Chip 3-Terminal Capacitor Array Chip 3-Terminal Capacitor Array Type: EZASC EZANC GND GND ■ Features 1. ● ● 2. ● ● 3. ● ● Suitable for EMI suppression filtering The low residual inductance at high frequency range provides effective reduction of noise Equivalent noise reduction to the EMI filters with low cost design Compact design for high density PWB assembly EZASC : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch EZANC : 6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch Flat and square packages suitable for high speed automatic placement machine Superior mountability with concave terminals Firm solder joint (2 times that of convex terminal type) Self-aligning placement during reflow soldering <Effect of high density placing, PWB space saving> Digital cordless phone (4 line mounting) RF Circuit (EZA SC) I/O I/O I/O I/O Digital Control Circuit 3-Terminal Capacitors or EMI Filters EZASC: 0.8 mm pitch EZANC: 1.27 mm pitch Prevent high frequency harmonic noise to RF circuits ■ Recommended Applications ● ● ● ● Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT Digital audio and video equipment Electronic musical instruments, and other digital devices Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip 3-Terminal Capacitor Array ■ Explanation of Part Number 1 2 3 4 5 6 7 8 9 10 E Z A N C E 1 0 1 M Dimensions and Temperature Capacitance Value Circuit Configuration Characteristics Product Code Thick Film Noise Suppression and Filtering Components 4.0 mm ҂2.1 mm Four 3-Terminal Capacitors 6.4 mm NC ҂3.1 mm +20 %/–55 % E (–25°C to +85 °C) SC ■ Construction Capacitance Suffix for Special Tolerance Requirement The first two digits are significant figures of capacitance value, and the third one denotes the number of zeros following ex. 101촞100 pF M ±20 % When less than 22 pF +30 % –20 % ■ Circuit Configuration Protective coating Alumina substrate 10 GND Electrode (Outer) 11 CIOI GND Electrode (Outer) 9 8 7 GND 1 6 GND 2 Electrode (Outer) 3 4 5 ■ Dimensions in mm (not to scale) EZASC 0.4±0.2 +0.1 f 0.3 –0.2 3.1±0.2 CIOI 1.27±0.10 +0.20 0.65 –0.10 Size : 1608 inches Mass (Weight) [1000 pcs.] : 17 g 0.3±0.2 0.56±0.20 +0.20 0.75 –0.10 0.4±0.2 0.45±0.20 6.4±0.2 0.8±0.2 4.0±0.2 0.4±0.2 0.5±0.2 0.7±0.2 0.4±0.2 0.8±0.2 2.1±0.2 CIOI 0.8±0.1 0.4±0.2 f 0.4+–0.1 0.2 0.5±0.2 0.25±0.20 0.5±0.2 0.25±0.20 EZANC Size : 2512 inches Mass (Weight) [1000 pcs.] : 52 g Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip 3-Terminal Capacitor Array ■ Ratings Specification Item Capacitance Values (25 °C, 1 kHz(1), 1 Vrms) EZASC EZANC 10 pF to 180 pF Standard : 22 pF, 47 pF, 100 pF 22 pF, 47 pF, 100 pF, 220 pF, 470 pF ±20% (+30% –20% in the case of Less than 22 pF) Capacitance Tolerance Temperature Characteristic E Characteristic: +20 %/±55 % (±25 °C to +85 °C) Less than 2 % (25 °C, 1 kHz(1), 1 Vrms) Dissipation Factor Rated Voltage 25 V Rated Current (2) Resistance 200 mA 300 mA Less than 1 액 (3) Category Temperature Range (Operating Temperature Range) –25 °C to +85 °C (1) In measuring at 1 MHz, Capacitance Value and Dissipation Factor are different. (2) Rated Current between Input terminal and Output terminal. (3) Resistance value between Input terminal and Output terminal. ■ Attenuation Characteristics Measurement Circuit Measurement Circuit 50 액 1 k액 1 k액 EZANC 50 액 2000 pF MN74HC04 MN74HC04 MN74HC04 촞 ~ 8 MHz EZA SCE470M Chip 3-Terminal Capacitor Array (EZANC) Attenuation (dB) 10 10 22 47 0pF 0p F 20 22 47 pF pF F 0p 30 40 80 60 40 20 50 1M 10M 100M Frequency (Hz) 1G 100 Electric field intensity (dBµV) Electric field intensity (dBµV) 100 0 100 200 400 600 800 Frequency (MHz) 1000 80 60 40 20 100 200 400 600 Frequency (MHz) 800 1000 3G ✽ Equivalent to EMI filter ■ Packaging Methods (Taping) ● Standard Quantity Type EZASC EZANC Kind of Taping Pitch (P1) Quantity Embossed Carrier Taping 4 mm 4000 pcs./reel Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Chip 3-Terminal Capacitor Array ● Embossed Carrier Taping t1 ● Taping Reel T Compartment E Sprocket hole fD0 F W A fB B fC fD1 t2 P1 P2 P0 Tape running direction Chip component fA Type Dimensions (mm) B W F E W P0 EZASC 2.50±0.20 4.40±0.20 12.00±0.30 5.50±0.20 1.75±0.20 4.00±0.10 EZANC 3.50±0.20 6.80±0.20 Type Dimensions (mm) A P1 P2 Dimensions (mm) fD0 t1 fD1 t2 1.15±0.20 EZASC +0.10 4.00±0.10 2.00±0.05 1.50−0 0.25±0.05 fB fC 180+0 −3.0 60 min. 13.0±1.0 Dimensions (mm) +0.10 1.50−0 1.30±0.20 