Figure 3)
Full
-
2
5
ns
Driver Maximum Data Rate
fMAXD
|VOD| ≥ 1.5V (Figure 4)
Full
30
-
-
Mbps
tPLH, tPHL (Figure 5)
Full
8
17
30
ns
(Figure 5)
Full
-
1
5
ns
Receiver Input to Output Prop
Delay
Receiver Prop Delay Skew
| tPLH - tPHL |
tSKD
Receiver Enable to Output High
tZH
CL = 15pF, SW = GND (Figure 6)
Full
-
7
20
ns
Receiver Enable to Output Low
tZL
CL = 15pF, SW = VCC (Figure 6)
Full
-
7
20
ns
Receiver Disable from Output High
tHZ
CL = 15pF, SW = GND (Figure 6)
Full
-
7
20
ns
tLZ
CL = 15pF, SW = VCC (Figure 6)
Full
-
7
20
ns
CL = 15pF, VID ≥ 1.5V, RO tH and tL ≥ 20ns
Full
30
-
-
Mbps
Receiver Disable from Output Low
Receiver Maximum Data Rate
fMAXR
NOTES:
2. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to device ground unless
otherwise specified.
3. Supply current specification is valid for loaded drivers when DE = 0V.
4. Applies to peak current. See “Typical Performance Curves” for more information.
5. Devices meeting these limits are denoted as “1 unit load (UL)” transceivers. The RS-485 standard allows up to 32 Unit Loads on the bus, so a
1UL transceiver permits > 32 devices on the bus.
Test Circuits and Waveforms
R
VCC
375Ω
DE
VCC
Z
DI
Z
DI
VOD
D
DE
Y
Y
R
FIGURE 1A. VOD AND VOC
VOC
RD = 60Ω
-7V to +12V
375Ω
FIGURE 1B. VOD WITH COMMON MODE LOAD
FIGURE 1. DC DRIVER TEST CIRCUITS
4
VCM
VOD
D
ISL81485
Test Circuits and Waveforms (Continued)
3V
DI
1.5V
1.5V
0V
tPHL
tPLH
VOH
VCC
CL = 100pF
DE
50%
OUT (Y)
50%
VOL
Z
DI
tPHL
RDIFF
D
Y
tPLH
VOH
CL = 100pF
OUT (Z)
50%
SIGNAL
GENERATOR
50%
VOL
90%
DIFF OUT (Y - Z)
+VOD
90%
10%
10%
tR
-VOD
tF
SKEW = |CROSSING PT. OF Y↑ & Z↓ - CROSSING PT. OF Y↓ & Z↑|
FIGURE 2A. TEST CIRCUIT
FIGURE 2B. MEASUREMENT POINTS
FIGURE 2. DRIVER PROPAGATION DELAY AND DIFFERENTIAL TRANSITION TIMES
DE
3V
Z
DI
110Ω
VCC
D
SIGNAL
GENERATOR
SW
Y
DE
1.5V
1.5V
0V
GND
CL
tZH
tHZ
OUTPUT HIGH
VOH - 0.5V
OUT (Y, Z)
PARAMETER OUTPUT
RE
DI
SW
CL (pF)
tHZ
Y/Z
X
1/0
GND
50
tLZ
Y/Z
X
0/1
VCC
50
tZH
Y/Z
X
1/0
GND
50
tZL
Y/Z
X
0/1
VCC
50
VOH
2.3V
0V
tZL
tLZ
VCC
OUT (Y, Z)
2.3V
OUTPUT LOW
FIGURE 3A. TEST CIRCUIT
VOL + 0.5V V
OL
FIGURE 3B. MEASUREMENT POINTS
FIGURE 3. DRIVER ENABLE AND DISABLE TIMES
VCC
CL = 100pF
DE
3V
Z
DI
DI
RDIFF
D
Y
0V
CL = 100pF
SIGNAL
GENERATOR
+VOD
DIFF OUT (Y - Z)
-VOD
FIGURE 4A. TEST CIRCUIT
FIGURE 4B. MEASUREMENT POINTS
FIGURE 4. DRIVER DATA RATE
5
0V
ISL81485
Test Circuits and Waveforms (Continued)
RE
3V
15pF
B
+1.5V
R
A
A
1.5V
RO
1.5V
0V
tPLH
tPHL
VCC
SIGNAL
GENERATOR
50%
RO
50%
0V
FIGURE 5A. TEST CIRCUIT
FIGURE 5B. MEASUREMENT POINTS
FIGURE 5. RECEIVER PROPAGATION DELAY
3V
RE
RE
B
SIGNAL
GENERATOR
1kΩ
RO
R
1.5V
VCC
SW
A
1.5V
0V
GND
tZH
15pF
tHZ
OUTPUT HIGH
VOH - 0.5V
RO
VOH
1.5V
0V
PARAMETER
DE
A
SW
tHZ
0
+1.5V
GND
tLZ
0
-1.5V
VCC
tZH
0
+1.5V
GND
tZL
0
-1.5V
VCC
FIGURE 6A. TEST CIRCUIT
tZL
tLZ
VCC
RO
1.5V
OUTPUT LOW
VOL + 0.5V V
OL
FIGURE 6B. MEASUREMENT POINTS
FIGURE 6. RECEIVER ENABLE AND DISABLE TIMES
Application Information
Receiver Features
RS-485 and RS-422 are differential (balanced) data
transmission standards for use in long haul or noisy
