sf0603f

PL
IA
N
T
SinglFuse™ SF-0603F Series Features
LE
AD
F
RE
E
*R
oH
S
C
OM
n Single blow fuse for overcurrent protection
n 1608 (EIA 0603) miniature footprint
n Fast-acting fuse
n UL listed
n RoHS compliant* and halogen free**
n Thin film chip fuse
n Surface mount packaging for automated assembly
SF-0603F Series - Fast Acting Surface Mount Fuses
Model
Rated Current
(Amps)
SF-0603F050
0.50
SF-0603F063
SF-0603F080
SF-0603F100
SF-0603F125
SF-0603F150
SF-0603F160
SF-0603F200
SF-0603F250
SF-0603F300
SF-0603F315
SF-0603F400
0.63
0.80
1.00
1.25
1.50
1.60
2.00
2.50
3.00
3.15
4.00
SF-0603F500
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR IA E
NT
*
Electrical Characteristics
Fusing Time
Resistance
(mΩ) Typ.***
Rated Voltage
Breaking Capacity
250
DC 50 V
DC 50 V
50 A
Open within 1 min.
at 200 % rated
current
5.00
173
115
88
63
45
42
33
24
21
19
15
12
DC 32 V
DC 32 V
50 A
DC 24 V
DC 24 V
50 A
DC 32 V
DC 32 V
50 A
Typical
I2t (A2s)
0.005
0.007
0.014
0.016
0.027
0.037
0.041
0.044
0.055
0.082
0.089
0.239
0.433
***Resistance value was measured with less than 10 % of rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity...................................... No fusing.....................................................Rated current, 4 hours
Fusing Time............................................... Within 1 minute...........................................200 % of its rated current
Interrupting Ability...................................... No mechanical damages............................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test.............................................. No mechanical damages............................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat......................... ±20 %..........................................................260 °C ±5 °C,10 seconds ±1 second
Solderability............................................... 95 % coverage minimum............................235 °C ±5 °C, 2 ±0.5 second
245 °C ±5 °C, 2 ±0.5 second (lead free)
Temperature Rise...................................... <75 °...........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat............................. ±20 %..........................................................105 °C ±5 °C,1000 hours
Resistance to Solvent................................ No evident damage on protective...............23 °C ±5 °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance.................................. 10k W or more............................................Measure DC resistance after fusing
Thermal Shock.......................................... DR < 10 %..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles
Typical Part Marking
Represents total content. Layout may
vary.
How to Order
SF - 0603 F 050 - 2
SinglFuse™
Product Designator
SMD Footprint
1608 (EIA 0603) size
RATING CURRENT (A)
S = 2.00
F = 0.50
T = 2.50
I = 0.63
3 = 3.00
K = 0.80
U = 3.15
L = 1.00
W = 4.00
M = 1.25
Y = 5.00
P = 1.50
N = 1.60
6 = 6.00
Fuse Blow Type
F = Fast acting
S = Slow blow
Rated Current
050-500 (500 mA - 5.00 A)
Packaging Type
- 2 = Tape & Reel (5,000 pcs./reel)
Asia-Pacific:
Tel: +886-2 2562-4117
Email: [email protected]
Europe:
Tel: +36 88 520 390
Email: [email protected]
The Americas:
Tel: +1-951 781-5500
Email: [email protected]
www.bourns.com
* RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
**Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is:
Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SinglFuse™ SF-0603F Series Applications
n Portable memory
n Cell phones
n LCD monitors
n Rechargeable battery packs
n Disk drives
n Battery chargers
n PDAs
n Set top boxes