EZANC fA W T 13.0±1.0 15.4±2.0 ■ Recommended Land Pattern Design Chip 3-Terminal Capacitor Array (EZANC/EZASC) f2 GND e a f1 d c b P Land pattern Dimensions (mm) Solder resistant Type a b c d e f1 f2 EZASC 1.2 to 1.4 0.4 3.1 to 3.3 0.4 to 0.5 0.8 2.9 to 3.3 4.8 to 5.2 0.8 EZANC 2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8 1.8 4.2 to 4.6 7.5 to 7.9 1.27 Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. P Feb. 2006 Chip 3-Terminal Capacitor Array ■ Recommended Soldering Conditions Recommendations and precautions are described below. ● Recommended soldering conditions for reflow ·Reflow soldering shall be performed a maximum of two times. ·Please contact us for additional information when used in conditions other than those specified. ·Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. For soldering (Example : Sn/Pb) Preheating Main heating Peak Temperature Time 140 °C to 160 °C 60 s to 120 s Above 200 °C 30 s to 40 s 235 ± 5 °C max. 10 s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Peak Preheating Preheating Main heating Heating Peak Temperature Time 150 °C to 180 °C 60 s to 120 s Above 230 °C 30 s to 40 s max. 260 °C max. 10 s Time ● Flow Soldering We do not recommend flow soldering to the Chip 3-Terminal Capacitor Array: EZASC, because solder bridging may occur due to the narrow 0.8 mm pitch of EZASC. Please contact us regarding flow soldering of EZANC type. Safety Precautions The following are precautions for individual products. Please also refer to the precautions common to EMI Filters, Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog. 1. Take measures against mechanical stress during and after mounting of Chip 3-Terminal Capacitor Array (hereafter called the capacitor arrays) so as not to damage their electrodes and protective coatings. Be careful not to misplace the capacitor arrays on the land patterns. Otherwise, solder bridging may occur. 2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitors arrays' per for mance and/or reliability. 3. When soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. When using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 ° C max.). 4. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 5. Do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the capacitor arrays' protective coatings and bodies may be chipped, affecting their performance. 6. Avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from abnormal stress. 7. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to dielectric materials having a high dielectric constant. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. Feb. 2006 Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements]) • When using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. • Do not use the products beyond the specifications described in this catalog. • This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. • Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment where a defect in these products may cause the loss of human life or other significant damage, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. ✽ Systems equipped with a protection circuit and a protection device ✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault (1) Precautions for use • These products are designed and manufactured for general and standard use in general electronic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) • These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used. 1. In liquid, such as water, oil, chemicals, or organic solvent 2. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials • These products generate Joule heat when energized. Carefully position these products so that their heat will not affect the other components. • Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs). • Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the performance or reliability of the products. • Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. (2) Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of arrival at your company, provided that they remain packed as they were when delivered and stored at a temperature of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the date of arrival at your company) The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures. 1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2 2. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Feb. 2006 – EX2 –