SRR1208

MATERIAL DECLARATION SHEET
Material Number
Product Line
SRR1208 Series
Shielded SMD Power Inductor
Compliance Date
RoHS Compliant
No.
Construction
Element(subpart)
2014/11/24
YES
MSL
Homogeneous
Material
1
Material
weight [g]
1
Ferrite Material DL5 2.7 2
Winding Wire 2SFBW 0.9 3
Base LCP-­‐E4008 0.32 4
5
C2680 0.12 Plating 0.01 Terminal Adhesive Headquarters Riverside CA
6020H-­‐2-­‐NH 0.035 Homogeneous
Material\
Substances
Iron oxide Zinc oxide Cupric oxide Manganese oxide Copper Polyester Resin Aromatic polyester resin Glass fiber Copper Zinc Tin Nickel Bisphenol A Epoxy Resin Alkyd glycidyl ether Material
Subpart
Mass % of
mass of total
total unit wt.
wt. (%)
33.035% 9.53% 63.53% 10.800% 10.165% 20.121% 21.18% 1.059% if applicable
Materials
Mass %
1309-­‐37-­‐1 1314-­‐13-­‐2 1317-­‐38-­‐0 1344-­‐43-­‐0 7440-­‐50-­‐8 109-­‐16-­‐0 52.0 15.0 17.0 16.0 95.0 5.0 60088-­‐52-­‐0 70.0 5.271% 65997-­‐17-­‐3 7440-­‐50-­‐8 7440-­‐66-­‐6 7440-­‐31-­‐5 7440-­‐02-­‐0 30.0 66.3 33.7 75.0 25.0 2.259% 1.87% 0.95% 0.18% 0.06% 25068-­‐38-­‐6 56.0 0.459% 68609-­‐97-­‐2 2.0 0.016% Methyl imidazole 693-­‐98-­‐1 10.0 0.082% Carbon black 1333-­‐86-­‐4 5.0 0.041% Silicon dioxide 7631-­‐86-­‐9 27.0 0.222% CASRN
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7.53% 2.82% 0.24% 0.82% page 1 of 2
MATERIAL DECLARATION SHEET
6
Adhesive 6020H-­‐6-­‐QR-­‐NH 0.145 7
Solder 100H 0.01 8
Solder 0030 0.01 Total weight 4.25 Bisphenol A Epoxy Resin Alkyd glycidyl ether Methyl imidazole Carbon black Silicon dioxide Tin (Sn) Tin (Sn) Copper (Cu) 25068-­‐38-­‐6 59.0 2.012% 68609-­‐97-­‐2 693-­‐98-­‐1 1333-­‐86-­‐4 7631-­‐86-­‐9 7440-­‐31-­‐5 7440-­‐31-­‐5 7440-­‐50-­‐8 4.0 10.0 5.0 22.0 100.0 97.0 3.0 0.136% 0.341% 0.170% 0.751% 0.235% 0.228% 0.007% 3.41% 0.235% 0.235% This Document was updated on: 2014/11/24
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1.
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