TLD2310EL Data Sheet

I n f i n e o n ® L I T I X TM B a s i c
TLD2310EL
3 Channel High Side Current Source
Data Sheet
Rev. 1.1, 2015-03-24
Automotive
TLD2310EL
1
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
3.1
3.2
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
4.1
4.2
4.3
General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5
5.1
5.2
5.3
5.3.1
5.3.2
5.4
EN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EN Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Supply Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EN Unused . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EN - Pull Up to VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
EN - Direct Connection to VS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics Internal Supply / EN Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
10
10
11
12
12
12
13
6
6.1
6.2
6.3
IN_SETx Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Current Adjustment via RSET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics IN_SET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15
15
15
17
7
7.1
7.1.1
7.1.2
7.2
Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Over Load Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reverse Battery Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics Power Stage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
18
18
18
18
19
8
8.1
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Further Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
9
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
10
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Data Sheet
2
8
8
9
9
Rev. 1.1, 2015-03-24
3 Channel High Side Current Source
LITIXTM Basic
1
TLD2310EL
Overview
Features
•
•
•
•
•
•
•
•
•
•
•
•
3 Channel device with integrated output stages (current sources),
optimized to drive LEDs
Output current up to 120mA per channel
Low current consumption in sleep mode
PWM-operation supported via VS- and EN-pin
Output current adjustable via external low power resistor and
possibility to connect PTC resistor for LED protection during over
temperature conditions
Reverse polarity protection
Overload protection
Undervoltage detection
Wide temperature range: -40 °C < Tj < 150 °C
PG-SSOP14 package with exposed heatslug
Green Product (RoHS compliant)
AEC Qualified
PG-SSOP14
Description
The LITIXTM Basic TLD2310EL is a three channel high side driver IC with integrated output stages. It is designed
to control LEDs with a current up to 120 mA. In typical automotive applications the device is capable to drive i.e.
3 red LEDs per chain (total 9 LEDs) with a current up to 60mA, which is limited by thermal cooling aspects. The
output current is controlled practically independent of load and supply voltage changes.
Table 1
Product Summary
VS(nom)
5.5 V… 40 V
VS(max)
40 V
VOUTx(max)
IOUTx(nom) 60 mA when using a supply voltage range of 8V
Operating voltage
Maximum voltage
Nominal output (load) current
- 18V (e.g. Automotive car battery). Currents up
to IOUT(max) possible in applications with low
thermal resistance RthJA
Maximum output (load) current
Output current accuracy at RSETx = 12 kΩ
Current consumption in sleep mode
IOUTx(max)
kLT
IS(sleep,typ)
120 mA; depending on thermal resistance RthJA
750 ± 7%
0.1 µA
Type
Package
Marking
TLD2310EL
PG-SSOP14
TLD2310EL
Data Sheet
3
Rev. 1.1, 2015-03-24
TLD2310EL
Overview
Protective functions
- ESD protection
- Under voltage lock out
- Over Load protection
- Over Temperature protection
- Reverse Polarity protection
Applications
Designed for exterior LED lighting applications such as tail/brake light, turn indicator, position light, side marker,...
The device is also well suited for interior LED lighting applications such as ambient lighting (e.g. RGB), interior
illumination and dash board lighting.
Data Sheet
4
Rev. 1.1, 2015-03-24
TLD2310EL
Block Diagram
2
Block Diagram
VS
Internal
supply
EN
Thermal
protection
Output
control
OUT3
OUT2
OUT1
IN_SET3
IN_SET2 Current
IN_SET1
adjust
TLD2310EL
Figure 1
Data Sheet
GND
Basic Block Diagram
5
Rev. 1.1, 2015-03-24
TLD2310EL
Pin Configuration
3
Pin Configuration
3.1
Pin Assignment
Figure 2
Data Sheet
VS
1
VS
2
EN
3
NC
4
IN_SET3
14
NC
13
OUT3
12
OUT2
11
OUT1
5
10
NC
IN_SET2
6
9
GND
IN_SET1
7
8
NC
TLD2310EL
EP
Pin Configuration
6
Rev. 1.1, 2015-03-24
TLD2310EL
Pin Configuration
3.2
Pin Definitions and Functions
Pin
Symbol
Input/
Output
Function
1, 2
VS
–
Supply Voltage; battery supply, connect a decoupling capacitor (100 nF 1 µF) to GND
3
EN
I
Enable pin
4
NC
–
Pin not connected
5
IN_SET3
I/O
Input / SET pin 3; Connect a low power resistor to adjust the output current
6
IN_SET2
I/O
Input / SET pin 2; Connect a low power resistor to adjust the output current
7
IN_SET1
I/O
Input / SET pin 1; Connect a low power resistor to adjust the output current
8
NC
–
Pin not connected
9
GND
–
1)
10
NC
–
Pin not connected
11
OUT1
O
Output 1
12
OUT2
O
Output 2
13
OUT3
O
Output 3
14
NC
–
Pin not connected
–
1)
Exposed
Pad
GND
Ground
Exposed Pad; connect to GND in application
1) Connect all GND-pins together.
