MATERIAL DECLARATION SHEET Package Type SOT236 Version 2 Product Line TISP and Diode Arrays Compliance Date RoHS Compliant August 28th, 2015 Yes No. Construction Element (subpart) Homogeneous Material MSL Material Weight (g) 1 Encapsulation Epoxy resin 0.00854 2 Leadframe Copper Alloy 0.00674 3 Chip Silicon 0.00043 4 5 6 Die Attach Bond wires Terminal Finish Headquarters Riverside CA Epoxy Gold Tin Total weight (g) 0.00004 0.00007 0.00073 0.01655 1 Homogeneous Material/ Substances Fused Silica (SiO2) Epoxy Resin Phenol Resin Epoxy, Cresol Novolac Carbon Black Copper (Cu) Iron (Fe) Silver (Ag) Zinc (Zn) Phosphorus (P) Silicon (Si) Aluminum (Al) Nickel (Ni) Gold (Au) Silver (Ag) Formaldehyde, polymer with aniline, maleated, cyclized Phenol, 4,4'-(1-methylethylidene)bis-, polymer with 2,2'-[(1methylethylidene)bis(4,1phenyleneoxymethylene)]bis[oxirane] Reaction product: bisphenol-A(epichlorhydrin); epoxy resin (number average molecular weight <= 700) Gold (Au) Tin (Sn) CASRN 87.70 5.00 5.00 2.00 0.30 94.95 2.35 2.50 0.12 0.08 97.40 1.27 1.28 0.06 88.50 Material Mass (%) of total units wt. 45.23 2.58 2.58 1.03 0.15 38.67 0.96 1.02 0.05 0.03 2.51 0.03 0.03 0.00 0.22 67784-74-1 5.50 0.01 25036-25-3 5.50 0.01 25068-38-6 0.50 0.00 7440-57-5 07440-31-5 100.00 100.00 0.45 4.41 if applicable 60676-86-0 Trade secret Trade secret 29690-82-2 1333-86-4 7440-50-8 7439-89-6 7440-22-4 7440-66-6 7723-14-0 7440-21-3 7429-90-5 7440-02-0 7440-57-5 7440-22-4 Material Mass (%) www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Subpart Mass of total wt. (%) 51.58 40.73 2.58 0.25 0.45 4.41 Rev1 - Aug 2015 page 1 of 1