SLA6845MZ High Voltage 3-Phase Motor Driver Features and Benefits ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ Description Built-in pre-drive IC IGBT power element CMOS compatible input (3.3 to 5 V) High-side gate driver using bootstrap circuit or floating power supply Integrated Fast Recovery Diode (FRD) as freewheeling diode for each IGBT Built-in protection circuit for controlling power supply voltage drop Built-in overtemperature detection circuit (TD) 3-shunt configuration Output of fault signal during operation of protection circuit Output current 3 A Small SIP (SLA 24-pin) The SLA6845MZ inverter power module (IPM) device provides a robust, highly-integrated solution for optimally controlling 3-phase motor power inverter systems and variable speed control systems used in energy-conserving designs to drive motors of residential and commercial appliances. These ICs take 230 VAC input voltage, and 3 A (continuous) output current. They can withstand voltages of up to 600 V (IGBT breakdown voltage). The SLA6840M power package includes an IC with all of the necessary power elements (six IGBTs), pre-driver ICs (two), and freewheeling diodes (six), needed to configure the main circuit of an inverter. This enables the main circuit of the inverter to be configured with fewer external components than traditional designs. Applications include residential white goods (home applications) and commercial appliance motor control: • Air conditioner fan • Refrigerator compressor • Dishwasher pump Package: Power SIP Leadform 2171 Leadform 2178 Leadform 2175 Not to scale Functional Block Diagram VB 1 VB 2 VB3 VBB 1 VCC1 VBB 2 UVLO HIN1 HIN2 HIN3 Input Logic UVLO UVLO UVLO High Side Level Shift Driver COM1 VCC2 VREG LIN1 LIN2 LIN3 7.5 V Reg. UVLO Input Logic COM2 FO Figure 1. Driver block diagram. SLA6845MZ-DS Overtemperature Detection U V W1 W2 Low Side Driver LS3 LS2 LS1 SLA6845MZ High Voltage 3-Phase Motor Driver Selection Guide Output Current Part Number Packing IGBT Breakdown Voltage, VCES(min) (V) IGBT Saturation Voltage, VCE(sat)(typ) (V) Continuous, IO(max) (A) Pulsed, IOP (max) (A) SLA6845MZ 18 pieces per tube 600 1.75 3 6 Absolute Maximum Ratings, valid at TA = 25°C Characteristic Symbol Main Supply Voltage VBB Main Supply Voltage (Peak) VBB(surge) Remarks Rating Unit Maximum voltage that can be applied between VBB and LSx continuously 450 V Maximum voltage allowed between VBB and LSx, including transient switching noise. If surge voltages reach this rating, the snubber circuit should be improved so the voltage does not exceed this level. 500 V IGBT Breakdown Voltage VCES 600 V Logic Supply Voltage VCC Between VCC and COM 20 V Bootstrap Voltage VBS Between VB and HS (U,V, and W phases) 20 V IO TC = 25°C 3 A Output Current, Pulsed IOP PW ≤ 100 μs Output Current for Regulator IREG Input Voltage VIN Allowable Power Dissipation PD Output Current, Continuous Thermal Resistance (Junction to Case) TC = 25°C, all elements operating 6 A 35 mA –0.5 to 7 V 32 W RθJC(I) All elements operating (IGBT) 3.8 °C/W RθJC(F) All elements operating (FRD) 4.2 °C/W Thermal Resistance (Junction to Ambient) RθJA 25 °C/W Case Operating Temperature TCOP All elements operating (IGBT and FRD) –20 to 100 °C Junction Temperature (IGBT) TJ 150 °C Storage Temperature Tstg –40 to 150 °C Max. Units Recommended Operating Conditions Characteristic Symbol Remarks Main Supply Voltage VBB Between VBB and LS, IBB ≤ 2 A Logic Supply Voltage VCC Between VCC and COM RS Min. Typ. – 300 450 V 13.5 – 16.5 V LS1, LS2, LS3 to COM2 0.3 – – Ω Dead Time tdead Between LS1, LS2, LS3 and COM 1.5 – – μs Overcurrent Protection (OCP) Response Time tOCP No built-in OCP. If OCP required, implement using an external circuit. Measure tOCP from overcurrent occurrence to shutdown command received on corresponding HINx or LINx terminal. – – 2.0 μs Snubber Capacitor CS Between VCC and COM. Use properly-rated film capacitor for voltage surge suppression. 0.01 – 0.1 μF Junction Temperature TJ – – 125 °C Shunt Resistor All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25°C, unless otherwise stated. