pt61022xel

T
PL
IA
N
M
Features
Applications
■ Compliant with IEEE 802.3 standards
■ Ethernet
*R
oH
S
CO
■ Designed for 10/100/1000 Base-T
full duplex
■ Supports four pairs of Category 5 UTP
cables
■ Extended operating temperature range
■ RoHS compliant*
PT61022XEL 10/100/1000 Base-T Transformer
Electrical Specifications @ 25 °C
Turns Ratio (±5 %) .................1CT*:1CT*
Inductance .......350 µH min. @ 100 KHz,
0.1 Vrms, 8 mA DC Bias
Leakage Inductance ............ 0.5 µH max.
@ 100 KHz, 0.1 Vrms
Cww......................................... 25 pF typ.
@ 100 KHz, 0.1 Vrms
DCR....................................... 0.9 Ω max.
Insertion Loss
0.3-100 MHz ....................-1.1 dB max.
Return Loss
0.3-30 MHz ......................-18 dB min.
30-60 MHz .......................-14 dB min.
60-80 MHz .......................-12 dB min.
80-100 MHz .....................-10 dB min.
Common Mode Rejection
0.3-60 MHz ......................-35 dB Min.
60-100 MHz .....................-30 dB Min.
Crosstalk
0.3-60 MHz ......................-35 dB Min.
60-100 MHz .....................-28 dB Min.
Hipot
1 mA, 60 sec. .....................1500 Vrms
Operating Temperature
................................... -40 °C to +85 °C
Storage Temperature
................................. -40 °C to +125 °C
Product Dimensions
Recommended Layout
13.56 ± 0.25
(0.534 ± 0.010)
15.24 ± 0.25
(0.600 ± 0.10)
PT61022XL
PIN 1
10.89 ± 0.25
(0.429 ± 0.010)
20.0 ± 0.25
(0.787 ± 0.010)
18.65 ± 0.25
(0.734 ± 0.010)
0.99
(0.039)
0.41
(0.016)
10.89 ± 0.25
(0.429 ± 0.010)
2.54
(0.100)
0.99
(0.039)
0.6
(0.024)
DIMENSIONS:
5.79
(0.222)
0 ˚~8 ˚
0.25
(0.010)
TOLERANCES:
0.05
(0.002)
MM
(INCHES)
UNLESS OTHERWISE NOTED
1.06
(0.042)
Electrical Schematic
TD1+
1
2
TD1–
3
TCT2
TD2+
4
5
TD2–
6
TCT1
1CT : 1 CT
24 MCT1
23 MX1+
*CT: Center tap
Material
Terminal Finish .................................. Tin
Packaging Specifications
22 MX1
1CT : 1 CT
21 MCT2
20 MX2+
Tape & Reel ....................... 500 pcs./reel
How To Order
PT61022 X E L
Model
Type
X = Extended Temperature Range
7
TD3+ 8
TCT3
Packaging
E = Tape and Reel (500 pcs./reel)
Termination
L = Tin only (RoHS Compliant)
TD3–
1CT : 1 CT
9
TD4+
10
11
TD4–
12
TCT4
19 MX2–
18 MCT3
17 MX3+
16 MX3–
1CT : 1 CT
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
15 MCT4
14 MX4+
13 MX4–
PT61022XEL 10/100/1000 Base-T Transformer
Soldering Profile
tp
TP
CRITICAL ZONE
T L TO TP
RAMP-UP
TL
Temperature
tL
TS MAX.
RAMP-DOWN
TS MIN.
ts
PREHEAT
25 °C
Ramp up rate = 3 °C/second max.
Ramp down rate = 6 °C/second max.
TL = 217 °C
tL = 60 seconds to 150 seconds
TP = 250 ±3 °C
Time within 5 °C of Actual Peak Temperature (tp) =
20~40 seconds
Ts min = 150 °C
Ts max = 200 °C
Ts min to Ts max: 60 seconds to 180 seconds
25 °C to Peak Temperature = 8 minutes max.
8 MINS./248.9 °C
t 25 °C TO PEAK
Time
Packaging Specifications
32.00 ± 0.30
(1.260 ± .012)
28.40 ± 0.10
(1.118 ± .004)
14.20 ± 0.10
(.559 ± .004)
330
DIA.
(12.992)
4.00 ± 0.10
(.157 ± .004)
2.00 ± 0.10
(.079 ± .004)
1.75 ± 0.10
(.069 ± .004)
1.50 +0.10/-0.00
DIA.
(.059 +.004/-.000)
20.00 ± 0.10
(.787 ± .004)
END
START
36.5
(1.437)
PT61022XL
2.00
DIA. MIN.
(.079)
14.10 ± 0.10
(.555 ± .004)
12.20 ± 0.10
(.480 ± .004)
1.50 ± 0.10
DIA.
(.059 ± .004)
8°
USER DIRECTION OF FEED
20.00 ± 0.10
(.787 ± .004)
0.35 ± 0.10
(.014 ± .004)
5.90 ± 0.10
(.232 ± .004)
DIMENSIONS:
MM
(INCHES)
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
EMEA:
Tel: +36 88 520 390
Fax: +36 88 520 211
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
500 PCS. PER REEL
01/15
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.