DR332

PL
IA
NT
Features
CO
M
■ RoHS compliant*
*R
oH
S
■ Bifilar or sector windings
■ Wide frequency range over 1000MHz
■ Rated current 0.2 to 0.5A
■ Model DR331 recommended for new designs
DR332 Series Surface Mount Data Line Chokes
Electrical Characteristics (@ 25 °C)
Bourns
Part
Number
L (1-4)
@ 100 kHz,
0.1 Vrms
(µH)
LL (1-4)
@ 100 kHz,
0.1 Vrms
(Typ.) (2-3 Short)
RDC (Ω)
(Winding)
Max.
(Ω)
Rated
Current
Max.
DR332-113AE
DR332-253AE
11.0 +25 %
0.05 µH
0.12
0.5 A
Bifilar
25.0 +25 %
1.50 µH
0.20
0.5 A
Sector
Winding
DR332-513AE
51.0 +25 %
2.00 µH
0.30
0.5 A
Sector
DR332-474AE
470.0 +25 %
0.28 µH
0.28
0.5 A
Bifilar
DR332-105AE
1000.0 +25 %
0.29 µH
0.40
0.5 A
Bifilar
DR332-475AE
4700.0 +25 %
0.30 µH
0.70
0.2 A
Bifilar
Note: For tape and reel packaging, add “E” at the end of part number.
Product Dimensions
*Model DR443-475:
Operating Temperature ....-40 to +100 °C
Storage Temperature ......-40 to +100 °C
Recommended PCB Layout
(.362 ± .012)
7.10
TYP.
(.280)
1.00
REF.
(.039)
1
4
2
3
3.40
(.134)
REF.
How to Order
6.00 ± 0.3
(.236 ± .012)
DR332 - 513 AE
9.60
(.378)
REF.
Model
Value Code
See Model-Value Table
MM
(INCHES)
Termination
AE = Cu/Ni/Sn (Lead Free)
Schematic
5.32
TYP.
(.209)
0.60
(.024)
TYP.
DIMENSIONS:
5.00 ± 0.3
(.197 ± .012)
0.25
(.010)
Rated Voltage ..................80 Vdc/42 Vac
Hipot (1 sec.)..........250 Vac/60 Hz, 3 mA
*Operating Temperature ..-40 to +135 °C
*Storage Temperature ......-40 to +135 °C
Temperature Rise
..................30 °C max. at rated current
Resistance to Solder Heat
......................................260 °C 10 sec.
Core ..............................................Ferrite
Wire ......Enameled copper wire (Class F)
Base ............................PPHS (UL 94V-0)
Terminal ....................................Cu/Ni/Sn
Adhesive................................Epoxy resin
Packaging ..................1500 pcs. per reel
2
1.92
TYP.
(.076)
N2
1
4
3
2
1
4
2.49
TYP.
(.098)
3
N1
= POLARITY
Typical Part Marking
113E = DR332A-113E
113E
0320
DATE CODE: WEEK
DATE CODE: YEAR
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Applications
■ For the suppression of EMI in data and
signal lines, e.g. CAN Bus
Surface Series
Mount Chip
Inductor
Capability
Matrix
DR332
Surface
Mount
Data Line
Chokes
Solder Profile
300
<1> Max. of 70 seconds > 200 °C
<2> Max. of 50 seconds > 230 °C
<3> Max. of 10 seconds > 255 °C
250
<3>
260 °C
255 °C
230 °C
245 °C
<2>
(°C)
200
Temperature
<1>
150
120 - 150 seconds
100
Ramp-down
5 °C/second maximum
50
Ramp-up
4 °/second maximum
0
0
50
100
150
Time
Impedance vs. Frequency
200
250
300
(Seconds)
Insertion Loss vs. Frequency
100000
0
-5
-475BE
-10
Insertion Loss (dB)
Impedance (Ω)
10000
-105BE
-225BE
1000
-474BE
-513AE
-253AE
100
-104AE
-15
-104AE
-25
-253AE
-474BE
-225BE
-30
-513AE
-105BE
-35
-113BE
-113BE
-20
-40
-475BE
-45
10
0.1
0.1
1
10
100
1
10
1000
100
1000
100
1000
Frequency (MHz)
Frequency (MHz)
10000
0
-5
Insertion Loss (dB)
Impedance (Ω)
-513BE
-513BE
1000
-10
-15
-20
-25
-30
-35
100
0.1
0.1
1
10
100
Frequency (MHz)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
1000
1
10
Frequency (MHz)
Surface Series
Mount Chip
Inductor
Capability
Matrix
DR332
Surface
Mount
Data Line
Chokes
Packaging Specifications
330.0
DIA.
(13.00)
2.0 ± 0.5
(.079 ± .020)
22.4
(.882)
COVER TAPE
13.0
(.512)
DIA.
21.0 ± 0.8
(.827 ± .031)
DIMENSIONS:
50.0
(1.969)
13.0
DIA.
(.512)
18.0
(.709)
MM
(INCHES)
EMBOSSED
CARRIER
16.0
(.630)
1.75
(.069)
END
DIA.
1.55
(.061)
8
(.315)
4
(.157)
16.0
(.630)
253A
512
160
(6.300)
253A
512
253A
512
253A
512
253A
512
NO COMPONENT
START
NO COMPONENT
COMPONENTS
390
(15.354)
USER DIRECTION OF FEED
1500 PCS. PER REEL
REV. 05/11
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.