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 2 SLA6845MZ High Voltage 3-Phase Motor Driver Typical Application Diagram DBOOT RBOOT 2 3 4 VB1 VB2 VB3 SLA6845MZ 11 10 5 VCC1 HO1 HVIC HS1 1 HO2 9 8 7 6 HS2 13 M HIN1 HIN2 HIN3 HO3 COM1 HS3 Cs 12 14 23 VCC2 LVIC Controller LO1 24 20 19 18 16 LIN1 LO2 17 LIN2 LIN3 LO3 VREG 15 CC 22 21 FO COM2 RS 15V NOTE: ▪ All of the input pins are connected to GND with internal pull-down resistors rated at 100 kΩ, however, an external pull-down resistor may be required to secure stable condition of the inputs if high impedance conditions are applied to them. ▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise susceptibility is necessary. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 3 SLA6845MZ High Voltage 3-Phase Motor Driver ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Logic Supply Voltage Logic Supply Current Input Voltage Input Voltage Hysteresis Input Current Symbol Between VCC and COM FO Terminal Output Voltage Overtemperature Detection Activating and Releasing Temperature Units 16.5 V – 4 6 mA VCC = 15 V, output on – 2.0 2.5 V VIL VCC = 15 V, output off 1.0 1.5 – V – 0.5 – V VIhys VCC = 15 V IIH High side, VCC = 15 V, VIN = 5 V – 50 100 μA IIL Low side, VCC = 15 V, VIN = 0 V – – 2 μA 9.0 10.0 11.0 V 9.5 10.5 11.5 V – 0.5 – V VUVHhys VUVLL VUVLhys LS Negative Surge Max 15 VCC = 15 V, VIN = 5 V VUVLH Voltage2 Typ ICC VUVHL –VO for Output Voltage1 Min 13.5 VIH VUVHH Undervoltage Lockout Conditions VCC High side, between VB and U, V, or W High side, hysteresis Low side, between VCC and COM 10.0 11.0 12.0 V 10.5 11.5 12.5 V Low side, hysteresis – 0.5 – V –VO Between U, V, or W and COM –5 – – V VLS Between LS1, LS2, or LS3 and COM –5 – 5 V VFOL VCC = 15 V, IFO = –1 mA 0 – 1.0 V VFOH VCC = 15 V, IFO = –1.6 mA TTDH TTDL VCC = 15 V, no heatsink, IREG = 0 mA TTDhys 4.0 – 5.5 V 135 150 165 °C 105 120 135 °C – 30 – °C V Output Voltage for Regulator VREG IREG = 0 to 35 mA 6.75 7.5 8.25 IGBT Breakdown Voltage VCES VCC = 15 V, IC = 1 mA, VIN = 0 V 600 – – V IGBT Leakage Current ICES VCC = 15 V, VCE = 600 V, VIN = 0 V – – 1 mA IGBT Saturation Voltage VCE(sat) VCC = 15 V, IC = 3 A, VIN = 5 V – 1.75 2.1 V Diode Forward Voltage VF VCC = 15 V, IF = 3 A, VIN = 0 V – 1.65 2.0 V trr IF = 3 A, di / dt = 100 A/μs Diode Recovery Time Switching Time, High Side – 50 – ns tdH(on) – 315 – ns trH – 50 – ns tdH(off) – 375 – ns – 165 – ns – 325 – ns trL – 60 – ns tdL(off) – 400 – ns tfL – 165 – ns tfH tdL(on) Switching Time, Low Side 1Indicates 2Indicates VBB = 300 V, VCC = 15 V, IC = 3 A, 0 V ≤ VIN ≤ 5 V, inductive load normal operating range for the high-side driver IC. the allowable range assuming any transient surge <1 μs. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 4 SLA6845MZ High Voltage 3-Phase Motor Driver High-Side Driver Input/Output Timing Diagrams V V • High-side turn-on at next rising edge on HIN signal after UVLO release. • FO output state does not change at high-side UVLO. Low-Side Driver Input/Output Timing Diagrams V V T T • Low-side turn-on in accordance with LIN signal level after UVLO release. • FO output state goes high at low-side UVLO. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 5 SLA6845MZ High Voltage 3-Phase Motor Driver Pin-out Diagram Pad Side 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 21 20 23 22 24 (Top View) Terminal List Table Number 1 Name U Function 2 VB1 High side bootstrap terminal (U phase) 3 VB2 High side bootstrap terminal (V phase) Output of U phase 4 VB3 5 VCC1 High side logic supply voltage High side bootstrap terminal (W phase) 6 COM1 High side logic GND terminal 7 HIN3 High side input terminal (W phase) 8 HIN2 High side input terminal (V phase) 9 HIN1 High side input terminal (U phase) 10 VBB1 Main supply voltage 1 (connect to VBB2 externally) 11 VBB2 Main supply voltage 2 (connect to VBB1 externally) 12 W1 Output of W phase (connect to W2 externally) 13 V 14 W2 Output of W phase (connect to W1 externally) 15 LS3 Low side emitter terminal (W phase) 16 VREG 17 LS2 Low side emitter terminal (V phase) 18 LIN3 Low side input terminal (W phase) 19 LIN2 Low side input terminal (V phase) 20 LIN1 Low side input terminal (U phase) 21 COM2 22 FO 23 VCC2 24 LS1 Output of V phase Internal regulator output terminal Low side GND terminal Overtemperature detection fault-signal output terminal Low side logic supply voltage Low side source terminal (U phase) Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 6 SLA6845MZ High Voltage 3-Phase Motor Driver Package Outline Drawing Leadform 2171 Dual rows, 24 alternating pins; vertical case mounting; pin #1 on pad side Exposed heatsink pad 31.3 ±0.2 31 ±0.2 24.4 ±0.2 16.4 ±0.2 4.8 ±0.2 0.6 Gate protrusion 1.7 ±0.1 Ø3.2 ±0.15 Ø3.2 ±0.15 2X Gate protrusion 2.45 ±0.2 BSC 16 ±0.2 B 12.9 ±0.2 9.9 ±0.2 Branding Area 5 ±0.5 9.5 +0.7 – 0.5 View A 2 1 4 3 6 5 8 7 10 9 12 11 14 13 16 15 18 17 20 19 22 21 4.5 REF Measured at pin tips B To case top 4.5 ±0.7 24 23 0.7 MAX A R1 REF +0.15 0.5 – 0.05 1.27 ±0.7 A 0.6 +0.15 – 0.05 Heatsink exposed this side 2X Exposed tie bar 0.7 MAX Deflection at pin bend View A Leadform: 2171 Terminal core material: Cu Terminal plating: Ni Recommended attachment: Solder dip (Sn-Ag-Cu) Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, type: SLA6845M 2nd line, lot: YMDDZ Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date Z represents the version, SLA6845MZ Leadframe plating Pb-free. Device composition complies with the RoHS directive. Appearance: The body shall be clean and shall not bear any stain, rust or flaw. Marking: The type number and lot number shall be clearly marked. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 7 SLA6845MZ High Voltage 3-Phase Motor Driver Package Outline Drawing Leadform 2175 Dual rows, 24 alternating pins; pins bent 90° for horizontal case mounting; pin #1 in outer row Exposed heatsink pad 31.3 ±0.1 31 ±0.2 24.4 ±0.2 16.4 ±0.2 Gate protrusion 4.8 ±0.2 0.6 1.7 ±0.1 Ø3.2 ±0.15 Ø3.2 ±0.15 2X Gate protrusion 2.45 ±0.1 BSC 16 ±0.2 B 12.9 ±0.2 9.9 ±0.1 Branding Area 3 ±0.3 BSC 2X Exposed tie bar 2.2 ±0.6 BSC 4.4 REF 0.6 +0.2 – 0.1 View A 1.27 ±0.2 A 2.2 ±0.6 BSC R1 REF 0.5 ±0.1 1 2 3 5 7 9 11 13 15 17 19 21 23 16 4 6 18 8 12 14 20 10 22 24 0.7 MAX A Measured at pin exit from case B To case top 0.7 MAX Deflection at pin bend View A Leadform: 2175 Terminal core material: Cu Terminal plating: Ni Recommended attachment: Solder dip (Sn-Ag-Cu) Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, type: SLA6845M 2nd line, lot: YMDDZ Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date Z represents the version, SLA6845MZ Leadframe plating Pb-free. Device composition complies with the RoHS directive. Appearance: The body shall be clean and shall not bear any stain, rust or flaw. Marking: The type number and lot number shall be clearly marked. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 8 SLA6845MZ High Voltage 3-Phase Motor Driver Package Outline Drawing Leadform 2178 Dual rows, 24 alternating pins; vertical case mounting; pin #1 on pad side Exposed heatsink pad 31.3 ±0.2 31 ±0.2 24.4 ±0.2 16.4 ±0.2 4.8 ±0.2 0.6 Gate protrusion 1.7 ±0.1 Ø3.2 ±0.15 x3.8 Ø3.2 ±0.15 2X Gate protrusion 2.45 ±0.2 16 ±0.2 B 12.9 ±0.2 9.9 ±0.2 Branding Area 5 ±0.5 8 ±0.5 2 1 4 3 6 5 A Measured at pin tips B To case top 8 7 10 9 12 11 14 13 16 15 18 17 4.5 ±0.7 1.27 ±0.7 A 20 19 R1 REF +0.15 0.5 – 0.05 3 REF 0.6 +0.15 – 0.05 View A Heatsink exposed this side 2X Exposed tie bar 22 21 24 23 Leadform: 2178 Terminal core material: Cu Terminal plating: Ni Recommended attachment: Solder dip (Sn-Ag-Cu) Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, type: SLA6845M 2nd line, lot: YMDDZ Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date Z represents the version, SLA6845MZ Leadframe plating Pb-free. Device composition complies with the RoHS directive. Appearance: The body shall be clean and shall not bear any stain, rust or flaw. Marking: The type number and lot number shall be clearly marked. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 9 SLA6845MZ High Voltage 3-Phase Motor Driver Packing Specification Leadform 2171 Dimensions in millimeters 31.2 580 Tube material: PVC Maximum 18 pieces per tube (pins aligned along X direction) Rubber plug each end 13.8 X 137 621 186 Z Maximum 12 tubes in Y direction Maximum 3 tubes in Z direction Y Maximum pieces per carton: 18 pieces per tube 12 tubes per layer x 3 layers of tubes 648 pieces per carton Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 10 SLA6845MZ High Voltage 3-Phase Motor Driver Packing Specification Leadform 2175 Dimensions in millimeters 31.0 580 15.8 X Tube material: PVC Maximum 18 pieces per tube (pins aligned along X direction) Rubber plug each end 130 610 185 Z Y Maximum 10 tubes in Y direction Maximum 3 layers in Z direction Maximum pieces per carton: 18 pieces per tube 10 tubes per layer x 3 layers of tubes 540 pieces per carton Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 