BS801C/02C/04C/06C/08C Touch Key Features · Operating voltage: 2.2V~5.5V · Output type: Level-hold or Toggle · Ultra low current: 3.0mA at 3V · One-key or Any-key State · Auto-calibration · Key State Mode set by pins or serial command · High reliability touch detections · Open drain NMOS output · High PSRR · Key status monitored using pins or serial bus General Description The BS801C/02C/04C/06C/08C are a range of 1 to 8 key touch key devices which can detect human body contact using external touch pads. The high level of device integration enable applications to be implemented with a minimum number of external components. Special internal circuitry is also employed to ensure excellent power noise rejection to reduce the possibility of false detections, increasing the touch switch application reliability under adverse environmental conditions. With auto-calibration, low operating current and a low power one-key operating state, this range of touch key devices provides a simple and effective means of implementing touch switches in a wide variety of applications. The BS804C and BS808C are equipped with a One-line serial interface to allow easy communication with an external MCU for device setup and for touch pin monitoring purposes. Selection Table Operating Current at 3V One-Key State Any-key State Key Output Type Package Serial Interface 1-Key 3.0mA ¾ Level-Hold or Toggle SOT23-6 ¾ BS802C 2-Key ¾ 5.0mA Level-Hold or Toggle 8SOP ¾ ¾ 8SOP BS804C 4-Key Level-Hold or Toggle 16NSOP Level-Hold 16NSOP ¾ ¾ 16NSOP Ö Level-Hold 20SOP/SSOP ¾ Part. No. Touch Keys BS801C 3.0mA 8.0mA BS806C 6-Key 3.0mA 14.0mA BS808C 8-Key 3.0mA 18.0mA Rev. 1.00 1 Ö Auto Calibration Ö December 2, 2009 BS801C/02C/04C/06C/08C Pin Assignment V D D 5 L H F 6 C re f 4 T o p V ie w 2 1 3 K o u t V S S K e y K e y 0 1 1 6 K o u t0 K e y 1 2 1 5 K o u t1 K e y 2 3 1 4 K o u t2 K e y 3 4 1 3 K o u t3 K e y 0 1 8 C re f K e y 1 1 8 K e y 0 C re f 5 1 2 S C D K o u t1 2 7 K e y 1 K e y 2 2 7 S C D V S S 6 1 1 V D D K o u t0 3 6 V D D K e y 3 3 6 V D D N C 7 1 0 O K W V S S 4 5 L H F C re f 4 5 V S S N C 8 9 L H F B S 8 0 2 C 8 S O P -A B S 8 0 1 C S O T 2 3 -6 -A B S 8 0 4 C 8 S O P -A B S 8 0 4 C 1 6 N S O P -A K e y 0 1 2 0 K o u t0 K e y 1 2 1 9 K o u t1 K e y 0 1 1 6 K o u t0 K e y 0 1 1 6 K e y 2 K e y 2 3 1 8 K o u t2 K e y 1 2 1 5 K o u t1 K e y 1 2 1 5 K e y 3 K e y 3 4 1 7 K o u t3 K e y 2 3 1 4 K o u t2 K e y 4 3 1 4 N C K e y 4 5 1 6 K o u t4 K e y 3 4 1 3 K o u t3 K e y 5 4 1 3 N C K e y 5 6 1 5 K o u t5 K e y 4 5 1 2 K o u t4 K e y 6 5 1 2 N C K e y 6 7 1 4 K o u t6 K e y 5 6 1 1 K o u t5 K e y 7 6 1 1 S C D K e y 7 8 1 3 K o u t7 C re f 7 1 0 V D D C re f 7 1 0 V D D C re f 9 1 2 V D D V S S 8 9 O K W N C 8 9 V S S V S S 1 0 1 1 O K W B S 8 0 6 C 1 6 N S O P -A B S 8 0 8 C 1 6 N S O P -A B S 8 0 8 C 2 0 S O P -A /S S O P -A Pin Description The pins in the following table are common to all devices. Pin Name Key0~Keyn Kout0~Koutn I/O Input Description Touch key n input. These pins are connected to the external touch key. Output Touch key n output pin. Touch key reference capacitor input - value range of 0pF to 10pF - higher capacitance values result in higher sensitivities. Cref Input VSS ¾ Negative power supply, ground VDD ¾ Positive power supply The following table shows device specific pins. Pin Name I/O Device Description OKW Input BS804C BS806C BS808C Selects One-key State or Any-key State. Pin condition is read during power-up. The logic status of this pin must not be changed after power-on. After power-on this pin¢s function can be overridden