PL IA NT Features This series is currently available but not recommended for new designs. *R oH S CO M Lead free RoHS compliant* Low profile package Surface mount Very low forward voltage drop CD1607-B140 / B140L Schottky Barrier Rectifier Chip Diode General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Schottky Rectifier Diodes for rectification applications, in compact chip package 1607 (Mini-SMA) size format, which offer PCB real estate savings and are considerably smaller than competitive parts. The Schottky Rectifier Diodes offer a forward current of 1 A with a repetitive peak reverse voltage of 40 V. Bourns® Chip Diodes conform to JEDEC standards, easy to handle on standard pick and place equipment and their flat configuration makes roll away much more difficult. Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol CD1607- Unit B140 B140L VF 0.5 0.4 V Typical Junction Capacitance* CT 110 110 pF Reverse Current (Max.) at Rated VR) IR 0.5 1.0 mA Forward Voltage (Max.) (If = 1 A) * Measured at 1.0 MHz and applied reverse voltage of 4.0 V DC. Absolute Ratings (@ TA = 25 °C Unless Otherwise Noted) Parameter Symbol Repetitive Peak Reverse Voltage Reverse Voltage Maximum RMS Voltage Avg. Forward Current Forward Current, Surge Peak (60 Hz, 1 cycle) Typical Thermal Resistance** Storage Temperature Junction Temperature CD1607- Unit B140 B140L VRRM 40 40 V VR 40 40 V VRMS IO 28 28 V 1 A Isurge 30* A RθJL 20 °C/W TSTG TJ ** Thermal resistance junction to lead. * Condition: 8.3 ms single half sine-wave superimposed on rate load (JEDEC method). Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. -55 to +150 °C -55 to +125 °C How To Order CD 1607 - B 1 40 L LF Common Code Chip Diode Package • 1607 = Mini-SMA Model B = Schottky Barrier Series Average Forward Current (Io) Code 1 = 1 A (Code x 1000 mA = Average Forward Current) Reverse Voltage (VR) Code 40 = 40 V Forward Voltage Suffix L = Low Forward Voltage Vf Terminations LF = 100 % Sn (lead free) Applications Cellular phones PDAs Desktop PCs and notebooks Digital cameras MP3 players CD1607-B140 / B140L Schottky Barrier Rectifier Chip Diode Product Dimensions Recommended Pad Layout A A C B B D C F Dimension A (Max.) B (Min.) E Dimension A B C D E F Mini-SMA 3.70 - 4.10 (0.146 - 0.161) 1.40 - 1.80 (0.055 - 0.071) 0.30 TYP. (0.012) 2.40 - 2.80 (0.094 - 0.110) 0.90 2 PLCS. TYP. (0.035) 1.40 - 1.60 (0.055 - 0.063) C (Min.) DIMENSIONS: Mini-SMA 3.50 (0.138) 1.50 (0.059) 1.50 (0.059) MM (INCHES) Physical Specifications Case....................................................................1607 Molded plastic Polarity ..........................................Color band denotes cathode end Terminals..........................Solderable per MIL-STD-750, Method 206 Weight ......................................................Approximately 0.04 grams Typical Part Marking CD1607-B140 ..................................................................l4 DIMENSIONS: MM (INCHES) CD1607-B140L ................................................................L4 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. CD1607-B140 / B140L Schottky Barrier Rectifier Chip Diode Rating and Characteristic Curves: CD1607-B140 Reverse Characteristics 100 100 10 10 Reverse Current (mAmps) Forward Current (Amps) Forward Characteristics 1 1 Tj=75 °C 0.1 0.1 Tj=25 °C 0.01 0.0 0.2 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 20 40 60 80 100 120 160 180 200 Percent of Rated Peak Reverse Voltage (%) Forward Voltage (Volts) Capacitance Between Terminals Derating Curve 1000 1.25 F = 1 MHz Ta = 25 °C 900 800 1.00 700 Capacitance (pF) Average Forward Current (Amps) 140 0.75 0.50 600 500 400 300 200 0.25 100 Single Phase Half Wave 60 Hz Resistive or Inductive Load 0.00 0 25 50 75 100 Lead Temperature (°C) 125 150 0 20 40 60 Reverse Voltage (Volts) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 80 100 CD1607-B140 / B140L Schottky Barrier Rectifier Chip Diode Rating and Characteristic Curves: CD1607-B140L Reverse Characteristics Forward Characteristics 10 10 Reverse Current (mAmps) 100 Forward Current (Amps) 100 1 0.1 1 Tj=75 °C 0.1 Tj=25 °C 0.01 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.01 2.0 0 20 40 Forward Voltage (Volts) 60 80 100 120 160 180 200 Capacitance Between Terminals Derating Curve 1000 1.25 F = 1 MHz Ta = 25 °C 900 800 1.00 700 Capacitance (pF) Average Forward Current (Amps) 140 Percent of Rated Peak Reverse Voltage (%) 0.75 0.50 600 500 400 300 200 0.25 Single Phase Half Wave 60 Hz Resistive or Inductive Load 0.00 100 0 20 40 60 80 100 Lead Temperature (°C) 120 140 160 0 20 40 60 Reverse Voltage (Volts) Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 80 100 CD1607-B140 / B140L Schottky Barrier Rectifier Chip Diode Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d Index Hole T E 120 ° F D1 D P A Trailer End D2 W B C Device Leader ....... ....... ....... ....... ....... ....... ....... ....... 10 pitches (min.) DIMENSIONS: 10 pitches (min.) Symbol Carrier Width A Carrier Length B Carrier Depth C Sprocket Hole d Reel Outside Diameter D Reel Inner Diameter D1 Feed Hole Diameter D2 Sprocket Hole Position E Punch Hole Position F Punch Hole Pitch P Sprocket Hole Pitch P0 Embossment Center P1 Overall Tape Thickness T Tape Width W Reel Width W1 Quantity per Reel MM (INCHES) Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Direction of Feed Item W1 Start -- 1607 1.90 ± 0.10 (0.075 - 0.004) 4.30 ± 0.10 (0.169 - 0.004) 1.80 ± 0.10 (0.071 - 0.004) 1.55 ± 0.05 (0.061 - 0.002) 178 (7.008) 80.0 MIN. (3.150) 13.0 ± 0.20 (0.512 - 0.008) 1.75 ± 0.10 (0.069 - 0.004)) 3.50 ± 0.05 (0.138 - 0.002) 4.00 ± 0.10 (0.157 - 0.004) 4.00 ± 0.10 (0.157 - 0.004) 2.00 ± 0.05 (0.079 - 0.002) 0.20 ± 0.10 (0.008 - 0.004) 8.00 ± 0.20 (0.315 - 0.008) 13.5 MAX. (0.531) 2,500 REV. 12/15 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.