74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer Rev. 1 — 8 March 2016 Product data sheet 1. General description The 74AHC1G17-Q100 and 74AHCT1G17-Q100 are single buffers with Schmitt-trigger inputs. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments. The AHC device has CMOS input switching levels and supply voltage range 2 V to 5.5 V. The AHCT device has TTL input switching levels and supply voltage range 4.5 V to 5.5 V. This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications. 2. Features and benefits Automotive product qualification in accordance with AEC-Q100 (Grade 1) Specified from 40 C to +85 C and from 40 C to +125 C Symmetrical output impedance High noise immunity ESD protection: MIL-STD-883, method 3015 exceeds 2000 V HBM JESD22-A114F exceeds 2000 V MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 ) Low power dissipation Balanced propagation delays 3. Applications Wave and pulse shapers Astable multivibrators Monostable multivibrators NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 4. Ordering information Table 1. Ordering information Type number Package 74AHC1G17GW-Q100 Temperature range Name Description Version 40 C to +125 C plastic thin shrink small outline package; 5 leads; body width 1.25 mm SOT353-1 74AHCT1G17GW-Q100 TSSOP5 5. Marking Table 2. Marking codes Type number Marking code[1] 74AHC1G17GW-Q100 AJ 74AHCT1G17GW-Q100 CJ [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 6. Functional diagram $ < PQE Fig 1. PQE Logic symbol Fig 2. IEC logic symbol $ < PQE Fig 3. Logic diagram 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 7. Pinning information 7.1 Pinning $+&*4 $+&7*4 QF $ *1' 9&& < DDD Fig 4. Pin configuration SOT353-1 7.2 Pin description Table 3. Pin description Symbol Pin Description n.c. 1 not connected A 2 data input GND 3 ground (0 V) Y 4 data output VCC 5 supply voltage 8. Functional description Table 4. Function table H = HIGH voltage level; L = LOW voltage level Input Output A Y L L H H 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 9. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage VI input voltage IIK input clamping current VI < 0.5 V IOK output clamping current VO < 0.5 V or VO > VCC + 0.5 V IO output current 0.5 V < VO < VCC + 0.5 V ICC IGND Tstg storage temperature Min Max Unit 0.5 +7.0 V 0.5 +7.0 20 - mA - 20 mA - 25 mA supply current - 75 mA ground current 75 - mA 65 +150 C - 250 mW total power dissipation Ptot Conditions [1] Tamb = 40 C to +125 C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For TSSOP5 package: above 87.5 C the value of Ptot derates linearly with 4.0 mW/K. V 10. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions 74AHC1G17-Q100 Min Typ 74AHCT1G17-Q100 Max Min Typ Unit Max VCC supply voltage 2.0 5.0 5.5 4.5 5.0 5.5 V VI input voltage 0 - 5.5 0 - 5.5 V VO output voltage 0 - VCC 0 - VCC V Tamb ambient temperature 40 +25 +125 40 +25 +125 C 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 11. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max HIGH-level VI = VT+ or VT output voltage IO = 50 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V IO = 50 A; VCC = 3.0 V 2.9 3.0 - 2.9 - 2.9 - V IO = 50 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V IO = 4.0 mA; VCC = 3.0 V 2.58 - - 2.48 - 2.40 - V IO = 8.0 mA; VCC = 4.5 V 3.94 - - 3.8 - 3.70 - V LOW-level VI = VT+ or VT output voltage IO = 50 A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 A; VCC = 3.0 V - 0 0.1 - 0.1 - 0.1 V IO = 50 A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V IO = 4.0 mA; VCC = 3.0 V - - 0.36 - 0.44 - 0.55 V 74AHC1G17-Q100 VOH VOL IO = 8.0 mA; VCC = 4.5 V - - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 A supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 A input capacitance - 1.5 10 - 10 - 10 pF 4.4 4.5 - 4.4 - 4.4 - V 3.94 - - 3.8 - 3.70 - V II input leakage current ICC CI VI = 5.5 V or GND; VCC = 0 V to 5.5 V 74AHCT1G17-Q100 VOH HIGH-level VI = VT+ or VT; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA VOL LOW-level VI = VT+ or VT; VCC = 4.5 V output voltage IO = 50 A IO = 8.0 mA 0 0.1 - 0.1 - 0.1 V - 0.36 - 0.44 - 0.55 V - - 0.1 - 1.0 - 2.0 A II input leakage current ICC supply current VI = VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.0 - 10 - 40 A ICC additional per input pin; VI = 3.4 V; supply current other inputs at VCC or GND; IO = 0 A; VCC = 5.5 V - - 1.35 - 1.5 - 1.5 mA CI input capacitance - 1.5 10 - 10 - 10 pF 74AHC_AHCT1G17_Q100 Product data sheet VI = 5.5 V or GND; VCC = 0 V to 5.5 V - All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 11.1 Transfer characteristics Table 8. Transfer characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). See Figure 7 and Figure 8. Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max VCC = 3.0 V - - 2.2 - 2.2 - 2.2 V VCC = 4.5 V - - 3.15 - 3.15 - 3.15 V VCC = 5.5 V - - 3.85 - 3.85 - 3.85 V VCC = 3.0 V 0.9 - - 0.9 - 0.9 - V VCC = 4.5 V 1.35 - - 1.35 - 1.35 - V VCC = 5.5 V 1.65 - - 1.65 - 1.65 - V VCC = 3.0 V 0.3 - 1.2 0.3 1.2 0.25 1.2 V VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.5 - 1.6 0.5 1.6 0.45 1.6 V VCC = 4.5 V - - 2.0 - 2.0 - 2.0 V VCC = 5.5 V - - 2.0 - 2.0 - 2.0 V negative-going threshold voltage VCC = 4.5 V 0.5 - - 0.5 - 0.5 - V VCC = 5.5 V 0.6 - - 0.6 - 0.6 - V hysteresis voltage VCC = 4.5 V 0.4 - 1.4 0.4 1.4 0.35 1.4 V VCC = 5.5 V 0.4 - 1.6 0.4 1.6 0.35 1.6 V 74AHC1G17-Q100 VT+ VT VH positive-going threshold voltage negative-going threshold voltage hysteresis voltage 74AHCT1G17-Q100 VT+ VT VH positive-going threshold voltage 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 12. Dynamic characteristics Table 9. Dynamic characteristics GND = 0 V; tr = tf 3.0 ns. For waveform, see Figure 5. For test circuit, see Figure 6. Symbol Parameter 25 C Conditions 40 C to +85 C 40 C to +125 C Unit Min Typ Max Min Max Min Max - 4.2 12.8 1.0 15.0 1.0 16.5 ns - 6.0 16.3 1.0 18.5 1.0 20.5 ns - 3.2 8.6 1.0 10.0 1.0 11.0 ns - 4.6 10.6 1.0 12.0 1.0 13.5 ns - 12 - - - - - pF - 4.1 7.0 1.0 8.0 1.0 9.0 ns - 5.9 8.5 1.0 10.0 1.0 11.0 ns - 13 - - - - - pF 74AHC1G17-Q100 tpd propagation delay [1] A to Y; VCC = 3.0 V to 3.6 V [2] CL = 15 pF CL = 50 pF VCC = 4.5 V to 5.5 V [3] CL = 15 pF CL = 50 pF CPD power dissipation capacitance per buffer; CL = 50 pF; f = 1 MHz; VI = GND to VCC [4] 74AHCT1G17-Q100 tpd propagation delay A to Y; VCC = 4.5 V to 5.5 V [1][3] CL = 15 pF CL = 50 pF CPD power dissipation capacitance [4] per buffer; VI = GND to VCC [1] tpd is the same as tPLH and tPHL. [2] Typical values are measured at VCC = 3.3 V. [3] Typical values are measured at VCC = 5.0 V. [4] CPD is used to determine the dynamic power dissipation PD (W). PD = CPD VCC2 fi + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 13. Waveforms 9, $LQSXW 90 90 *1' W3+/ W3/+ 9&& 92+ <RXWSXW 92/ W7/+ 9, 38/6( *(1(5$725 92 '87 &/ 57 W7+/ PQD DDD The test data is given in Table 10 Test data is given in Table 9. Definitions for test circuit: CL = Load capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. Fig 5. Table 10. The input (A) to output (Y) propagation delays Fig 6. Test circuit for measuring switching times Test data Type number Input Output VI VM VM 74AHC1G17-Q100 GND to VCC 0.5 VCC 0.5 VCC 74AHCT1G17-Q100 GND to 3.0 V 1.5 V 0.5 VCC 13.1 Transfer characteristic waveforms 92 9, 97 9+ 97 97 Fig 7. 97 Transfer characteristic 74AHC_AHCT1G17_Q100 Product data sheet 92 9, 9+ PQE PQE Fig 8. The definitions of VT+, VT and VH All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer PQD PQD ,&& P$ ,&& P$ Fig 9. 