PL IA NT *R oH S CO M Features Applications n Available in E6 series n Input/output of DC/DC converters n Unit height of 1.8 mm n Power supplies for: n Current up to 2.8 A n RoHS compliant* LE AD F RE E 470 • Portable communication equipment • Camcorders • LCD TVs • Car radios SRU5018 Series - Shielded SMD Power Inductors General Specifications SRU5018-1R0Y SRU5018-1R5Y SRU5018-2R2Y SRU5018-3R5Y SRU5018-4R7Y SRU5018-6R8Y SRU5018-100Y SRU5018-150Y SRU5018-220Y SRU5018-330Y SRU5018-470Y SRU5018-680Y SRU5018-101Y 1.0 1.5 2.2 3.5 4.7 6.8 10.0 15.0 22.0 33.0 47.0 68.0 100.0 Tol. (%) Q Ref. ±30 9 7.96 160 7.96 90 ±30 ±30 ±30 ±30 9 10 9 8.5 ±30 7.5 ±30 12 ±30 ±30 ±30 ±30 ±30 ±30 12 12 13 7.96 7.96 7.96 7.96 2.52 2.52 2.52 2.52 13 2.52 15 0.796 12 2.52 SRF Min. (MHz) RDC .(mW) 15.5 200 130 12.5 5.2±0.2 2.80 (.205±.008) 20.5 2.30 2.50 I sat Typ. (A) 2.85 **KFactor 1105 2.40 904 2.10 765 32.0 80 36.0 60 50.0 50 65.0 40 100.0 28 160.0 23 220.0 18 330.0 16 480.0 15 620.0 2.10 1.70 585 1.20 432 5.2±0.2 1.55(.205±.008) 524 2.00 1.45 1.25 1.05 0.95 0.80 0.68 0.65 0.66 368 1.8±0.2 301 (.071±.008) 243 0.56 0.54 3.9 TYP. 0.37 (.154) 0.32 0.45 0.36 0.31 195 Test Voltage.....................................0.1 V Reflow Soldering... 230 °C, 50 sec. max. Operating Temp...........-40 °C to +125 °C (Temperature rise included) Storage Temperature...-40 °C to +125 °C Resistance to Soldering Heat .............................. +260 °C for 10 sec. Materials Core.....................Ferrite DR and RI core Wire.............................Enameled copper Terminal.....................................Ag/Ni/Sn Rated Current...Ind. drop 35 % typ. at Isat Temperature Rise ......................30 °C max. at rated Irms Packaging................... 1000 pcs. per reel 5.2±0.2 s) L (µH) I rms Max. (A) AP *Ro PR HS OV C ED OM (S PL el IAN ec T tM od el Bourns Part Number Test Freq. (MHz) & *R AE oH C- SC Q2 O 00 MP Q LI UA AN LI T FI ED Inductance @ 100 KHz Ro VE LEA HS RS D C ION FRE OM S E PL AR IA E NT * Electrical Specifications 163 1.7 (.067)140 TYP.117 5.2±0.2 (.205±.008) 5.2±0.2 (.205±.008) AE C **K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x Δ I (peak-to-peak ripple current, A), determine core loss from Core Loss vs. Flux Density plot. SRU5018 (.205±.008) Product Dimensions Core Loss vs. Flux Density 1.8 TYP. (.071) 1000 1.8±0.2 (.071±.008) 1.8±0.2 (.071±.008) 1.7 TYP. (.067) 0.78 (.031) REF. 100 Core Loss (mW) 5.2±0.2 (.205±.008) 1 1.1 (.043) REF. 1 MHz 1.1 500 KHz (.043) 300 KHz REF. 200 KHz 100 KHz 50 KHz 3.7 (.146) REF. 1.7 (.067) TYP. 3.9 TYP. (.154) 10 1.1 (.043) REF. 1.7 (.067) TYP. 3.9 TYP. (.154) 1.8 TYP. (.071) 1.7 TYP. (.067) 1.8 TYP. (.071) 1.7 TYP. (.067) 0.1 3.7 (.146) REF. 0.01 100 1000 10000 Flux Density Bp-p (gauss) Electrical Schematic * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 1.1 (.043) Inductor REF. Connection REF. 2.0 (.079) 2.0 (.079) REF. Recommended Layout 1.1 (.043) REF. 1.1 1.1 (.043) (.043) REF. REF. 1.1 (.043) REF. 3.7 (.146) REF. 3.7 (.146) REF. 3.7 (.146) REF. 3.7 (.146) REF. LCRMETER 1.1 (.043) REF. 1.1 (.043) REF. 1.1 (.043) REF. 1.1 (.043) REF. DIMENSIONS: 2.0 (.079) REF. 2.0 2.0 REF. (.079) (.079) REF. 2.0 REF. MM (.079) (INCHES) SRU5018 Series SMD Power Inductors SRF0504 Series- -Shielded Line Filter Packaging Specifications 178 DIA. (7.008) 2.0±0.5 (.079±.020) 16.5 (.650) 13.0±0.5 (.512±.020) DIA. 21.0±0.8 (.827±.031) COVER TAPE EMBOSSED CAVITY 50.0 (1.969) 13.0±0.5 DIA. (.512±.020) EMBOSSED CARRIER 14 (.551) 12.0 (.472) 4 (.157) END START 8 (.315) NOCOMPONENT 160 (6.299) NOCOMPONENT COMPONENTS USER DIRECTION OF FEED QTY: 1000 PCS. PER REEL 400 (15.748) DIMENSIONS: MM (INCHES) REV. 06/16 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.