MATERIAL DECLARATION Material Number CM160808 Series Product Line Chip Inductor Compliance Date January 11, 2013 RoHS Compliant Yes No. Construction Element (subpart) MSL Homogeneous Material 1 Material weight [mg] 1 Core Alumina 2.39 2 Outer Packaging Resin Epoxy Resin 0.1 3 4 5 Coil / Electrode Electrode base-Plating Electrode Plating Cu plating Ni Plating Sn Plating Total weight 1.26 0.0044 0.1226 3.877 Homogeneous Material\ Substances Aluminum Oxide Manganese Oxide Crystalline Silica Chromium (III) Oxide Titanium Dioxide Others Epoxy Resin Epoxy Resin Silica Others Copper Nickel Tin CASRN if applicable Materials Mass % 1344-28-1 1313-13-9 14808-60-7 1308-38-9 13463-67-7 29690-82-2 25068-38-6 14808-82-2 7440-50-8 7440-02-0 7440-31-5 87.67 3.44 3.00 2.30 3.00 0.59 14.00 13.00 68.00 5.00 100.00 100.00 100.00 Material Mass % of total unit wt. 54.04 2.12 1.85 1.42 1.85 0.36 0.36 0.34 1.75 0.13 32.50 0.11 3.16 Subpart mass of total wt. (%) 61.28 2.94 32.50 0.11 3.16 This Document was updated on: 2013/1/11 Important remarks: It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1