11 SLA6845MZ High Voltage 3-Phase Motor Driver Packing Specification Leadform 2178 Dimensions in millimeters 31.2 580 Tube material: PVC Maximum 18 pieces per tube (pins aligned along X direction) Rubber plug each end 13.8 X 137 621 186 Z Y Maximum 12 tubes in Y direction Maximum 3 tubes in Z direction Maximum pieces per carton: 18 pieces per tube 12 tubes per layer x 3 layers of tubes 648 pieces per carton Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 12 SLA6845MZ High Voltage 3-Phase Motor Driver WARNING — These devices are designed to be operated at lethal voltages and energy levels. Circuit designs that embody these components must conform with applicable safety requirements. Precautions must be taken to prevent accidental contact with power-line potentials. Do not connect grounded test equipment. The use of an isolation transformer is recommended during circuit development and breadboarding. Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40 to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between adjacent products, and shorts to the heatsink. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce stress. • Volatile-type silicone greases may permeate the product and produce cracks after long periods of time, resulting in reduced heat radiation effect, and possibly shortening the lifetime of the product. • Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials, Inc. SC102 Dow Corning Toray Silicone Co., Ltd. Heatsink Mounting Method Torque When Tightening Mounting Screws. The recommended tightening torque for this product package type is: 58.8 to 78.4 N•cm (6.0 to 8.0 kgf•cm). Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10 s 380±5°C • 5s Soldering iron should be at a distance of at least 1.5 mm from the body of the products Electrostatic Discharge • When handling the products, operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance to ground to prevent shock hazard. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in other to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in our shipping containers or conductive containers, or be wrapped in aluminum foil. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 13 SLA6845MZ High Voltage 3-Phase Motor Driver The products described herein are manufactured in Japan by Sanken Electric Co., Ltd. for sale by Allegro MicroSystems, Inc. Sanken and Allegro reserve the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, or manufacturability of its products. Therefore, the user is cautioned to verify that the information in this publication is current before placing any order. When using the products described herein, the applicability and suitability of such products for the intended purpose shall be reviewed at the users responsibility. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to society due to device failure or malfunction. Sanken products listed in this publication are designed and intended for use as components in general-purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Their use in any application requiring radiation hardness assurance (e.g., aerospace equipment) is not supported. When considering the use of Sanken products in applications where higher reliability is required (transportation equipment and its control systems or equipment, fire- or burglar-alarm systems, various safety devices, etc.), contact a company sales representative to discuss and obtain written confirmation of your specifications. The use of Sanken products without the written consent of Sanken in applications where extremely high reliability is required (aerospace equipment, nuclear power-control stations, life-support systems, etc.) is strictly prohibited. The information included herein is believed to be accurate and reliable. Application and operation examples described in this publication are given for reference only and Sanken and Allegro assume no responsibility for any infringement of industrial property rights, intellectual property rights, or any other rights of Sanken or Allegro or any third party that may result from its use. The contents in this document must not be transcribed or copied without Sanken’s written consent. Copyright © 2011 Allegro MicroSystems, Inc. Allegro MicroSystems, Inc. 115 Northeast Cutoff, Box 15036 Worcester, Massachusetts 01615-0036 (508) 853-5000 www.allegromicro.com 14