by a serial command on relevant devices. Pin connected to an internal pull-high resistor. Internal circuitry ensures that this pull high resistor will not consume current even if the input is low. Open: One-key State using key0 only Low: Any-Key State SCD Input/ Output BS804C BS808C Serial bus pin used to communicate with an external MCU. The external MCU can read the BS804C or BS808C touch key status and also send commands to the device via this pin. BS801C BS802C BS804C Selects Key Output Type Pin condition is read during power-up. The logic status of this pin must not be changed after power-on. After power-on this pin¢s function can be overridden by a serial command on relevant devices. Pin connected to an internal pull-high resistor. Internal circuitry ensures that this pull high resistor will not consume current even if the input is low. Open: Level-Hold output Low: Toggle output LHF Note: Input It is important that the logic level of the OKW and LHF pins do not change state after power-on. Rev. 1.00 2 December 2, 2009 BS801C/02C/04C/06C/08C Absolute Maximum Ratings Supply Voltage ..........................VSS-0.3V to VSS+6.0V Storage Temperature ...........................-50°C to 125°C Input Voltage .............................VSS-0.3V to VDD+0.3V IOL Total ................................................................80mA Total Power Dissipation .....................................500mW Operating Temperature ..........................-40°C to 85°C IOH Total..............................................................-80mA Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics BS801C Ta=25°C Test Conditions Symbol Parameter VDD Conditions ¾ Min. Typ. Max. Unit 2.2 ¾ 5.5 V ¾ 3 6 mA VDD Operating Voltage ¾ IDD Operating Current 3V VIH Input High Voltage ¾ ¾ 0.7VDD ¾ VDD V VIL Input Low Voltage ¾ ¾ 0 ¾ 0.3VDD V IOL Sink Current 3V VOL=0.1VDD 4 8 ¾ mA RPH Pull-high Resistance 3V ¾ 20 60 100 kW No load BS802C Ta=25°C Test Conditions Symbol Parameter VDD Conditions ¾ Min. Typ. Max. Unit 2.2 ¾ 5.5 V ¾ 5 10 mA VDD Operating Voltage ¾ IDD Operating Current 3V VIH Input High Voltage ¾ ¾ 0.7VDD ¾ VDD V VIL Input Low Voltage ¾ ¾ 0 ¾ 0.3VDD V IOL Sink Current 3V VOL=0.1VDD 4 8 ¾ mA RPH Pull-high Resistance 3V ¾ 20 60 100 kW Rev. 1.00 No load 3 December 2, 2009 BS801C/02C/04C/06C/08C BS804C Symbol Ta=25°C Parameter Test Conditions VDD Conditions ¾ Min. Typ. Max. Unit 2.2 ¾ 5.5 V ¾ 3.0 6.0 mA 8.0 16.0 mA VDD Operating Voltage ¾ IDD1 Operating Current One-key State 3V No load IDD2 Operating Current Any-Key State 3V No load VIH Input High Voltage ¾ ¾ 0.7VDD ¾ VDD V VIL Input Low Voltage ¾ ¾ 0 ¾ 0.3VDD V IOL Sink Current 3V 4 8 ¾ mA RPH Pull-high Resistance 3V 20 60 100 kW VOL=0.1VDD ¾ BS806C Symbol Ta=25°C Parameter Test Conditions VDD Conditions ¾ Min. Typ. Max. Unit 2.2 ¾ 5.5 V ¾ 3.0 6.0 mA 14.0 28.0 mA VDD Operating Voltage ¾ IDD1 Operating Current One-key State 3V No load IDD2 Operating Current Any-Key State 3V No load VIH Input High Voltage ¾ ¾ 0.7VDD ¾ VDD V VIL Input Low Voltage ¾ ¾ 0 ¾ 0.3VDD V IOL Sink Current 3V 4 8 ¾ mA RPH Pull-high Resistance 3V 20 60 100 kW VOL=0.1VDD ¾ BS808C Symbol Ta=25°C Parameter Test Conditions VDD Conditions ¾ VDD Operating Voltage ¾ IDD1 Operating Current One-key State 3V No load IDD2 Operating Current Any-Key State 3V No load VIH Input High Voltage ¾ VIL Input Low Voltage ¾ IOL Sink Current 3V RPH Pull-high Resistance 3V Rev. 1.00 Typ. Max. Unit 2.2 ¾ 5.5 V ¾ 3.0 6.0 mA 18.0 36.0 mA ¾ 0.7VDD ¾ VDD V ¾ 0 ¾ 0.3VDD V VOL=0.1VDD ¾ 4 Min. 4 8 ¾ mA 20 60 100 kW December 2, 2009 