Data Sheet
7
Rev. 1.1, 2015-03-24
TLD2310EL
General Product Characteristics
4
General Product Characteristics
4.1
Absolute Maximum Ratings
Absolute Maximum Ratings 1)
Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin for input pins (I), positive
currents flowing out of the I/O and output pins (O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Max.
VS
VEN
VEN(VS)
VEN VOUTx
VOUTx
VPS
-16
40
V
–
-16
40
V
–
VS - 40
VS + 16
V
–
-16
40
V
–
-1
40
V
–
-16
40
V
–
IN_SETx voltage
VIN_SETx
-0.3
6
V
–
4.1.8
IN_SETx current
–
2
mA
–
4.1.9
Output current
IIN_SETx
IOUTx
–
130
mA
–
Tj
Tstg
-40
150
°C
–
-55
150
°C
–
Voltages
4.1.1
Supply voltage
4.1.2
Input voltage EN
4.1.3
Input voltage EN related to VS
4.1.4
Input voltage EN related to VOUTx
VEN - VOUTx
4.1.5
4.1.6
Output voltage
Power stage voltage
VPS = VS - VOUTx
4.1.7
Currents
Temperatures
4.1.10
Junction temperature
4.1.11
Storage temperature
ESD Susceptibility
4.1.12
ESD resistivity to GND
VESD
-2
2
kV
Human Body
Model (100 pF via
1.5 kΩ)2)
4.1.13
ESD resistivity all pins to GND
-500
500
V
CDM3)
4.1.14
ESD resistivity corner pins to GND
VESD
VESD
-750
750
V
CDM3)
1) Not subject to production test, specified by design
2) ESD susceptibility, Human Body Model “HBM” according to ANSI/ESDA/JEDEC JS-001-2011
3) ESD susceptibility, Charged Device Model “CDM” according to JESD22-C101E
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
8
Rev. 1.1, 2015-03-24
TLD2310EL
General Product Characteristics
4.2
Pos.
Functional Range
Parameter
Symbol
Limit Values
Min.
Max.
Unit
Conditions
4.2.15
Supply voltage range for
normal operation
VS(nom)
5.5
40
V
–
4.2.16
Power on reset threshold
VS(POR)
–
5
V
VEN = VS
RSETx = 12 kΩ
IOUTx = 80% IOUTx(nom)
VOUTx = 2.5 V
4.2.17
Junction temperature
Tj
-40
150
°C
–
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Pos.
Thermal Resistance
Parameter
4.3.1
Junction to Case
4.3.2
Junction to Ambient 1s0p board
Symbol
RthJC
RthJA1
Limit Values
Min.
Typ.
Max.
–
8
10
–
–
4.3.3
Junction to Ambient 2s2p board
61
56
Unit
Conditions
K/W
1) 2)
K/W
1) 3)
Ta = 85 °C
Ta = 135 °C
–
–
RthJA2
K/W
–
–
45
43
–
–
1) 4)
Ta = 85 °C
Ta = 135 °C
1) Not subject to production test, specified by design. Based on simulation results.
2) Specified RthJC value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad are fixed to
ambient temperature). Ta = 85°C, Total power dissipation 1.5 W.
3) The RthJA values are according to Jedec JESD51-3 at natural convection on 1s0p FR4 board. The product (chip + package)
was simulated on a 76.2 x 114.3 x 1.5 mm3 board with 70µm Cu, 300 mm2 cooling area. Total power dissipation 1.5 W
distributed statically and homogenously over all power stages.
4) The RthJA values are according to Jedec JESD51-5,-7 at natural convection on 2s2p FR4 board. The product (chip +
package) was simulated on a 76.2 x 114.3 x 1.5 mm3 board with 2 inner copper layers (outside 2 x 70 µm Cu, inner 2 x
35µm Cu). Where applicable, a thermal via array under the exposed pad contacted the first inner copper layer. Total power
dissipation 1.5 W distributed statically and homogenously over all power stages.
