R478 - Reliability Data

Reliability Data Report
Product Family R478
LTC1403 \ LTC1407 \ LTC1408 \ LTC2201 \ LTC2202 \
LTC2203 \ LTC2204 \ LTC2205 \ LTC2206 \ LTC2207 \
LTC2208 \ LTC2209 \ LTC2215 \ LTC2216 \ LTC2217 \
LTC2220 \ LTC2221 \ LTC2222 \ LTC2223 \ LTC2224 \
LTC2225 \ LTC2226 \ LTC2227 \ LTC2228 \ LTC2229 \
LTC2230 \ LTC2231 \ LTC2232 \ LTC2233 \ LTC2234 \
LTC2236 \ LTC2237 \ LTC2238 \ LTC2239 \ LTC2245 \
LTC2246 \ LTC2247 \ LTC2248 \ LTC2249 \ LTC2250 \
LTC2251 \ LTC2252 \ LTC2253 \ LTC2254 \ LTC2255 \
LTC2272 \ LTC2273 \ LTC2274 \ LTC2280 \ LTC2281 \
LTC2282 \ LTC2283 \ LTC2284 \ LTC2285 \ LTC2286 \
LTC2287 \ LTC2288 \ LTC2289 \ LTC2290 \ LTC2291 \
LTC2292 \ LTC2293 \ LTC2294 \ LTC2295 \ LTC2296 \
LTC2297 \ LTC2298 \ LTC2299 \ LTC2350 \ LTC2351 \
LTC2355 \ LTC2356 \ LTC2360 \ LTC2361 \ LTC2362 \
LTC2365 \ LTC2366 \ LTC2372 \ LTC2373
Reliability Data Report
Report Number: R478
Report generated on: Mon Aug 17 11:54:22 PDT 2015
OPERATING LIFE TEST
PACKAGE TYPE
SAMPLE SIZE
OLDEST DATE
NEWEST DATE
K DEVICE HRS
CODE
CODE
(+125°C)
1
No. of FAILURES
2,3
SOIC/MSOP
QFN/DFN
QFP
1014
1313
154
0309
0438
0713
1428
0740
0746
652
1189
154
0
0
0
TQFP
SOT
77
233
0713
0718
0713
0801
77
233
0
0
Totals
2,791
-
-
2,305
0
HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH
PACKAGE TYPE
QFN/DFN
Totals
SAMPLE SIZE
152
152
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
4
CODE
CODE
(+85°C)
0420
-
0429
-
553
553
0
0
K DEVICE HRS
No. of FAILURES
PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C
PACKAGE TYPE
SAMPLE SIZE
OLDEST DATE
NEWEST DATE
SOIC/MSOP
QFN/DFN
606
13945
CODE
CODE
0308
0401
1413
1422
98
1936
0
0
QFP
SOT
1432
1352
0652
0726
1022
1238
402
79
0
0
Totals
17,335
-
-
2,515
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
TEMP CYCLE FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
CODE
CODE
CYCLES
SOIC/MSOP
QFN/DFN
QFP
605
13830
1251
0308
0401
0652
1413
1422
0906
267
5236
1045
0
0
0
SOT
Totals
276
15,962
0716
-
1238
-
58
6,606
0
0
OLDEST DATE
NEWEST DATE
K DEVICE
No. of FAILURES
CODE
CODE
CYCLES
THERMAL SHOCK FROM -65 TO 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOIC/MSOP
527
0308
1413
257
0
QFN/DFN
QFP
SOT
12096
1180
177
0401
0652
0740
1422
0902
1238
4905
811
48
0
0
0
Totals
13,980
-
-
6,021
0
(1) Assumes Activation Energy = 0.7 Electron Volts
(2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =5.14 FITS
(3) Mean Time Between Failure in Years = 22206.65
(4) Assumes 20X Acceleration from 85 °C to +130 °C
Note 1: 1 FIT = 1 Failure in One Billion Hours.
Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning
Reliability Data Report
Report Number: R478
Report generated on: Mon Aug 17 11:54:22 PDT 2015
HIGH TEMPERATURE BAKE AT 150 DEG C
PACKAGE TYPE
SAMPLE SIZE
QFN/DFN
Totals
1395
1,395
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
CODE
CODE
0814
-
1410
-
1321
1,321
0
0
OLDEST DATE
NEWEST DATE
K DEVICE HRS
No. of FAILURES
CODE
CODE
0803
-
1127
-
240
240
0
0
HIGH TEMPERATURE BAKE AT 175 DEG C
PACKAGE TYPE
SAMPLE SIZE
SOT
Totals
240
240