BS801C/02C/04C/06C/08C A.C. Characteristics Ta=25°C Test Conditions Symbol Parameter VDD Conditions Min. Typ. Max. Unit fSCD SCD Clock 3V ¾ 10.4 13.0 15.6 kHz fKRT Key Response Time 3V ¾ 75 100 125 ms tKH Maximum Key Hold Time 3V ¾ 30 40 50 s tCAL Auto-Calibration Period 3V ¾ 1.8 2.5 3.2 s Functional Description actions are detected on any Key input, then the device will revert to the One-key State. Introduction This range of BS80xC touch key devices offer an easy and reliable means of implementing touch switch functions in a range of applications. A single external capacitor is the only external component required for most applications while a single line serial bus offers convenient communication with an external MCU. The advantage of choosing the One-key State over the Any-key State is that it will result in lower power consumption as only one key remains active. The logic status of the OKW pin is only read when the device powers up and will determine the operating state of the device after power-on. For the BS804C and BS808C devices, this power-on state can be overridden later by sending the appropriate command to the device on its SCD pin. The logic level on the OKW pin must not be changed after power on. Internal circuitry ensures that the internal pull-high resistor on the OKW pin will not consume current after power-on. Device Operation State There are two operating states known as the One-key State and the Any-key State. Devices with an OKW pin, namely the BS804C, BS806C and BS808C, can operate in either the One-key State or the Any-key State. When these devices are powered up, the condition of the OKW pin will be automatically read. If the OKW pin is low then the device will enter the Any-key State and if the pin is floating the device will enter the One-key State. As the BS801C and BS802C devices do not have an OKW pin they will always operate in the Any-key State. OKW Open OKW Low BS804C BS806C BS808C One-key State Any-key State The logic status of the OKW pin is read when the device powers up. The logic level on this pin must not be changed after power on. Internal circuitry ensures that the internal pull-high resistor on the OKW pin will not consume current. In the Any-key State, as the name suggests all of the Keyn touch inputs will be active, however in the One-key State only Key0 will be active. After power up if the BS804C, BS806C and BS808C device enters the One-key State then touching any Key other than Key0 will have no effect. If a touch action is however detected on Key0, then the device will enter the Any-key State and operate normally with all keys active. However, within a timer period of around 20 seconds, if no touch Rev. 1.00 Part No. 5 Part No. Any-key On Time in One-key State BS804C BS806C BS808C Approx 20 secs December 2, 2009 BS801C/02C/04C/06C/08C Touch Key Outputs mands to the touch key device. The serial interface allows three functions to be implemented, two are initiated by the external MCU and one by the BS80xC. All Kout pins have NMOS structures to allow easy interfacing to external devices with different operating voltages. The BS801C, BS802 and BS804C devices can have their outputs configured to operate with either Level-Hold or Toggle type. The output type is determined by the status of the LHF pin which is read during power-on. The logic level on this pin must not be changed after power on. Internal circuitry ensures that the internal pull-high resistor on the LHF pin will not consume current. The BS806C and BS808C only have Level-Hold output types. Part No. LHF BS801C BS802C BS804C