CI160808

PL
IA
NT
Features
This series is currently available but
not recommended for new designs.
*R
oH
S
CO
M
0603 size
Available in E12 Series
High frequency
Nickel barrier
CI160808 Series - Multi-Layer Chip Inductors
Electrical Specifications
Bourns Part No.
CI160808-1N0D
CI160808-1N2D
CI160808-1N5D
CI160808-1N8D
CI160808-2N2D
CI160808-2N7D
CI160808-3N3D
CI160808-3N9D
CI160808-4N7D
CI160808-5N6D
CI160808-6N8J
CI160808-8N2J
CI160808-10NJ
CI160808-12NJ
CI160808-15NJ
CI160808-18NJ
CI160808-22NJ
CI160808-27NJ
CI160808-33NJ
CI160808-39NJ
CI160808-47NJ
CI160808-56NJ
CI160808-68NJ
CI160808-82NJ
CI160808-R10J
CI160808-R12J
CI160808-R15J
CI160808-R18J
CI160808-R22J
Inductance
nH
1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
Tol. %
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±0.3 nH
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
Q
Test Freq.
min.
L,Q MHz
8
8
8
8
8
8
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
8
8
8
8
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
50
50
50
50
SRF MHz
min.
4000
4000
4000
3800
3600
3400
3200
3000
2800
2700
2600
2200
1800
1650
1350
1350
1100
1100
1000
900
800
750
700
600
500
500
500
400
350
typ.
13000
13000
10000
10000
10000
8000
6000
6000
5000
5000
4000
4000
3000
2700
2400
2050
1850
1750
1500
1350
1200
1150
1000
900
850
850
680
500
500
DCR
I rms
ohm max.
mA max.
0.10
0.10
0.10
0.12
0.16
0.20
0.22
0.25
0.28
0.29
0.30
0.33
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.90
1.00
1.20
1.50
1.70
2.00
2.40
2.70
2.80
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
300
250
200
200
200
General Specifications
Temperature Rise
...................20 ˚C max. at rated current
Operating Temperature .-55 °C to +125 °C
Storage Temperature..-55 °C to +125 °C
Reflow Soldering ...230 °C, 50 sec. max.
Resistance to Soldering Heat
...............................260 ˚C, 10 seconds
Materials
Base Material .............................Ceramic
Terminal.....................................Ag/Ni/Sn
Packaging..................4,000 pcs. per reel
Product Dimensions
0.8 ± 0.15
(.031 ± .006)
0.5
MAX.
(.020)
0.8 ± 0.15
(.031 ± .006)
1.6 ± 0.15
(.063 ± .006)
DIMENSIONS:
MM
(INCHES)
Recommended Layout
1.0
(.039)
REF.
1.3
(.051)
REF.
1.0
(.039)
REF.
0.5
REF.
(0.02)
Packaging Specifications
178.0
DIA.
(7.00)
2.0 ± 0.5
(.079 ± .020)
21.0 ± 0.8
(.827 ± .031)
12.0
(.472)
13.0 ± 0.5
(.512 ± .020)
DIA.
50.0
(1.969)
13.0 ± 0.5
DIA.
(.512 ± .020)
9.0
(.354)
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex..
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Applications
Mobile phones
Cellular phones
CTV, VCR, HIC, FDD
Automotive electronics
Surface Mount
Chip
Inductor Capability
Matrix
CI160808
Series
- Multi-Layer
Chip Inductors
Electrical Specifications
1000
Inductance Characteristics
100
Q Characteristics
Inductance (nH)
80
100
Q
22nH
10
60
40
10nH
6.8nH
4.7nH
20
10nH
22nH
1
10
100
1000
Frequency (MHz)
10000
REV. 02/16/16
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
0
10
100
1000
Frequency (MHz)
6.8nH
4.7nH
10000