Package Information CSP10 2.0×1.5 Land Pattern (101-2015-10) 0.5 10×φ0.3 0.5 NOTES: 1. Bump is Lead Free Sn/Ag/Cu. 2. Unit: mm. 3. Non-solder mask defined copper landing pad. 4. Laser Mark on silicon die back; back-lapped. ________________________________________________________________________ http://www.union-ic.com Rev.01 Dec.2012