T PL IA N M CO *R oH S Features Applications ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ AEC-Q200 qualified Meets IEC 61000-4-2 standard Multilayered varistor technology Proprietary insulating overcoat provides low and stable leakage current Quick response time (<0.5 ns) High transient current capability High reliability RoHS compliant* HDMI CANbus Ethernet GPS Camera links Sensors Touchscreen interfaces Circuits sensitive to ESD ChipGuard® Automotive MLA Series Varistor ESD Clamp Protectors Device Symbol Description Bourns® ChipGuard® Automotive MLA Series is a multlayered varistor designed specifically for use in automotive circuits requiring ESD protection. The CGA-MLA series is available in industry standard 0603, 0805 and 1206 packages. These robust protectors exhibit extremely fast response times to ESD events making them ideal for protecting a wide array automotive electronics. ChipGuard® Automotive MLA Series products are fully AEC-Q200 qualified and supported. Electrical Characteristics @ 25 °C (unless otherwise noted) Model Package Vrms (V) VDC (V) <10 µA CGA0603MLA-16150E CGA0603MLA-16121E CGA0603MLA-17300E CGA0603MLA-18101E CGA0603MLA-19161E CGA0603MLA-22750E CGA0603MLA-22500E CGA0603MLA-22101E CGA0603MLA-22161E CGA0603MLA-26800E CGA0603MLA-31900E CGA0603MLA-32120E CGA0805MLA--16401E CGA0805MLA-18351E CGA0805MLA-22101E CGA0805MLA-22401E CGA0805MLA-26221E CGA0805MLA-31251E CGA0805MLA-38201E CGA1206MLA-16801E CGA1206MLA-16701E CGA1206MLA-22651E CGA1206MLA-22841E CGA1206MLA-26601E CGA1206MLA-31551E CGA1206MLA-38501E CGA1206MLA-40181E 0603 0805 1206 14 14 14 14 14 17 17 17 17 20 25 25 14 14 17 17 20 25 30 14 14 17 17 20 25 30 40 VN Min. (V) VN Max. (V) 1 mA DC 16 16 17 18 19 22 22 22 22 26 31 32 16 18 22 22 26 31 38 16 16 22 22 26 31 38 56 23.0 22.0 21.6 19.8 24.0 25.0 24.3 24.3 24.3 30.0 35.0 51.9 22.0 19.8 25.0 24.3 29.7 35.1 42.3 22.0 19.8 24.3 24.3 29.7 35.1 42.3 63.0 34.2 28.0 34.4 25.2 32.0 41.0 30.7 30.7 30.7 43.0 43.9 71.0 28.0 25.2 34.0 30.7 37.3 43.9 52.7 28.0 25.2 30.7 29.7 37.3 43.9 52.7 77.0 VC (V) 1A@ 8/20 µs 70 46 70 44 64 54 54 50 50 67 71 124 46 44 54 50 56 71 81 44 42 48 50 58 69 81 110 ITM (Max.) (A) WTM (Max.) (J) CP (pF) Typ. @ 8/20 µs 10/1000 µs @ 1 KHz 5 30 2 30 20 30 10 30 30 30 30 5 120 120 30 120 80 80 80 200 200 200 100 200 200 200 200 0.030 0.200 0.050 0.200 0.100 0.075 0.100 0.200 0.200 0.100 0.200 0.250 0.3 0.3 0.1 0.3 0.4 0.3 0.3 0.60 0.50 0.30 0.40 0.70 1.00 1.10 1.00 15 120 30 100 160 75 50 100 160 80 90 12 400 350 100 400 220 250 200 800 700 650 840 600 550 500 180 General Characteristics Operating Temperature................................................................................................................................................... -55 °C to +125 °C Storage Temperature ...................................................................................................................................................... -55 °C to +150 °C Response Time...................................................................................................................................................................................