Data Sheet
9
Rev. 1.1, 2015-03-24
TLD2310EL
EN Pin
5
EN Pin
The EN pin is a dual function pin:
Internal Supply
Output Control
EN
V EN
Figure 3
Block Diagram EN pin
Note: The current consumption at the EN-pin IEN needs to be added to the total device current consumption. The
total current consumption is the sum of the currents at the VS-pin IS and the EN-pin IEN.
5.1
EN Function
If the voltage at the pin EN is below a threshold of VEN(off) the LITIXTM Basic IC will enter Sleep mode. In this state
all internal functions are switched off, the current consumption is reduced to IS(sleep). A voltage above VEN(on) at this
pin enables the device after the Power on reset time tPOR.
VS
V EN
IOU T
t
t
tPOR
100%
80%
t
Figure 4
Data Sheet
Power on reset
10
Rev. 1.1, 2015-03-24
TLD2310EL
EN Pin
5.2
Internal Supply Pin
The EN pin can be used to supply the internal logic. There are two typical application conditions, where this feature
can be used:
1) In “DC/DC control Buck” configurations, where the voltage Vs can be below 5.5V.
2) In configurations, where a PWM signal is applied at the Vbatt pin of a light module. The buffer capacitor CBUF is
used to supply the LITIXTM Basic IC during Vbatt low (Vs low) periods. This feature can be used to minimize the
turn-on time to the values specified in Pos. 7.2.11. Otherwise, the power-on reset delay time tPOR (Pos. 5.4.4) has
to be considered.
The capacitor can be calculated using the following formula:
I EN ( LS )
C BUF = tLOW ( max ) ⋅ -------------------------------------------------V S – V D1 – V S ( POR )
(1)
See also a typical application drawing in Chapter 8.
VBATT
VS
D1
EN
CBUF
Internal
supply
Thermal
protection
Output
control
OUT3
OUT2
OUT1
IN_SET
RSET
Current
adjust
TM
LITIX
Basic
LEDBasic
Driver
GND
GND
Figure 5
Data Sheet
External circuit when applying a fast PWM signal on VBATT
11
Rev. 1.1, 2015-03-24
TLD2310EL
EN Pin
V EN
t
V BATT
IOU T
t
tON (VS)
100%
80%
Switch off behavior depends on
V BATT and load characteristics
20%
t
Figure 6
Typical waveforms when applying a fast PWM signal on VBATT
The parameter tON(VS) is defined at Pos. 7.2.11. The parameter tOFF(VS) depends on the load and supply voltage
VBATT characteristics.
5.3
EN Unused
In case of an unused EN pin, there are two different ways to connect it:
5.3.1
EN - Pull Up to VS
The EN pin can be connected with a pull up resistor (e.g. 10 kΩ) to Vs potential. In this configuration the LITIXTM
Basic IC is always enabled.
5.3.2
EN - Direct Connection to VS
The EN pin can be connected directly to the VS pin (IC always enabled). This configuration has the advantage
(compared to the configuration described in Chapter 5.3.1) that no additional external component is required.
Data Sheet
12
Rev. 1.1, 2015-03-24
TLD2310EL
EN Pin
5.4
Electrical Characteristics Internal Supply / EN Pin
Electrical Characteristics Internal Supply / EN pin
Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSETx = 12 kΩ all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
5.4.1
Current consumption,
sleep mode
IS(sleep)
5.4.2
Current consumption,
active mode
IS(on)
Limit Values
Min.
Typ.
Max.