9,9 Typical 74AHC1G17-Q100 transfer characteristics; VCC = 3.0 V 9 9 , Fig 10. Typical 74AHC1G17-Q100 transfer characteristics; VCC = 4.5 V PQD ,&& P$ 9,9 Fig 11. Typical 74AHC1G17-Q100 transfer characteristics; VCC = 5.5 V 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer PQD PQD ,&& P$ ,&& P$ 9 9 , 9,9 Fig 13. Typical 74AHCT1G17-Q100 transfer characteristics; VCC = 5.5 V Fig 12. Typical 74AHCT1G17-Q100 transfer characteristics; VCC = 4.5 V 14. Application information The slow input rise and fall times cause additional power dissipation, which can be calculated using the following formula: Padd = fi (tr ICC(AV) + tf ICC(AV)) VCC where: Padd = additional power dissipation (W); fi = input frequency (MHz); tr = input rise time (ns); 10 % to 90 %; tf = input fall time (ns); 90 % to 10 %; ICC(AV) = average additional supply current (A). Average additional ICC differs with positive or negative input transitions, as shown in Figure 14 and Figure 15. 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer PQD PQD ǻ,&&$9 $ ǻ,&&$9 $ SRVLWLYHJRLQJ HGJH SRVLWLYHJRLQJ HGJH QHJDWLYHJRLQJ HGJH 9&&9 Fig 14. Average additional ICC for 74AHC1G17-Q100 Schmitt trigger devices; linear change of VI between 0.1VCC to 0.9VCC 74AHC_AHCT1G17_Q100 Product data sheet QHJDWLYHJRLQJ HGJH 9&&9 Fig 15. Average additional ICC for 74AHCT1G17-Q100 Schmitt trigger devices; linear change of VI between 0.1VCC to 0.9VCC All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 16 74AHC1G17-Q100; 74AHCT1G17-Q100 NXP Semiconductors Single Schmitt trigger buffer 15. Package outline 76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP ( ' 627 $ ; F \ +( Y 0 $ = $ $ $ $ ș /S H / Z 0 ES GHWDLO; H PP VFDOH ',0(16,216PPDUHWKHRULJLQDOGLPHQVLRQV 81,7 $ PD[ $ $ $ ES F ' ( H H +( PP / /S Y Z \ = ș 1RWH 3ODVWLFRUPHWDOSURWUXVLRQVRIPPPD[LPXPSHUVLGHDUHQRWLQFOXGHG 287/,1( 9(56,21 627 5()(5(1&(6 ,(& -('(& -(,7$ 02 6&$ (8523($1 352-(&7,21 ,668('$7( Fig 16. Package outline SOT353-1 (TSSOP5) 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 16. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic MIL Military 17. Revision history Table 12. Revision history Document ID Release date 74AHC_AHCT1G17_Q100 v.1 20160308 74AHC_AHCT1G17_Q100 Product data sheet Data sheet status Change notice Supersedes Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 - © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 18. Legal information 18.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 18.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. 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However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 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Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 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Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 14 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 18.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 19. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] 74AHC_AHCT1G17_Q100 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 8 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 15 of 16 NXP Semiconductors 74AHC1G17-Q100; 74AHCT1G17-Q100 Single Schmitt trigger buffer 20. Contents 1 2 3 4 5 6 7 7.1 7.2 8 9 10 11 11.1 12 13 13.1 14 15 16 17 18 18.1 18.2 18.3 18.4 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Transfer characteristics . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Transfer characteristic waveforms . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 8 March 2016 Document identifier: 74AHC_AHCT1G17_Q100