environments. RS-422 is a subset of RS-485, so RS-485
transceivers are also RS-422 compliant. RS-422 is a pointto-multipoint (multidrop) standard, which allows only one
driver and up to 10 (assuming one unit load devices)
receivers on each bus. RS-485 is a true multipoint standard,
which allows up to 32 one unit load devices (any
combination of drivers and receivers) on each bus. To allow
for multipoint operation, the RS-485 spec requires that
drivers must handle bus contention without sustaining any
damage.
This device utilizes a differential input receiver for maximum
noise immunity and common mode rejection. Input sensitivity
is ±200mV, as required by the RS422 and RS-485
specifications.
Another important advantage of RS-485 is the extended
common mode range (CMR), which specifies that the driver
outputs and receiver inputs withstand signals that range
from +12V to -7V. RS-422 and RS-485 are intended for runs
as long as 4000’, so the wide CMR is necessary to handle
ground potential differences, as well as voltages induced in
the cable by external fields.
The receiver includes a “fail-safe if open” function that
guarantees a high level receiver output if the receiver inputs
are unconnected (floating).
6
Receiver input resistance surpasses the RS-422 spec of
4kΩ, and meets the RS-485 “Unit Load” requirement of
12kΩ minimum, thereby allowing up to 32 devices on a bus.
Receiver inputs function with common mode voltages as
great as 7V outside the power supplies (i.e., +12V and -7V),
making them ideal for long networks, or industrial
applications, where induced voltages are a definite concern.
The receiver easily meets the data rate supported by the
driver, and receiver outputs are three-statable via the active
low RE input.
ISL81485
Driver Features
The RS-485, RS-422 driver is a differential output device
that delivers at least 2V across a 54Ω load (RS-485), and at
least 2.5V across a 100Ω load (RS-422) even with
VCC = 4.5V. The drivers feature low propagation delay skew
to maximize bit width, and to minimize EMI.
The driver is three-statable via the active high DE input.
Outputs of the driver are not slew rate limited, so faster
output transition times allow data rates of at least 30Mbps.
Data Rate, Cables, and Terminations
RS-485/RS-422 are intended for network lengths up to
4000’, but the maximum system data rate decreases as the
transmission length increases. Devices operating at 30Mbps
usually are limited to lengths of a couple hundred feet, but
the larger differential output voltage of this transceiver allows
that distance to be pushed past 350’. Figure 7 illustrates the
30Mbps performance of the ISL81485 driving 350’ of CAT5
cable, terminated in 120Ω at both the driver and receiver
ends. As shown, the differential signal (A-B) delivered to the
receiver inputs at the end of the cable is still greater than
1.5V (i.e., 7.5 times the required Rx sensitivity). Thus, even
longer cables can be driven if lower noise margins are
acceptable.
