T PL IA N M Features Applications ■ Compliant with IEEE 802.3 standards ■ Ethernet *R oH S CO ■ Designed for 10/100/1000 Base-T full duplex ■ Supports four pairs of Category 5 UTP cables ■ Extended operating temperature range ■ RoHS compliant* PT61022XEL 10/100/1000 Base-T Transformer Electrical Specifications @ 25 °C Turns Ratio (±5 %) .................1CT*:1CT* Inductance .......350 µH min. @ 100 KHz, 0.1 Vrms, 8 mA DC Bias Leakage Inductance ............ 0.5 µH max. @ 100 KHz, 0.1 Vrms Cww......................................... 25 pF typ. @ 100 KHz, 0.1 Vrms DCR....................................... 0.9 Ω max. Insertion Loss 0.3-100 MHz ....................-1.1 dB max. Return Loss 0.3-30 MHz ......................-18 dB min. 30-60 MHz .......................-14 dB min. 60-80 MHz .......................-12 dB min. 80-100 MHz .....................-10 dB min. Common Mode Rejection 0.3-60 MHz ......................-35 dB Min. 60-100 MHz .....................-30 dB Min. Crosstalk 0.3-60 MHz ......................-35 dB Min. 60-100 MHz .....................-28 dB Min. Hipot 1 mA, 60 sec. .....................1500 Vrms Operating Temperature ................................... -40 °C to +85 °C Storage Temperature ................................. -40 °C to +125 °C Product Dimensions Recommended Layout 13.56 ± 0.25 (0.534 ± 0.010) 15.24 ± 0.25 (0.600 ± 0.10) PT61022XL PIN 1 10.89 ± 0.25 (0.429 ± 0.010) 20.0 ± 0.25 (0.787 ± 0.010) 18.65 ± 0.25 (0.734 ± 0.010) 0.99 (0.039) 0.41 (0.016) 10.89 ± 0.25 (0.429 ± 0.010) 2.54 (0.100) 0.99 (0.039) 0.6 (0.024) DIMENSIONS: 5.79 (0.222) 0 ˚~8 ˚ 0.25 (0.010) TOLERANCES: 0.05 (0.002) MM (INCHES) UNLESS OTHERWISE NOTED 1.06 (0.042) Electrical Schematic TD1+ 1 2 TD1– 3 TCT2 TD2+ 4 5 TD2– 6 TCT1 1CT : 1 CT 24 MCT1 23 MX1+ *CT: Center tap Material Terminal Finish .................................. Tin Packaging Specifications 22 MX1 1CT : 1 CT 21 MCT2 20 MX2+ Tape & Reel ....................... 500 pcs./reel How To Order PT61022 X E L Model Type X = Extended Temperature Range 7 TD3+ 8 TCT3 Packaging E = Tape and Reel (500 pcs./reel) Termination L = Tin only (RoHS Compliant) TD3– 1CT : 1 CT 9 TD4+ 10 11 TD4– 12 TCT4 19 MX2– 18 MCT3 17 MX3+ 16 MX3– 1CT : 1 CT *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 15 MCT4 14 MX4+ 13 MX4– PT61022XEL 10/100/1000 Base-T Transformer Soldering Profile tp TP CRITICAL ZONE T L TO TP RAMP-UP TL Temperature tL TS MAX. RAMP-DOWN TS MIN. ts PREHEAT 25 °C Ramp up rate = 3 °C/second max. Ramp down rate = 6 °C/second max. TL = 217 °C tL = 60 seconds to 150 seconds TP = 250 ±3 °C Time within 5 °C of Actual Peak Temperature (tp) = 20~40 seconds Ts min = 150 °C Ts max = 200 °C Ts min to Ts max: 60 seconds to 180 seconds 25 °C to Peak Temperature = 8 minutes max. 8 MINS./248.9 °C t 25 °C TO PEAK Time Packaging Specifications 32.00 ± 0.30 (1.260 ± .012) 28.40 ± 0.10 (1.118 ± .004) 14.20 ± 0.10 (.559 ± .004) 330 DIA. (12.992) 4.00 ± 0.10 (.157 ± .004) 2.00 ± 0.10 (.079 ± .004) 1.75 ± 0.10 (.069 ± .004) 1.50 +0.10/-0.00 DIA. (.059 +.004/-.000) 20.00 ± 0.10 (.787 ± .004) END START 36.5 (1.437) PT61022XL 2.00 DIA. MIN. (.079) 14.10 ± 0.10 (.555 ± .004) 12.20 ± 0.10 (.480 ± .004) 1.50 ± 0.10 DIA. (.059 ± .004) 8° USER DIRECTION OF FEED 20.00 ± 0.10 (.787 ± .004) 0.35 ± 0.10 (.014 ± .004) 5.90 ± 0.10 (.232 ± .004) DIMENSIONS: MM (INCHES) Asia-Pacific: Tel: +886-2 2562-4117 Fax: +886-2 2562-4116 EMEA: Tel: +36 88 520 390 Fax: +36 88 520 211 The Americas: Tel: +1-951 781-5500 Fax: +1-951 781-5700 www.bourns.com 500 PCS. PER REEL 01/15 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.