<1 ns Performance Standard ........................................................................................................................................................ IEC 61000-4-2 *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ChipGuard® Automotive MLA Series Varistor ESD Clamp Protectors Product Dimensions Recommended Pad Layout TOP VIEW SIDE VIEW D W T C L C B C A DIMENSIONS: MM (INCHES) Note: Print solder to a recommended thickness of 150 to 200 µm. CGA0603MLA Series CGA0805MLA Series CGA1206MLA Series L 1.60 ± 0.15 (0.063 ± 0.006) 2.00 ± 0.20 (0.079 ± 0.008) 3.20 ± 0.30 (0.126 ± 0.012) W 0.80 ± 0.10 (0.031 ± 0.004) 1.25 ± 0.20 (0.049 ± 0.008) T 0.80 ± 0.10 (0.031 ± 0.004) C 0.30 ± 0.15 (0.012 ± 0.006) Dim. Construction CGA0603MLA Series CGA0805MLA Series CGA1206MLA Series A 2.54 (0.100) 3.50 (0.137) 4.06 (0.160) 1.60 ± 0.20 (0.063 ± 0.008) B 0.50 (0.020) 1.10 (0.043) 2.02 (0.080) 0.90 ± 0.10 (0.035 ± 0.004) 1.70 MAX. (0.067) C 1.02 (0.040) 1.20 (0.047) 1.02 (0.040) 0.50 ± 0.25 (0.020 ± 0.010) 0.50 ± 0.25 (0.020 ± 0.010) D 0.76 (0.030) 1.20 (0.047) 1.65 (0.065) Dim. How to Order CG A xx0x MLA - xx yyy E ChipGuard® Product Designator Automotive Series Package Option 0603 = 1608 Package 0805 = 2012 Package 1206 = 3216 Package Multilayer Series Designator Maximum DC Working Voltage, V (Current <10 µA) Capacitance, pF (Example: 151 = 15x101 (150 pF) Tape & Reel Packaging E = 4,000 pcs. per reel Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ChipGuard® Automotive MLA Series Varistor ESD Clamp Protectors Solder Reflow Recommendations TP TP Temperature (°C) TL A Stage 1 Preheat Ramp Ambient to Preheating Temperature 3 °C / s max. B Stage 2 Preheat Preheat min./max. Temperature Range 150 °C to 200 °C 60 s to 180 s C Stage 3 Preheat to Main Heating Max. Time Above Stated Temperature 217 °C 60 s to 150 s D Main Heating Max. Time Within 5 °C of Peak Temperature (260 °C) 255 °C 20 s to 40 s E Cool Down Rate from Peak Temperature 6 °C / s max. CRITICAL ZONE TLTO TP RAMP-UP TSmax TL TSmin TS RAMP-DOWN PREHEAT 25 t 25 °C TO PEAK Time (seconds) CAUTION: • Rapid heating and cooling in excess of stated maximum rates will easily damage this product. • Localized heating can also damage product. • Do not thermally shock product in excess of 100 °C. • Use a 30 W or less solder gun/iron for product repairs. Tip temperature maximum is 280 °C for less than 3 seconds. • Do not touch the component directly with the soldering gun/iron. • Excess solder volumes can damage the body of the product. Packaging Dimensions F E C Dim. B D W NOTES: TAPE MATERIAL IS PAPER. DIMENSIONS: TAPE THICKNESS IS: 13.0 ± 1.0 (.512 ± .039) 2.0 ± 0.5 (.079 ± .020) 21.0 ± 0.8 (.827 ± .031) B 3.50 ± 0.05 (0.138 ± 0.002) C 1.75 ± 0.10 (0.069 ± 0.004) D 2.00 ± 0.05 (0.079 ± 0.002) E 4.00 ± 0.10 (0.157 ± 0.004) F 1.50 ± 0.10 (0.059 ± 0.004) CGA1206MLA Series 62.0 ± 1.5 (2.441 ± .059) L 1.90 ± 0.15 (0.075 ± 0.006) 2.30 ± 0.15 (0.091 ± 0.006) 3.50 ± 0.15 (0.138 ± 0.006) 13.0 ± 0.5 (.512 ± .020) W 1.05 ± 0.15 (0.041 ± 0.006) 1.55 ± 0.15 (0.061 ± 0.006) 1.90 ± 0.15 (0.075 ± 0.006) 178 ± 2.0 (7.008 ± .079) 9.0 ± 0.5 (.354 ± .020) 8.00 ± 0.30 (0.315 ± 0.012) MM (INCHES) 0.95 ± 0.05 (0.037 ± 0.002) CGA0805MLA Series A A L TOP TAPE CGA0603MLA Series Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com REV. A 07/14 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.