–
0.1
2
Current consumption,
device disabled via
IN_SETx
Conditions
µA
1)
mA
–
–
–
–
–
–
5.4.3
Unit
1.4
0.75
1.5
IS(dis,IN_SET)
mA
VEN = 0.5 V
Tj < 85 °C
VS = 18 V
VOUTx = 3.6 V
2)
IIN_SET = 0 µA
Tj < 105 °C
VS = 18 V
VOUTx = 3.6V
VEN = 5.5 V
VEN = 18 V
1)
REN = 10 kΩ between
VS and EN-pin
2)
VS = 18 V
Tj < 105 °C
VIN_SETx = 5 V
VEN = 5.5 V
VEN = 18 V
1)
REN = 10 kΩ between
VS and EN-pin
–
–
–
–
–
–
1.4
0.7
1.4
Power-on reset delay time 3) tPOR
–
–
25
5.4.5
Required supply voltage for VS(on)
output activation
–
–
4
V
5.4.6
Required supply voltage for VS(CC)
current control
–
–
5.2
V
5.4.7
VEN(on)
EN turn off threshold
VEN(off)
EN input current during low IEN(LS)
–
–
2.5
V
–
0.8
–
–
V
–
–
–
2.4
mA
1)
–
–
–
–
–
–
–
–
0.1
0.1
2.05
0.45
5.4.4
5.4.8
5.4.9
EN turn on threshold
µs
supply voltage
5.4.10
EN high input current
IEN(H)
mA
1)
VS = VEN = 0 → 13.5 V
VOUTx(nom) = 3.6 ± 0.3V
IOUTx = 80% IOUTx(nom)
VEN = 5.5 V
VOUTx = 3 V
IOUTx = 50% IOUTx(nom)
VEN = 5.5 V
VOUTx = 3.6 V
IOUTx ≥ 90% IOUTx(nom)
VS = 4.5 V
Tj < 105 °C
VEN = 5.5 V
Tj < 105 °C
VS = 13.5 V, VEN = 5.5 V
VS = 18 V, VEN = 5.5 V
VS = VEN = 18 V
1)
VS = 18 V, REN = 10 kΩ
between VS and EN-pin
1) Not subject to production test, specified by design
Data Sheet
13
Rev. 1.1, 2015-03-24
TLD2310EL
EN Pin
2) The total device current consumption is the sum of the currents IS and IEN(H), please refer to Pos. 5.4.10
3) See also Figure 4
Data Sheet
14
Rev. 1.1, 2015-03-24
TLD2310EL
IN_SETx Pin
6
IN_SETx Pin
The IN_SET pin is a multiple function pin for output current definition and input:
IN_SET
IIN_SET
VIN_SET
GND
Figure 7
Block Diagram IN_SET pin
6.1
Output Current Adjustment via RSET
The output current of each channel can be adjusted independently. The current adjustment can be done by placing
a low power resistor (RSET) at the IN_SETx pin to ground. The dimensioning of the resistor can be done using the
formula below:
kR SET = ---------I OUT
(2)
The gain factor k (RSET * output current) is specified in Pos. 7.2.4 and Pos. 7.2.5. The current through the RSET is
defined by the resistor itself and the reference voltage VIN_SET(ref), which is applied to the IN_SET during supplied
device.
6.2
Input Pin
The IN_SETx pin can be connected via RSET to the open-drain output of a µC or to an external NMOS transistor
as described in Figure 8. This signal can be used to turn off the output stages of the IC. A minimum IN_SET
current of IIN_SET(act) is required to turn on the output stages. This feature is implemented to prevent glimming of
LEDs caused by leakage currents on the IN_SET pin, see Figure 10 for details.
Microcontroller
(e.g. XC866)
OUT
RSET
IN_SET
Current
adjust
TM
LITIX
Basic
LEDBasic
Driver
GND
VDDP = 5 V
Figure 8
Schematics IN_SET interface to µC
The resulting switching times are shown in Figure 9:
Data Sheet
15
Rev. 1.1, 2015-03-24
TLD2310EL
IN_SETx Pin
IIN_ SET
tON (IN_ SET )
IOU T
t
tOFF(IN _ SET)
100%
80%
20%
t
Figure 9
Switching times via IN_SET
IOUT [mA]
k = IOUTx * VIN_SET(ref) / IIN_SETx
IOUTx
IIN_SET(ACT)
Figure 10
Data Sheet
IIN_SETx
IIN_SET [µA]
IOUT versus IINSET
16
Rev. 1.1, 2015-03-24
TLD2310EL
IN_SETx Pin
6.3
Electrical Characteristics IN_SET Pin
Electrical Characteristics IN_SET pin
Unless otherwise specified: VS = 5.5 V to 40 V, Tj = -40 °C to +150 °C, RSETx = 12 kΩ, all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
VIN_SET(ref)
6.3.1
IN_SET reference
voltage
6.3.2
IN_SET activation
IIN_SET(act)
current without turn on of
output stages
Limit Values
Unit
Conditions
Min.
Typ.
Max.
