PWR163

MATERIAL DECLARATION SHEET
Material Number
PWR163S-25-RC
Product Line
Power Resistor
Compliance Date
Since inception
RoHS Compliant
yes
No.
1
2
3
4
5
Construction
Element (subpart)
Housing
Back Plate
Terminal
Solder
Substrate
Headquarters Riverside CA
MSL
Homogeneous
Material
Epoxy Molding
Compound
N/A
Material
weight [g]
0.15
Copper
0.32
Plating
0.002
Copper
0.11
Plating
0.007
Metal
Alumina
0.02
0.078
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Silica
14808-60-7
53
11.5169
Epoxy Resin
29690-82-2
25
5.4325
Homogeneous Material/
Substances
CASRN
Phenolic Resin
9003-35-4
15
3.2595
Antimony trioxide
1309-64-4
3
0.6519
Brominated epoxy resin
40039-93-8
3
0.6519
Carbon Black
1333-86-4
1
0.2173
Copper
7440-50-8
99.9
46.3136
0.1
0.0464
Other, not to declare
Nickel
7440-02-0
100
0.29
Copper
7440-50-8
99.99
15.928
Oxygen
7782-44-7
0.01
0.002
Tin
7440-31-5
100
1.01
Tin
7440-31-5
96.5
2.7985
Silver
7440-22-4
3
0.087
Copper
7440-50-8
0.5
0.0145
Aluminum Oxide
1344-28-1
88
9.944
Manganese dioxide
1313-13-9
3.5
0.3955
Titanium-dioxide
13463-67-7
3.5
0.3955
Chromium(III)oxide
1308-38-9
2.5
0.2825
Quartz (Silicon dioxide)
14808-60-7
2.5
0.2825
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Subpart
mass of
total wt. (%)
21.73
46.36
0.29
15.93
1.01
2.90
11.30
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MATERIAL DECLARATION SHEET
6
7
8
Term Ink
Resistor Paste
Encapsulant
Ink
Ink
0.002
0.0008
Ink
0.0005
Total weight
0.6903
Silver
7440-22-4
96.8
0.2807
Lead
7439-92-1
0.5
0.0015
Dibismuth-trioxide
1304-76-3
1.6
0.0046
Platinum
7440-06-4
1.1
0.0032
Palladium
Glass without declarable
substances
Silver
7440-05-3
33.4
0.040
65997-17-3
45.3
0.0544
7440-22-4
20
0.024
Ruthenium dioxide
12036-10-1
1.3
0.0016
Lead
7439-92-1
55.4
0.0388
Glass without declarable
substances
65997-17-3
44.6
0.0312
0.29
0.12
0.07
This Document was updated on: July 14, 2015
Important remarks:
1. It is the responsibility of the user to verify they are accessing the latest version.
2. RoHS exemptions 7c-I.
Headquarters Riverside CA
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CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society
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