567KZ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP12, 1.28x1.684
CASE 567KZ
ISSUE A
SCALE 4:1
DATE 27 JAN 2015
ÈÈ
ÈÈ
PIN A1
REFERENCE
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
A B
D
DIM
A
A1
A2
b
D
E
e
0.05 C
2X
0.05 C
2X
TOP VIEW
A
A2
0.10 C
A1
GENERIC
MARKING DIAGRAM*
0.08 C
NOTE 3
C
SIDE VIEW
XXXX
ALYW
G
SEATING
PLANE
A
L
Y
W
G
e/2
12X
b
e
e
0.05 C A B
0.03 C
C
B
2
3
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
A
1
MILLIMETERS
MIN
MAX
0.65
−−−
0.17
0.23
0.38 REF
0.23
0.29
1.28 BSC
1.684 BSC
0.40 BSC
4
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
0.40
PITCH
PACKAGE
OUTLINE
12X
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON92747F
ON SEMICONDUCTOR STANDARD
REFERENCE:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
WLCSP12, 1.28X1.684
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON92747F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY B. BLAUER.
18 NOV 2014
A
MODIFIED DIMENSIONS A, A1 AND b. REQ. BY B. BLAUER.
27 JAN 2015
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
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© Semiconductor Components Industries, LLC, 2015
January, 2015 − Rev. A
Case Outline Number:
567KZ