Open BS806C BS808C ¾ Low SCD Command Direction Wake-up or Interrupt MCU BS804C/BS808C ® MCU Step1: MCU send command MCU ® BS804C/BS808C Read Touch Key Status Step2: MCU read key status BS804C/BS808C ® MCU Send command to BS804C/BS808C Kout Type MCU ® BS804C/BS808C SCD Function Summary Level-Hold · BS804C/BS808C Wakes-up or Interrupts MCU Toggle When any of the touch keys change state, a pulse will be generated by the BS804C/BS808C device which can be used to wake up or to interrupt an external MCU. The MCU must ensure that its pin connected to the SCD pin is setup as an input to receive this pulse. The pulse width generated by the device is equal to a tSCD/2 period where tSCD is about 76ms. Level-Hold Serial Interface - SCD Both the BS804C and BS808C are equipped with a single line serial interface on the SCD pin, allowing for easy interfacing to an external MCU. tS This single line interface allows communication in both directions between the touch key device and the external MCU. Using this interface, the external MCU can serially read the status of the touch keys at any time. The Serial interface also allows the external MCU to send com- B S 8 0 4 C B S 8 0 8 C C D I/P O /P S C D /2 IN T o r I/O M C U Wake-up/Interrupt Pulse to MCU P o w e r O n O n e -K e y S ta te Y O K W O K W O p e n ? N K e y 0 O n ? lo w A n y -K e y S ta te N A n y -K e y O n ? R e tu rn to O n e -K e y S ta te E n a b le K e y 0 O u tp u t N Y E n a b le K e y n O u tp u t Y A n y -K e y o n w ith in 2 0 s e c . ? N Y E n a b le K e y n O u tp u t BS804C, BS806C and BS808C Operating Flow Rev. 1.00 6 December 2, 2009 BS801C/02C/04C/06C/08C · MCU reads the touch key status command from the MCU. Any command sent to the device from the MCU will override the original power on configuration setup. The MCU can send a command to the BS804C/ BS808C device to request the touch key status. The protocol for reading the touch key status is as follows: ¨ The external MCU takes control of the SCD line and first sends three rising edge pulses or more to the BS804C/BS808C within a time of about 152ms. ¨ The MCU then changes its I/O pin to an input. ¨ The BS804C/BS808C device will then pull the SCD line low, then high, the timings are given by synchronise period. This allows the MCU to synchronise itself for the data transfer. ¨ N u m b e r o f p u ls e s w ith in 4 tS C D s e ts o p e r a tin g m o d e S C D L in e fro m M C U For the BS804C, the data format is D0~D3. - For the BS808C, the data format is D0~D7. ¨ The MCU can then read the key status taking care to read the data in the centre of the transmitted data pulse. ¨ After the last data bit is transferred the BS804C/ BS808C device will return its SCD pin to an input state. 4 tS N o te : T A > 8 tS C D C D P e r io d s SCD Device Setup The desired Operating Mode to be setup depends upon the number of pulses received by BS804C/ BS808C within a time period, 4 tSCD, as shown in the table. After the programming clock cycles have been transmitted and the SCD line returns high, the device will return to normal operation. Clock Pulses The timings associated with the above protocol can be described in multiples of the SCD clock periods. The SCD clock period is about about 76ms. A certain time is required for the MCU to transmit three or more pulses to inform the device that it desires to read the key status. After this time has elapsed the device will then transmit the data bits, D0~Dn. Operating Mode 0~2 Set by external pin 3~6 For test purposes 7~10 One-Key state 11~14 For test purposes >15 Any-Key state