SRN2012

MATERIAL DECLARATION SHEET
SRN2012 SERIES Power Inductor Since inception Material Number
Product Line
Compliance Date
Yes RoHS Compliant
Construction
Element(subpart)
No.
1 MSL
Homogeneous Material
Iron oxide Nickel oxide
Zinc oxide
Copper oxide
Copper 1309-­‐37-­‐1 1313-­‐99-­‐1
1314-­‐13-­‐2
1317-­‐38-­‐0
7440-­‐50-­‐8 62.000 11.000 20.000 7.000 96.500 Material
Mass % of
total unit
wt.
45.260 8.030 14.600 5.110 14.475 0.000705 Polyamideimide Resin 31957-­‐38-­‐1 3.500 0.525 0.000705 0.000235 0.000235 Silver Nickel Tin Dimethyl siloxane, dimethylvinyl-­‐terminated Silicon dioxide Dimethylvinylated and trimethylated silica Methyl hydro siloxane Siloxanes and Silicones, Me vinyl, hydroxy-­‐terminated, reaction products with trimethoxy[3-­‐
(oxiranylmethoxy)propyl]silane Carbon black Dimethyl siloxane, dimethylvinyl-­‐terminated Methyl hydro siloxane Dimethylvinylated and trimethylated silica 7440-­‐22-­‐4 7440-­‐02-­‐0 7440-­‐31-­‐5 68083-­‐19-­‐2 14808-­‐60-­‐7 68988-­‐89-­‐6 68037-­‐59-­‐2 100.000 100.000 100.000 45.000 35.000 15.000 3.000 3.000 1.000 1.000 1.575 1.225 0.525 0.105 73891-­‐89-­‐1 1.000 0.035 1333-­‐86-­‐4 68083-­‐19-­‐2 68037-­‐59-­‐2 68988-­‐89-­‐6 1.000 89.000 10.000 1.000 0.035 3.115 0.350 0.035 Material
weight [g]
1
Ferrite body Ferrite Ni-­‐Zn Series 0.017155 2
Circuit-­‐Copper 0.00282 3
Circuit-­‐Coating 4
5
6
Terminal Solder Base Solder Copper Wire Polyurethane-­‐Based Insulation Varnish Silver paste Nickel Lead Free Solder Adhesive 0.0008225 Adhesive 7
Conformal coating Total weight
0.0008225 Homogeneous Material\
Substances
CASRN
if applicable
Materials
Mass %
0.0235 This Document was updated on: 2013/11/19
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Subpart
mass of total
wt. (%)
73.00 15.00 3.00 1.00 1.00 3.50 3.50