Twisted pair is the cable of choice for RS-485, RS-422
networks. Twisted pair cables tend to pick up noise and
other electromagnetically induced voltages as common
mode signals, which are effectively rejected by the
differential receivers in these ICs.
0
DRIVER INPUT (V)
5
RO
0
DRIVER+CABLE DELAY
As stated previously, the RS-485 spec requires that drivers
survive worst case bus contentions undamaged. The
ISL81485 meets this requirement via driver output short
circuit current limits, and on-chip thermal shutdown circuitry.
The driver output stages incorporate short circuit current
limiting circuitry which ensures that the output current never
exceeds the RS-485 spec, even at the common mode
voltage range extremes.
In the event of a major short circuit condition, the device also
includes a thermal shutdown feature that disables the drivers
whenever the die temperature becomes excessive. This
eliminates the power dissipation, allowing the die to cool.
The drivers automatically reenable after the die temperature
drops about 15 degrees. If the contention persists, the
thermal shutdown/reenable cycle repeats until the fault is
cleared. Receivers stay operational during thermal
shutdown.
VCC = 5V, TA = 25oC; Unless Otherwise Specified
DI = 30Mbps
5
Built-In Driver Overload Protection
(~490ns)
3
1.5
OUTPUT CURRENT (mA)
RECEIVER INPUT (V)
RECEIVER OUTPUT (V)
Typical Performance Curves
Proper termination is imperative, when using a 30Mbps
device, to minimize reflections. In point-to-point, or point-tomultipoint (single driver on bus) networks, the main cable
should be terminated in its characteristic impedance
(typically 120Ω) at the end farthest from the driver. In multireceiver applications, stubs connecting receivers to the main
cable should be kept as short as possible. Multipoint (multidriver) systems require that the main cable be terminated in
its characteristic impedance at both ends. Stubs connecting
a transceiver to the main cable should be kept as short as
possible.
160
140
120
100
80
60
40
20
0
-20
-40
Y OR Z = LOW
Y OR
OR ZZ == HIGH
HIGH
Y
-60
-80
-100
-120
-140
A-B
0
-1.5
-3
-160
TIME (20ns/DIV)
FIGURE 7. DRIVER AND RECEIVER WAVEFORMS DRIVING
350 FEET (107 METERS) OF CAT5 CABLE
(DOUBLE TERMINATED WITH 120Ω)
7
-7 -6
-4
-2
0
2
4
6
OUTPUT VOLTAGE (V)
8
10
12
FIGURE 8. DRIVER OUTPUT CURRENT vs SHORT CIRCUIT
VOLTAGE
ISL81485
Typical Performance Curves
VCC = 5V, TA = 25oC; Unless Otherwise Specified (Continued)
4
DIFFERENTIAL OUTPUT VOLTAGE (V)
DRIVER OUTPUT CURRENT (mA)
120
100
80
60
40
20
0
0
1
2
3
4
DIFFERENTIAL OUTPUT VOLTAGE (V)
3.8
3.6
3.4
3.2
RDIFF = 54Ω
3
2.8
-40
5
0
-25
25
50
85
75
TEMPERATURE (oC)
FIGURE 9. DRIVER OUTPUT CURRENT vs DIFFERENTIAL
OUTPUT VOLTAGE
FIGURE 10. DRIVER DIFFERENTIAL OUTPUT VOLTAGE vs
TEMPERATURE
12
3
RDIFF = 54Ω
RDIFF = 54Ω
2.5
11
|tPHL(Y or Z) - tPLH(Y or Z)| = PW Distortion
tPLHZ
tPLHY
2
10
SKEW (ns)
PROPAGATION DELAY (ns)
RDIFF = 100Ω
9
tPHLY
1.5
|tPHLY - tPLHZ| or |tPLHY - tPHLZ|
1
tPHLZ
8
0.5
-25
0
25
50
0
-40
85
75
TEMPERATURE (oC)
0
5
RO
0
5
4
3
A/Y
2