BS804C and BS808C SCD Commands Note that the MCU must transmits these pulses within 4 tSCD. Device Time BS804C 22 tSCD Maximum Key On Duration Time BS808C 38 tSCD To minimise the possibility of unintentional switch detections, such as undesired objects covering the sense electrodes, the devices includes a Maximum Key-On duration time function. To implement this function the devices include an internal timer, which starts running after each switch detection. If the key on time of a touch key exceeds a value of about 40 seconds, then the device will be reset to its power-on condition and initiate a new auto calibration. The output will then remain inactive until the next switch detection. Key Status Read Total Time Each bit of transmitted data corresponds directly to a touch input key. Therefore the status of touch key Key0 is represented by D0, Key1 by D1 and so on. A ²low² bit means that a touch has been detected, a ²high² bit means no touch has been detected. Pin Data Bit Key0 D0 Key1 D1 : : : : Keyn Dn Dn Value Auto-calibration Function 1: Key Off The devices include a full auto-calibration function which will be initiated after the device is powered-on. In addition to the power-on calibration, if no switch detection has been made for more than about 2.5 seconds then a further calibration procedure will be carried out. The calibration is applied independently to each channel on the devices. By implementing this feature, changes in the touch key environmental conditions are automatically catered for dynamically. 0: Key On · MCU sends commands to BS804C/BS808C device The MCU can send commands along the SCD line to setup the device in different Operating State. To do this the externally connected MCU takes control of the SCD line, first forcing it low and holding it low for a time of greater than 8 tSCD cycles. This action will temporarily disable the device and enable it to receive the Rev. 1.00 n T A The BS804C/BS808C device will then transmit its key status, given by D0~Dn - 2 1 7 December 2, 2009 BS801C/02C/04C/06C/08C M C U a s In p u t, d e v ic e a s In p u t M C U a s O u tp u t, d e v ic e a s In p u t M C U a s In p u t, d e v ic e a s O u tp u t S y n c h r o n is e S C D D 0 2 tS C D tS C D L e a d C lo c k 2 tS 2 tS C D C D tS 2 tS C D D 1 tS C D C D tS C D 2 tS D n C D tS C D K e y S ta tu s S y n c P e r io d D e v ic e T o u c h S w itc h D a ta L e n g th D a ta F o rm a t B S 8 0 4 C 4 b its D 0 ~ D 3 B S 8 0 8 C 8 b its D 0 ~ D 7 SCD Pin Touch Key Status Request Sensitivity Adjustment · Touch key pad size The sensitivity of the switch is a very important consideration in most applications whose requirements will vary according to the user application. The user should therefore be aware of the factors which will affect the overall sensitivity of their touch key application. Factors to take into consideration include the electrode size and the capacitance of the connection lines from the electrode to the BS80xC device. Therefore the sensitivity will vary according to the actual PCB layout and design. An external capacitor, Cs, connected to the Cref pin, is used to set the overall sensitivity of all pins. Some of the most important factors affecting sensitivity are the following: Larger touch key sizes will increase sensitivity and of course vice-versa, small electrode sizes will decrease sensitivity. · Touch key pad insulating panel thickness A thinner panel will result in higher sensitivity and of course thicker panels will result in a lower sensitivities. · Touch key pad insulating panel material The