HSP

Nomenclature Guide
HSP Types
H
SP XXXXX A
J
C - XX
PREFIX
HIGH-RELIABILITY
DESIGNATOR
/883: -55°C to +125°C Fully Compliant to
MIL-STD-883, Class B/QML
FAMILY
SP: Signal Processing,
DSP Function-Specific
DEVICE TYPE
43XXX: Digital Filters
45XXX: Signal Synthesis/Special Function
48XXX: Image Processing
95XX: Building Blocks
50XXX: Freq. Conversion and Modulation/
Demodulation
MASK REVISION
NOTE:
Suffix EV, EVAL:
/883
SPEED GRADE IN MHz
TEMPERATURE RANGE
C: Commercial, 0°C to +70°C
I: Industrial, -40°C to +85°C
M: Military, -55°C to +125°C
PACKAGE DESIGNATOR
D: Die
G: Ceramic Pin Grid Array (CPGA)
J: Plastic Leaded Chip Carrier (PLCC)
P: Dual-In-Line Plastic (PDIP)
S: Small Outline Plastic (SOIC)
V: Metric Quad Flatpack (MQFP)
W: Wafer
Evaluation Kit (Available for some products).
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