dsPIC30F6011A/6012A/6013A/6014A Migration Guidelines

dsPIC30F6011A/6012A/6013A/6014A Migration Guidelines
Note:
This device has been designed to perform to the parameters of its data sheet. It has been tested to an
electrical specification designed to determine its conformance with these parameters. Due to process
differences in the manufacture of this device, this device may have different performance characteristics
than its earlier version. These differences may cause this device to perform differently in your application
than the earlier version of this device.
Note:
The user should verify that the device oscillator starts and performs as expected. Adjusting the loading
capacitor values and/or the oscillator mode may be required.
GENERAL INFORMATION
CODE COMPATIBILITY
This document provides an overview of considerations
for migrating from dsPIC30F6011/6012/6013/6014
devices (referred to as dsPIC30F601x devices) to
dsPIC30F6011A/6012A/6013A/6014A
devices
(referred to as dsPIC30F601xA devices). If you are
undertaking this migration, it is recommended that you
download data sheets and errata documents on these
devices from www.microchip.com.
For the most part, dsPIC30F code developed with the
MPLAB® C30 C Compiler and MPLAB ASM30 Assembler is directly portable between the dsPIC30F601X
and dsPIC30F601xA devices. However, in some cases
small changes may be required depending on which
features have been enhanced. To migrate source code
to a dsPIC30F601xA device, perform these two steps:
Most errata for the dsPIC30F6011/6012/6013/6014
Rev. B2 silicon have been fixed in the dsPIC30F6011A/
6012A/6013A/6014A Rev. A2 silicon.
The specific device errata documents include:
• “dsPIC30F6011/6012/6013/6014 Rev. B2 Silicon
Errata” (DS80198)
• “dsPIC30F6011A/6012A/6013A/6014A Rev. A2
Silicon Errata” (DS80242)
1.
2.
Include the appropriate dsPIC30F601xA device
header (.h) and include (.inc) files in the
source code files.
Remove any work arounds implemented in
source code or MPLAB C30 command line
options for errata described in “dsPIC30F6011/
6012/6013/6014 Rev. B2 Silicon Errata”
(DS80198).
Appendix B of the “dsPIC30F6011A/6012A/6013A/
6014A Data Sheet” (DS70143) provides device
comparison summaries between dsPIC30F601X and
dsPIC30F601XA devices.
Appendix C of the “dsPIC30F6011A/6012A/6013A/
6014A Data Sheet” (DS70143) provides device
migration information between dsPIC30F601x and
dsPIC30F601xA devices.
Code developed for the dsPIC30F601x devices should
be directly portable to the dsPIC30F601xA devices,
with the exception of the DCI errata fix. See
“Peripherals” for more information.
© 2006 Microchip Technology Inc.
DS70176B-page 1
PERIPHERALS
OSCILLATOR OPERATION
The peripheral set for the dsPIC30F601x and
dsPIC30F601xA devices is the same. Some peripheral
changes have been made with regard to specific errata
fixes and additional features. No new peripheral
modules have been added.
The device oscillator feature set has been enhanced to
provide additional flexibility. New oscillator modes are
supported by using the respective dsPIC30F601xA
device header (.h), linker (.gld) and include (.inc)
files in the source code files.
The DCI codec interface peripheral has undergone a
specific errata fix that affects Slave mode operation
only. The work around called out in the “dsPIC30F6011/
6012/6013/6014 Rev. B2 Silicon Errata” (DS80198)
document, specifically item 12, is no longer required.
In addition, the internal Fast RC (FRC) oscillator tuning
bits have been moved from the OSCCON Special
Function Register (SFR) to the new OSCTUN SFR.
DS70176B-page 2
These oscillator modes have been added:
• HS/2 x4, x8 and x16 PLL
• HS/3 x4, x8 and x16 PLL
• FRC x4, x8 and x16 PLL
© 2006 Microchip Technology Inc.
ELECTRICAL CHARACTERISTICS
Table 1 presents a comparison of the operating MIPS
versus voltage between the dsPIC30F601x and
dsPIC30F601xA devices.
The dsPIC30F601x and dsPIC30F601xA devices are
designed using the same process technology. Therefore, the DC and AC electrical specifications yield the
consistent operational functionality. However, Run, Idle
and Sleep currents should slightly improve. Consult the
data sheets for further information.
TABLE 1:
OPERATING MIPS VS. VOLTAGE CHARACTERISTICS
Maximum MIPS
VDD Range
Temp Range
30F601XA-30I
30F601X-30I
30F601XA-20E
30F601X-20E
4.5-5.5V
-40°C to 85°C
30
30
—
—
4.5-5.5V
-40°C to 125°C
—
—
20
20
3.0-3.6V
-40°C to 85°C
20
15
—
—
3.0-3.6V
-40°C to 125°C
—
—
15
10
2.5-3.0V
-40°C to 85°C
10
7.5
—
—
© 2006 Microchip Technology Inc.
DS70176B-page 3
PACKAGE MIGRATION
CONSIDERATIONS
64-pin TQFP Package
Primary device programming pins, PGC and PGD, for
dsPIC30F6011A and dsPIC30F6012A devices have
been moved relative to the original pin locations on the
dsPIC30F6011 and dsPIC30F6012 devices. Pins PGC
and PGD are the only programming pins and support
In-Circuit Serial Programming™ (ICSP™).
Pins PGC and PGD were located on AN1/RB1 and
AN0/RB0, respectively, on the dsPIC30F6011 and
dsPIC30F6012 devices. These pins are now located on
AN6/RB6 and AN7/RB7, respectively, on the
dsPIC30F6011A and dsPIC30F6012A devices. The
customer must consider this change if existing signals
are interfaced on pins AN6/RB6 and AN7/RB7. Please
consult the “A” device pin diagrams and Appendix C of
the data sheet for additional information on this
change.