1.19
1.23
1.27
V
1)
2
–
15
µA
See Figure 10
VOUTx = 3.6 V
Tj = 25...115 °C
1) Not subject to production test, specified by design
Data Sheet
17
Rev. 1.1, 2015-03-24
TLD2310EL
Power Stage
7
Power Stage
The output stages are realized as high side current sources with a current of 120 mA. During off state the leakage
current at the output stage is minimized in order to prevent a slightly glowing LED. To increase the overall output
current for high brightness LED applications it is possible to connect two or all three output stages in parallel.
The maximum current of each channel is limited by the power dissipation and used PCB cooling areas (which
results in the applications RthJA).
For an operating current control loop the supply and output voltages according to the following parameters have
to be considered:
•
•
•
Required supply voltage for current control VS(CC), Pos. 5.4.6
Voltage drop over output stage during current control VPS(CC), Pos. 7.2.6
Required output voltage for current control VOUTx(CC), Pos. 7.2.7
7.1
Protection
The device provides embedded protective functions, which are designed to prevent IC destruction under fault
conditions described in this data sheet. Fault conditions are considered as “outside” normal operating range.
Protective functions are neither designed for continuous nor for repetitive operation.
7.1.1
Over Load Behavior
An over load detection circuit is integrated in the LITIXTM Basic IC. It is realized by a temperature monitoring of the
output stages (OUTx).
As soon as the junction temperature exceeds the current reduction temperature threshold Tj(CRT) the output current
will be reduced by the device by reducing the IN_SET reference voltage VIN_SET(ref). This feature avoids LED’s
flickering during static output overload conditions. Furthermore, it protects LEDs against over temperature, which
are mounted thermally close to the device. If the device temperature still increases, the three output currents
decrease close to 0 A. As soon as the device cools down the output currents rise again.
IOU T
V IN_ SET
Tj (C R T)
Figure 11
Tj
Output current reduction at high temperature
Note: This high temperature output current reduction is realized by reducing the IN_SET reference voltage voltage
(Pos. 6.3.1). In case of very high power loss applied to the device and very high junction temperature the
output current may drop down to IOUTx = 0 mA, after a slight cooling down the current increases again.
7.1.2
Reverse Battery Protection
The TLD2310EL has an integrated reverse battery protection feature. This feature protects the driver IC itself, but
also connected LEDs. The output reverse current is limited to IOUTx(rev) by the reverse battery protection.
Data Sheet
18
Rev. 1.1, 2015-03-24
TLD2310EL
Power Stage
Note: Due to the reverse battery protection a reverse protection diode for the light module may be obsolete. In case
of high ISO-pulse requirements and only minor protecting components like capacitors a reverse protection
diode may be reasonable. The external protection circuit needs to be verified in the application.
7.2
Electrical Characteristics Power Stage
Electrical Characteristics Power Stage
Unless otherwise specified: VS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, VOUTx = 3.6 V, all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Min.
7.2.1
Output leakage current
Typ.
Unit
Conditions
µA
VEN = 5.5 V
IIN_SET = 0 µA
VOUTx = 2.5 V
Tj = 150 °C
1)
Tj = 85 °C
1)
VEN = 5.5 V
IIN_SET = 0 µA
VOUTx = VS = 40 V
1)
VS = -16 V
Max.
IOUTx(leak)
–
–
–
–
7
3
7.2.2
Output leakage current in
boost over battery setup
–
IOUTx(leak,B2B)
–
50
µA
7.2.3
Reverse output current
-IOUTx(rev)
–
1
µA
–
Output load: LED with
break down voltage
< - 0.6 V
7.2.4
7.2.5
Output current accuracy
limited temperature range
Output current accuracy
over temperature
1)
kLT
697
645
750
750
803
855
697
645
750
750
803
855
kALL
7.2.6
Voltage drop over power
VPS(CC)
stage during current control
VPS(CC) = VS - VOUTx
0.75
–
–
V
7.2.7
Required output voltage for VOUTx(CC)
current control
2.3
–
–
V
7.2.8
Maximum output current
120
–
–
mA
IOUT(max)
Tj = 25...115 °C
VS = 8...18 V
VPS = 2 V
RSETx = 6...12 kΩ
RSETx = 30 kΩ
1)
Tj = -40...115 °C
VS = 8...18 V
VPS = 2 V
RSETx = 6...12 kΩ
RSETx = 30 kΩ
1)
VS = 13.5 V
RSETx = 12 kΩ
IOUTx ≥ 90% of
(kLT(typ)/RSETx)
1)
VS = 13.5 V
RSETx = 12 kΩ
IOUTx ≥ 90% of
(kLT(typ)/RSETx)
RSETx = 4.7 kΩ
The maximum output
current is limited by the
thermal conditions.