choice of the dielectric material for the panel will influence the sensitivity. Materials with higher dielectric constants will result in higher sensitivities and lower dielectric constants will result in lower sensitivities. Touch Key · Cref capacitor value - Cs The purpose of the Cs capacitor is to allow for adjustment of touch key sensitivity and power noise rejection. The optimal choice of sensitivity and power noise rejection will be obtained when the value of the Cs capacitor is equivalent to the touch pad capacitance, however the value can still be changed to obtain the required sensitivity value. Higher Cs values will result in higher levels of sensitivity. Recommended values for Cs are between 0pF and 10pF. Rev. 1.00 Key Cs 0pF~ 10pF 8 Cref December 2, 2009 BS801C/02C/04C/06C/08C Application Circuit VDD Touch Key Key VDD 0.1uF Cref Cs 0pF~ 10pF R VDD Kout LHF VSS BS801C VDD Touch Key0 Key0 Touch Key1 Key1 VDD 0.1uF R VDD Cref Cs 0pF~ 10pF Kout0 R VDD LHF Kout1 VSS BS802C VDD Touch Key0 . . . Touch Key3 Cs 0pF~ 10pF Key0 . . . Key3 VDD Cref SCD 0.1uF MCU INTB or Port R VDD Kout0 LHF OKW . . . Kout3 R VDD VSS BS804C Note: If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the application circuit is not required. Rev. 1.00 9 December 2, 2009 BS801C/02C/04C/06C/08C VDD Touch Key0 . . . Touch Key5 Key0 . . . VDD 0.1uF R Key5 Cref Cs 0pF~ 10pF VDD Kout0 . . . R VDD Kout5 OKW VSS BS806C VDD Touch Key0 . . . Touch Key7 Key0 . . . Key7 VDD MCU 0.1uF INTB or Port SCD R Cs 0pF~ 10pF VDD Cref Kout0 . . OKW R VDD Kout7 VSS BS808C Note: If the output is connected to an MCU input with an internal pull high resistor then the pull high resistor on the application circuit is not required. Rev. 1.00 10 December 2, 2009 BS801C/02C/04C/06C/08C Package Information 8-pin SOP (150mil) Outline Dimensions 5 8 A B 4 1 C C ' G H D E a F · MS-012 Symbol Rev. 1.00 Dimensions in mil Min. Nom. Max. A 228 ¾ 244 B 150 ¾ 157 C 12 ¾ 20 C¢ 188 ¾ 197 D ¾ ¾ 69 E ¾ 50 ¾ F 4 ¾ 10 G 16 ¾ 50 H 7 ¾ 10 a 0° ¾ 8° 11 December 2, 2009 BS801C/02C/04C/06C/08C 16-pin NSOP (150mil) Outline Dimensions 1 6 A 9 B 8 1 C C ' G H D E a F · MS-012 Symbol Rev. 1.00 Dimensions in mil Min. Nom. Max. A 228 ¾ 244 B 150 ¾ 157 C 12 ¾ 20 C¢ 386 ¾ 394 D ¾ ¾ 69 E ¾ 50 ¾ F 4 ¾ 10 G 16 ¾ 50 H 7 ¾ 10 a 0° ¾ 8° 12 December 2, 2009 BS801C/02C/04C/06C/08C 20-pin SOP (300mil) Outline Dimensions 1 1 2 0 A B 1 1 0 C C ' G H D E a F · MS-013 Symbol Rev. 1.00 Dimensions in mil Min. Nom. Max. A 393 ¾ 419 B 256 ¾ 300 C 12 ¾ 20 C¢ 496 ¾ 512 D ¾ ¾ 104 E ¾ 50 ¾ F 4 ¾ 12 G 16 ¾ 50 H 8 ¾ 13 a 0° ¾ 8° 13 December 2, 2009 BS801C/02C/04C/06C/08C 20-pin SSOP (150mil) Outline Dimensions 1 1 2 0 A B 1 1 0 C C ' G H D E Symbol Rev. 1.00 a F Dimensions in mil Min. Nom. Max. A 228 ¾ 244 B 150 ¾ 158 C 8 ¾ 12 C¢ 335 ¾ 347 D 49 ¾ 65 E ¾ 25 ¾ F 4 ¾ 10 G 15 ¾ 50 H 7 ¾ 10 a 0° ¾ 8° 14 December 2, 2009 BS801C/02C/04C/06C/08C 6-pin SOT23-6 Outline Dimensions D C L H E q e A A 2 b Symbol Dimensions in mm Min. Nom. Max. 1.0 ¾ 1.3 A1 ¾ ¾ 0.1 A2 0.7 ¾ 0.9 A Rev. 1.00 A 1 b 0.35 ¾ 0.50 C 0.1 ¾ 0.25 D 2.7 ¾ 3.1 E 1.4 ¾ 1.8 e ¾ 1.9 ¾ H 2.6 ¾ 3.0 L 0.37 ¾ ¾ q 1° ¾ 9° 15 December 2, 2009 BS801C/02C/04C/06C/08C Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 8N Symbol Description Dimensions in mm A Reel Outer Diameter 330.0±1.0 B Reel Inner Diameter 100.0±1.5 C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness 13.0 +0.5/-0.2 2.0±0.5 12.8 +0.3/-0.2 18.2±0.2 SOP 16N (150mil) Symbol Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.00 Dimensions in mm 330.0±1.0 100.0±1.5 13.0 +0.5/-0.2 2.0±0.5 16.8 +0.3/-0.2 