If a dsPIC30F6012A is to be used with a
dsPIC30F6012-based 64-pin Plug-in-Module (PIM),
the following minor modification is required to support
programming and debugging:
3.
4.
Jumper PGC pin between AN1/RB1 to
AN6/RB6
Jumper PGD pin between AN0/RB0 to
AN7/RB7
If analog or other circuit signals are present on the new
pins, some basic isolation is required to support
programming and debugging.
80-pin TQFP Package
No changes have been made to the primary programming pin locations, PGC and PGD, on the
dsPIC30F6013A and dsPIC30F6014A devices.
DS70176B-page 4
© 2006 Microchip Technology Inc.
DEVELOPMENT TOOLS AND
BOARDS
MPLAB IDE, MPLAB C30, MPLAB ICD 2 and MPLAB
PM3 tools support both the dsPIC30F601x and
dsPIC30F601xA devices.
MPLAB ICE 4000 supports both dsPIC30F601x and
dsPIC30F601xA devices. However, support for
dsPIC30F601xA devices must consider the operational
characteristics of “dsPIC30F6011/6012/6013/6014
Rev. B2 Silicon Errata” (DS80198).
Development boards supporting the dsPIC30F601x
devices fully support the new dsPIC30F601xA silicon.
Device support is handled with specific PIMs. PIMs to
support dsPIC30F6014A devices (Part No. MA300014)
can be ordered on http://microchipdirect.com/.
See Table 2 below for information on version support.
TABLE 2:
DEVELOPMENT TOOLS DEVICE SUPPORT
Device Support
Development Tools
MPLAB®
IDE
MPLAB C30
MPLAB ICD 2 Programmer/Debugger
dsPIC30F601xA
dsPIC30F601x
MPLAB IDE 7.21 or later
All current releases
MPLAB C30 1.32 or later
MPLAB C30 1.10 and later
Yes
Yes
MPLAB REAL ICE Emulator/Debugger
Yes
Yes
MPLAB PM 3 Device Programmer
Yes
Yes
MPLAB ICE 4000
Yes*
Yes
*
See qualification above for operational use of MPLAB ICE 4000 with dsPIC30F601X.
© 2006 Microchip Technology Inc.
DS70176B-page 5
MIGRATION PROCEDURE
Figure 1 illustrates a recommended process for
migrating from dsPIC30F601X to 601XA devices.
FIGURE 1:
RECOMMENDED MIGRATION PROCESS
Thoroughly Review
Reference Documents.
Are there new features that can enhance my application? See
Appendix B of “dsPIC30F6011A/6012A/6013A/6014A Data Sheet”
(DS70143) for device comparisons. See Appendix C of
“dsPIC30F6011A/6012A/6013A/6014A Data Sheet” (DS70143) for
device migration information.
Can I eliminate any software work arounds no longer needed?
Carefully review errata documents (see Reference Documents).
Determine Device
Pin Compatibility
To
Pin
Compatible
30F6011
30F6011A
No
Move PGC & PGD to Pins 17 & 18
30F6012
30F6012A
No
Move PGC & PGD to Pins 17 & 18
30F6013
30F6013A
Yes
None
30F6014
30F6014A
Yes
None
From
Hardware Modification Required
Modify pin connections, if necessary (see Table above).
Set Up
Hardware
Solder the “A” device onto the target board
1.
Recompile Software
using
MPLAB® IDE v7.21 (or later)
MPLAB C30 v1.32 (or later)
2.
3.
4.
Reconfigure workspace for “A” device
(MPLAB IDE>Configure>Select Device>dsPIC30F601XA)
Replace Device Header files and Linker scripts
(c:\Program Files\MPLAB C30\Support\)
Change device configuration bits
(MPLAB IDE>Configure>Configuration Bits)
Remove work arounds no longer needed with new “A” device
Reprogram Device,
Test and Run
Application
DS70176B-page 6
© 2006 Microchip Technology Inc.
APPLICATION LIBRARIES
All Advanced Application Libraries developed for the
dsPIC30F601x devices support the dsPIC30F601xA
devices.
REFERENCE DOCUMENTS
The following documents are available on our web site,
www.microchip.com, and are recommended reading:
• “dsPIC30F6011/6012/6013/6014 Data Sheet”
(DS70117)
• “dsPIC30F6011A/6012A/6013A/6014A Data
Sheet” (DS70150)
• “dsPIC30F Family Reference Manual” (DS70046)
• “dsPIC30F6011/6012/6013/6014 Rev. B1 Silicon
Errata” (DS80182)
• “dsPIC30F6011A/6012A/6013A/6014A Rev. B2
Silicon Errata” (DS80195)
• “dsPIC30F6011A/6012A/6013A/6014A Rev. A2
Silicon Errata” (DS80258)
© 2006 Microchip Technology Inc.
DS70176B-page 7
APPENDIX A:
REVISION HISTORY
Original (November 2005)
Original version of the document (DS91096A).
Revision A (January 2006)
Document recategorized as a Migration document and
given a new document number (DS70176A).
Revision B (November 2006)
This revision reflects these changes:
• Adds code compatibility information.
• Describes move of FRC oscillator tuning bits from
OSCCON SFR to OSCTUN SFR.
• Adds MPLAB REAL ICE In-Circuit Emulator to
development tools
• Adds recommended procedure for migrating from
dsPIC30F601X to dsPIC30F601XA devices
• Adds Reference Documents
DS70176B-page 8
© 2006 Microchip Technology Inc.
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•
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•
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•
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© 2006 Microchip Technology Inc.
DS70176B-page 9
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DS70176B-page 10
© 2006 Microchip Technology Inc.