n Digital cameras
n Industrial controllers
250
n DVDs
Peak: 250 +0/-5 °C
230 °C or higher
SF-0603F Series - Fast Acting Surface Mount 200
Fuses
TEMPERATURE (°C)
Solder Reflow Recommendations
150
180 °C
PRE-HEATING ZONE
150 °C
90 ± 30 Seconds
100
250
30 ± 10 Seconds
Peak: 250 +0/-5 °C
SOLDERING ZONE
230 °C or higher
TEMPERATURE (°C)
50
200
150
HEATING TIME
PRE-HEATING ZONE
180 °C
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds
150 °C
90 ± 30 Seconds
1.6 ± 0.1
(.063 ± .004)
100
1.02
(.040)
30 ± 10 Seconds
SOLDERING ZONE
50
PEAK: 250 +0/-5 °C, 5 seconds
Product
Dimensions
PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds
SOLDERING
1.6 ±ZONE:
0.1 230 °C or higher, 30 ± 10 seconds
0.3 ± 0.2
1.6 ± 0.1 (.012 ± .008)
(.063 ± .004)
(.063 ± .004)
1.09
(.043)
0.8 ± 0.1
(.031 ± .004)
HEATING TIME
0.3 ± 0.2
(.012 ± .008)1.02
(.040)
Recommended Pad Layout
1.02
(.040)
0.45 ± 0.1
(.018 ± .004)
0.8 ± 0.1
(.031 ± .004)
0.8 ± 0.1
(.031 ± .004)
0.35 ± 0.2
(.014 ± .008)
0.35 ± 0.2
(.014 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.3 ± 0.2
(.012 ± .008)
0.45 ± 0.1
PACKAGING: 5,000 pcs./reel
0.3 ± 0.2
(.012 ± .008)
DIMENSIONS:
1.09
(.043)
2.54
(.010)
MM
(INCHES)
0.45 ± 0.1
(.018 ± .004)
(.018 ± .004)
0.35 ± 0.2
1.09
(.043)
2.54
(.010)
2.54
(.010)
0.35 ± 0.2
Thermal
Curve
(.014Derating
± .008)
(.014
± .008)
0.35 ± 0.2
(.014 ± .008)
Construction & Material Content
0.35 ± 0.2
(.014 ± .008)
PERCENT OF RATING (%)
120
OVERCOAT
110
Sn PLATING
100
FUSE ELEMENT
90
Cu / Ni PLATING
CERAMIC SUBSTRATE
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Operating Temperature...................................................................................-40 °C to +105 °C
Storage Conditions
Temperature.................................................................................................+5 °C to +35 °C
Humidity...........................................................................................................40 % to 75 %
Shelf Life........................................................................... 2 years from manufacturing date
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
SF-0603F Series - Fast Acting Surface Mount Fuses
Average Time Current
1.50 A Curves
1.25 A
1.00 A1.50 A
0.80 A 1.25 A
0.63 A 1.00 A
0.50 A 0.80 A
0.63 A
0.50 A
100
100
Minimum I2T V Clear Time Curves
1.60 A
2.00 A
2.50
1.60AA
3.00
AA
2.00
3.152.50
A A
3.00A A
4.00
3.15A A
5.00
4.00 A
5.00 A
5.00 A
100
4.00 A
5.00 A
3.15 A
3.004.00
A A
2.50 3.15
A A
2.003.00
A A
1.602.50
A A
1.502.00
A A
1.25 1.60
A A
1.50 A
1.00 A
1.25 A
100
10
10
10
MIN. I2T (A2 SEC)
MIN. I2T (A2 SEC)
CLEARING TIME (S)
CLEARING TIME (S)
10
0.801.00
A A
0.63 A
0.80 A
0.50 A
0.63 A
1
1
1
0.1
0.1
0.50 A
1
0.1
0.1
0.01
0.01
0.01
0.001
0.01
0.001
0.0001
0.1
0.0001
0.1
1
10
CURRENT
(A)
1
CURRENT (A)
100
10
100
0.001
0.001
0.001
0.001
0.01
0.1
CLEARING
TIME (S)0.1
0.01
CLEARING TIME (S)
REV. E 05/16
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
1
1
SF-0603F Series Tape and Reel Specifications
Tape Dimensions
SF-0603F Series
per EIA 481-2
8.0 ± 0.2
(.315 ± .008)
W
P
0
P1
P
2
4.0 ± 0.1
(.157 ± .004)
4.0 ± 0.1
(.157 ± .004)
2.0 ± 0.05
(.079 ± .002)
1.1 ± 0.1
(.043 ± .004)
A
1.9 ± 0.1
(.075 ± .004)
B
3.5 ± 0.05
(.138 ± .002)
F
1.75 ± 0.1
(.069 ± .004)
E
1.5 + 0.1/-0
(.059 + .004/-0)
D0
0.64 ± 0.1
(.025 ± .004)
T
Reel Dimensions
180 +0/-3.0
(7.087 +0/-.118)
A
B Min.
C
60.0
(2.362)
13.0 ± 1.0
(.512 ± .039)
9.0 ± 1.0
(.354 ± .039)
W
11.4 ± 2.0
(.449 ± .079)
T
T
DIMENSIONS:
MM
(INCHES)
W
BOTTOM
TAPE
A
DIA.
C DIA.
DO
PO
E
TOP
TAPE
B
B
DIA.
PAPER
TAPE
RESISTOR
TAPE
T
F
A
P1
P2
DIRECTION OF UNREELING
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
W