Please refer to
Pos. 4.3.1 - Pos. 4.3.3
Data Sheet
19
Rev. 1.1, 2015-03-24
TLD2310EL
Power Stage
Electrical Characteristics Power Stage (cont’d)
Unless otherwise specified: VS = 5.5 V to 18 V, Tj = -40 °C to +150 °C, VOUTx = 3.6 V, all voltages with respect to
ground, positive current flowing into pin for input pins (I), positive currents flowing out of the I/O and output pins
(O) (unless otherwise specified)
Pos.
Parameter
Symbol
Limit Values
Unit
Conditions
Min.
Typ.
Max.
7.2.9
IN_SET turn on time
tON(IN_SET)
–
–
15
µs
–
10
µs
–
–
20
µs
Tj(CRT)
–
140
–
°C
IOUT(CRT)
85% of –
(kLT(typ)/
RSETx)
–
A
VS = 13.5 V
IIN_SET = 0 → 100 µA
IOUTx = 80% of
(kLT(typ)/RSETx)
VS = 13.5 V
IIN_SET = 100 → 0 µA
IOUTx = 20% of
(kLT(typ)/RSETx)
1) 2)
VEN = 5.5 V
RSETx = 12 kΩ
VS = 0 → 13.5 V
IOUTx = 80% of
(kLT(typ)/RSETx)
1)
IOUTx = 95% of
(kLT(typ)/RSETx)
1)
RSETx = 12 kΩ
Tj = 150 °C
7.2.10
IN_SET turn off time
tOFF(IN_SET)
–
7.2.11
VS turn on time
tON(VS)
7.2.12
Current reduction
temperature threshold
7.2.13
Output current during
current reduction at high
temperature
1) Not subject to production test, specified by design
2) see also Figure 6
Data Sheet
20
Rev. 1.1, 2015-03-24
TLD2310EL
Application Information
8
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be
regarded as a description or warranty of a certain functionality, condition or quality of the device.
VBATT
Cmo d =2.2µF
CVS =4.7nF
VS
Microcontroller
(e.g.
XC866)
ISO-Pulse protection circuit
depending on requirements
EN
Internal
supply
Thermal
protection
Output
control
4.7nF** 4.7nF** 4.7nF**
OUT3
OUT2
RSET
OUT1
OUT3*
IN_SET3
OUT2*
IN_SET1 adjust
IN_SET2 Current
TM
LITIX
Basic
LEDBasic
Driver
GND
OUT1*
* Open Drain
** For EMI improvement, if required.
Figure 12
Application Diagram
Note: This is a very simplified example of an application circuit. In case of high ISO-pulse requirements a reverse
protection diode may be used for LED protection. The function must be verified in the real application.
8.1
•
Further Application Information
For further information you may contact http://www.infineon.com/
Data Sheet
21
Rev. 1.1, 2015-03-24
TLD2310EL
Package Outlines
9
Package Outlines
0.19 +0.06
0.08 C
0.15 M C A-B D 14x
0.64 ±0.25
1
8
1
7
0.2
M
D 8x
Bottom View
3 ±0.2
A
14
6 ±0.2
D
Exposed
Diepad
B
0.1 C A-B 2x
14
7
8
2.65 ±0.2
0.25 ±0.05 2)
0.1 C D
8˚ MAX.
C
0.65
3.9 ±0.11)
1.7 MAX.
Stand Off
(1.45)
0 ... 0.1
0.35 x 45˚
4.9 ±0.11)
Index Marking
1) Does not include plastic or metal protrusion of 0.15 max. per side
2) Does not include dambar protrusion
Dimensions in mm
PG-SSOP-14-1,-2,-3-PO V02
Figure 13
PG-SSOP14
Green Product (RoHS compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e
Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further information on alternative packages, please visit our website:
http://www.infineon.com/packages.
Data Sheet
22
Rev. 1.1, 2015-03-24
TLD2310EL
Revision History
10
Revision History
Revision
Date
Changes
1.0
2013-08-08
Inital revision of data sheet
1.1
2015-03-19
Updated parameters KLT and KALL in the chapter Power Stage.
Data Sheet
23
Rev. 1.1, 2015-03-24
Edition 2015-03-24
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2015 Infineon Technologies AG
All Rights Reserved.
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of any third party.
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