No.12102571 Process Guidelines Laminate R-1755E Prepreg R-1650E High Reliability Glass Epoxy Multi-layer Materials No. 12102571-1 General Material Storage R-1755E laminate and R-1650E prepreg is the same as our conventional FR-4 material. Laminate should be stored flat in a cool dry environment. Avoid bending or scratching the laminate surface. When possible store the laminate in the original container. Prepreg should be stored flat in a cool dry controlled environment, 68 F(20 C) or less and 50% RH or less. Laminate Surface Preparation Regular Shiny Copper can be cleaned using industry standard chemical clean or mechanical clean. Reverse Treat Copper should be cleaned using industry standard chemical clean. Inner Layer Bond Treatment Black or Brown Oxide is not preferred. Alternative Oxide Treatment using a Peroxide/Sulfuric etch technology can be used. Drying Dry finished inner layers completely to remove any absorbed moisture or surface moisture. A racked bake at 225 F(105 C) for 20-30 minutes is preferred. For conveyorized alternative oxide processing, some equipment may have sufficient drying capability. However, a racked bake is suggested. The following guidelines are provided as general recommendations. Process optimization may be necessary. No. 12102571-2 Drilling (1) Drilling parameters in general condition Drilling parameters should be adjusted depending on hole size, layer count, panel thickness, stack count and stack height etc. (1) Drilling parameters in general condition min max diameter ｓpindle velocity infeed chipload infeed chipload mm 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 rpm 160,000 160,000 160,000 137,000 120,000 107,000 96,000 87,000 80,000 74,000 68,000 64,000 60,000 56,000 53,000 m/min 100 126 151 151 151 151 151 150 151 151 149 151 151 149 150 m/min 1.6 1.8 1.9 1.8 1.8 1.8 1.8 1.8 1.7 1.7 1.7 1.6 1.6 1.6 1.6 μ/rev 10 11 12 13 15 17 19 21 21 23 25 25 27 29 30 m/min 2.4 2.8 3.2 3.0 2.9 2.7 2.7 2.6 2.6 2.6 2.6 2.6 2.5 2.4 2.4 μ/rev 15 18 20 22 24 25 28 30 33 35 38 41 42 43 45 The following guidelines are provided as general recommendations. Process optimization may be necessary. bit life hits 1,000-2,000 1,000-2,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 2,000-3,000 No. 12102571-3 Drilling (2)Positioning accuracy (2) Positioning accuracy Drill size mm 0.3 Surface speed m/min 151 Revolution rpm Chip load micron/rev Hit count 160000 20 5000 0.15 Aluminum Entry board (lubricated is preferred) Panel thickness mm Copper thickness micron Stack count 1.6 ( #7628 X 8 ) 35 / 35 2 Positioning accuracy map of R-1755E and R-1766 as our conventional FR-4 R-1755E -0.100 -0.050 R-1766 0.100 0.100 0.050 0.050 0.000 0.000 0.050 0.100 -0.100 -0.050 0.000 0.000 -0.050 -0.050 -0.100 -0.100 positioning accuracy : 46.2 micron 0.050 0.100 positioning accuracy : 53.7 micron The following guidelines are provided as general recommendations. Process optimization may be necessary. No. 12102571-4 Laminate Curing temperature time will be determined by the thickness of multilayer package being laminated. Laminate parameters should be adjusted depending on board thickness, stack count and stack thickness etc. Please Note : below is NOT a press control program. The graph represents the recommended pressure/temperature profile that the actual panels are subjected to during the lamination program cycle. Product temp ： over 170C over 50min 200 ↑ Product 130 Heat up rate ( 1 – 3C/min ) 100 Pressure 2.0 - 2.9MPa Ramping up of pressure is started after 80 to 100C of material temp. 20 ↑1.0MPa 20 - 30min 30 60 Time （min） max. 100torr ( 13.3kPa ) Vacuum : Start - 60min The following guidelines are provided as general recommendations. Process optimization may be necessary. Pressure (kg/cm2) Temperature ( C ) 180 No. 12102571-5 Desmear The weight loss of R-1755E laminate and R-1650E prepreg is almost same as that of R-1766 as our conventional FR-4 material. Desmear parameters should be adjusted depending on board thickness, stack count and stack thickness etc. process reagent type temp. (C) time (min) Swelling alkaline 65-85 5-10 Etching permanganate 70-85 10-15 process reagent type temp. (C) time (min) Swelling organic solvent 35-40 6-10 Etching permanganate 70-85 10-15 Part number Weight loss ratio R-1755E 0.8 - 1.2 R-1766 1.0 The following guidelines are provided as general recommendations. Process optimization may be necessary. No. 12102571-6 ++Before purchase++ * If delivery specifications have been agreed upon, descriptions in the delivery specifications take precedence. * Specifications and appearances are subject to change without prior notice for product improvement. * For details of the products contained in this catalog, contact your dealer or our sales representative. * ALL data are our actual values and not assured values. 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