BGA Package 133-Lead (15mm × 15mm × 4.92mm) (Reference LTC DWG # 05-08-1940 Rev Ø) 3.54 BSC 2.18 BSC DETAIL A Z A M A2 aaa Z SEE NOTES L K J H G F E D C B 7 A 12 3.29 BSC 11 b A1 ccc Z 10 9 8.42 BSC 8 b1 MOLD CAP 7 F D SUBSTRATE 6 0.27 – 0.37 5 // bbb Z 3.95 – 4.05 PIN “A1” CORNER 4 DETAIL B 3 4 2 e Øb (133 PLACES) aaa Z DETAIL B PACKAGE SIDE VIEW DETAIL A 6.9850 0.630 ±0.025 Ø 133x 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 6.9850 SUGGESTED PCB LAYOUT TOP VIEW PIN 1 G 3 PACKAGE BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994 6.9850 5.7150 4.4450 3.1750 1.9050 0.6350 0.0000 0.6350 1.9050 3.1750 4.4450 5.7150 PACKAGE TOP VIEW e b SEE NOTES Y E 6.9850 1 ddd M Z X Y eee M Z X 2. ALL DIMENSIONS ARE IN MILLIMETERS DIMENSIONS SYMBOL A A1 A2 b b1 D E e F G aaa bbb ccc ddd eee MIN 4.72 0.50 4.22 0.60 0.60 NOM 4.92 0.60 4.32 0.75 0.63 15.0 15.0 1.27 13.97 13.97 MAX 5.12 0.70 4.42 0.90 0.66 0.15 0.10 0.20 0.30 0.15 TOTAL NUMBER OF BALLS: 133 NOTES 3 BALL DESIGNATION PER JESD MS-028 AND JEP95 4 DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE 5. PRIMARY DATUM -Z- IS SEATING PLANE 6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu 7 ! PACKAGE ROW AND COLUMN LABELING MAY VARY AMONG µModule PRODUCTS. REVIEW EACH PACKAGE LAYOUT CAREFULLY LTMXXXXXX µModule COMPONENT PIN “A1” TRAY PIN 1 BEVEL PACKAGE IN TRAY LOADING ORIENTATION BGA 133 0213 REV Ø