22.2±0.2 16 December 2, 2009 BS801C/02C/04C/06C/08C SOP 20W Symbol Description Dimensions in mm A Reel Outer Diameter 330.0±1.0 B Reel Inner Diameter 100.0±1.5 C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness 13.0 +0.5/-0.2 2.0±0.5 24.8 +0.3/-0.2 30.2±0.2 SSOP 20S (150mil) Symbol Description Dimensions in mm A Reel Outer Diameter 330.0±1.0 B Reel Inner Diameter 100.0±1.5 C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness 13.0 +0.5/-0.2 2.0±0.5 16.8 +0.3/-0.2 22.2±0.2 SOT23-6 Symbol Description Dimensions in mm A Reel Outer Diameter 178.0±1.0 B Reel Inner Diameter 62.0±1.0 C Spindle Hole Diameter 13.0±0.2 D Key Slit Width 2.50±0.25 T1 Space Between Flange 8.4 T2 Reel Thickness 11.4 Rev. 1.00 17 +1.5/-0.0 +1.5/-0.0 December 2, 2009 BS801C/02C/04C/06C/08C Carrier Tape Dimensions P 0 D P 1 t E F W C D 1 B 0 P K 0 A 0 R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . SOP 8N Symbol Description Dimensions in mm 12.0 +0.3/-0.1 W Carrier Tape Width P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 5.5±0.1 D Perforation Diameter D1 Cavity Hole Diameter P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.4±0.1 B0 Cavity Width 5.2±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness C Cover Tape Width 1.55±0.1 1.50 +0.25/-0.00 0.30±0.05 9.3±0.1 SOP 16N (150mil) Symbol Description Dimensions in mm W Carrier Tape Width 16.0±0.3 P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) D Perforation Diameter 1.55 +0.10/-0.00 D1 Cavity Hole Diameter 1.50 +0.25/-0.00 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.5±0.1 B0 Cavity Width 10.3±0.1 K0 Cavity Depth 2.1±0.1 7.5±0.1 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 13.3±0.1 Rev. 1.00 18 December 2, 2009 BS801C/02C/04C/06C/08C SOP 20W Symbol Description Dimensions in mm 24.0 +0.3/-0.1 W Carrier Tape Width P Cavity Pitch 12.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation (Width Direction) 11.5±0.1 D Perforation Diameter 1.5 D1 Cavity Hole Diameter 1.50 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 10.8±0.1 B0 Cavity Width 13.3±0.1 K0 Cavity Depth 3.2±0.1 +0.1/-0.0 +0.25/-0.00 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 21.3±0.1 SSOP 20S (150mil) Symbol Description Dimensions in mm 16.0 +0.3/-0.1 W Carrier Tape Width P Cavity Pitch E Perforation Position F Cavity to Perforation (Width Direction) D Perforation Diameter 1.5 D1 Cavity Hole Diameter 1.50 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.5±0.1 B0 Cavity Width 9.0±0.1 K0 Cavity Depth 2.3±0.1 8.0±0.1 1.75±0.10 7.5±0.1 +0.1/-0.0 +0.25/-0.00 t Carrier Tape Thickness 0.30±0.05 C Cover Tape Width 13.3±0.1 Rev. 1.00 19 December 2, 2009 BS801C/02C/04C/06C/08C SOT23-6 Symbol Description Dimensions in mm W Carrier Tape Width 8.0±0.3 P Cavity Pitch 4.0±0.1 E Perforation Position 1.75±0.10 F Cavity to Perforation (Width Direction) 3.50±0.05 D Perforation Diameter 1.5 +0.1/-0.0 D1 Cavity Hole Diameter 1.5 +0.1/-0.0 P0 Perforation Pitch P1 Cavity to Perforation (Length Direction) 2.00±0.05 A0 Cavity Length 3.15±0.10 B0 Cavity Width 3.2±0.1 K0 Cavity Depth 1.4±0.1 t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 4.0±0.1 0.20±0.03 5.3±0.1 20 December 2, 2009 BS801C/02C/04C/06C/08C Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor (China) Inc. (Dongguan Sales Office) Building No. 10, Xinzhu Court, (No. 1 Headquarters), 4 Cuizhu Road, Songshan Lake, Dongguan, China 523808 Tel: 86-769-2626-1300 Fax: 86-769-2626-1311 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2009 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 21 December 2, 2009