1
RECEIVER OUTPUT (V)
5
DRIVER INPUT (V)
RDIFF = 54Ω, CL = 15pF
DI
B/Z
0
TIME (10ns/DIV)
FIGURE 13. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH
8
0
25
TEMPERATURE (oC)
50
85
75
FIGURE 12. DRIVER SKEW AND PULSE DISTORTION vs
TEMPERATURE
DRIVER OUTPUT (V)
DRIVER OUTPUT (V)
RECEIVER OUTPUT (V)
FIGURE 11. DRIVER PROPAGATION DELAY vs
TEMPERATURE
-25
RDIFF = 54Ω, CL = 15pF
5
DI
0
5
RO
0
5
4
3
B/Z
2
1
A/Y
0
TIME (10ns/DIV)
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW
DRIVER INPUT (V)
7
-40
ISL81485
Typical Performance Curves
VCC = 5V, TA = 25oC; Unless Otherwise Specified (Continued)
950
DE = VCC, RE = X
900
ICC (µA)
850
800
DE = GND, RE = X
750
700
-40
-25
0
25
50
75
TEMPERATURE (oC)
FIGURE 15. SUPPLY CURRENT vs TEMPERATURE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
528
PROCESS:
Si Gate BiCMOS
9
85
ISL81485
Mini Small Outline Plastic Packages (MSOP)
N
M8.118 (JEDEC MO-187AA)
8 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE
E1
INCHES
E
-B-
INDEX
AREA
1 2
0.20 (0.008)
A B C
TOP VIEW
4X θ
0.25
(0.010)
R1
R
GAUGE
PLANE
SEATING
PLANE -CA
4X θ
A2
A1
b
-H-
0.10 (0.004)
L
SEATING
PLANE
C
MAX
MIN
MAX
NOTES
0.037
0.043
0.94
1.10
-
A1
0.002
0.006
0.05
0.15
-
A2
0.030
0.037
0.75
0.95
-
b
0.010
0.014
0.25
0.36
9
c
0.004
0.008
0.09
0.20
-
D
0.116
0.120
2.95
3.05
3
E1
0.116
0.120
2.95
3.05
4
0.026 BSC
0.20 (0.008)
C
C
a
SIDE VIEW
CL
E1
0.20 (0.008)
C D
-B-
END VIEW
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-187BA.
2. Dimensioning and tolerancing per ANSI Y14.5M-1994.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs and are measured at Datum Plane. Mold flash, protrusion
and gate burrs shall not exceed 0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions
and are measured at Datum Plane. - H - Interlead flash and
protrusions shall not exceed 0.15mm (0.006 inch) per side.
5. Formed leads shall be planar with respect to one another within
0.10mm (0.004) at seating Plane.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
and - B - to be determined at Datum plane
11. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only.
10
0.65 BSC
-
E
0.187
0.199
4.75
5.05
-
L
0.016
0.028
0.40
0.70
6
0.037 REF
N
-A-
10. Datums -A -H- .
MIN
A
L1
e
D
SYMBOL
e
L1
MILLIMETERS
0.95 REF
8
R
0.003
R1
0
α
-
8
-
0.07
0.003
-
5o
15o
0o
6o
7
-
-
0.07
-
-
5o
15o
-
0o
6o
Rev. 2 01/03
ISL81485
Small Outline Plastic Packages (SOIC)
M8.15 (JEDEC MS-012-AA ISSUE C)
N
INDEX
AREA
0.25(0.010) M
H
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
B M
E
INCHES
-B-
1
2
SYMBOL
3
L
SEATING PLANE
-A-
h x 45o
A
D
-C-
µα
e
A1
B
0.25(0.010) M
C
C A M
B S
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
MILLIMETERS
MIN
MAX
NOTES
A
0.0532
0.0688
1.35
1.75
-
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
8o
0o
N
NOTES:
MAX
A1
e
0.10(0.004)
MIN
α
8
0o
8
7
8o
Rev. 0 12/93
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
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Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
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11