SOT23-5

PACKAGE MECHANICAL INFORMATION
SOT23-5
Package Outline Dimensions
This surface mount package consists of a chip mounted on a leadframe and fully encapsulated in an epoxy mold compound.
With Pb-Free terminations, this package meets the requirements of IPC/Jedec J-STD-20, moisture level 1 at 260 °C.
MO-178, AA, JEDEC 95
5-Pin Plastic Small Outline Surface Mount
1.90 TYP.
(0.075)
5
4
2.60 - 3.00
(0.102 - 0.118)
1
3
2
0.95
TYP.
(0.037)
1.50 - 1.70
(0.059 - 0.067)
2.80 - 3.00
(0.110 - 0.118)
1.14 - 1.35
(0.045 - 0.053)
8 ° MAX.
0.00 - 0.15
(0.000 - 0.006)
DIMENSIONS ARE :
MILLIMETERS
(INCHES)
JUNE 2008
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
0.30 - 0.50
(0.012 - 0.020)
0.30 - 0.50
(0.012 - 0.020)
SOT23-5
Tape Dimensions
5-Pin Plastic Small Outline Surface Mount Embossed Carrier Tape
3.90 - 4.10
(0.154 - 0.161)
DIA.
ECA/EIA-481
1.50 - 1.60
(0.059 - 0.063)
1.95 - 2.05
(0.077 - 0.081)
1.65 - 1.85
(0.065 - 0.073)
3.45 - 3.55
(0.136 - 0.140)
0.27 MAX.
(0.011)
7.90 - 8.30
(0.311 - 0.327)
Cover
Tape
3.90 - 4.10
(0.154 - 0.161)
1.74 TYP.
(0.069)
DIA. 1.00 - 1.25
(0.039 - 0.049)
Direction of Feed
20 °
DIMENSIONS ARE :
Maximum Component
Rotation
MILLIMETERS
(INCHES)
JUNE 2008
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
SOT23-5
Reel Dimensions
5-Pin Plastic Small Outline Surface Mount Reel - 13 "
100
(3.94)
330
(12.99)
Hub Detail
Rim Detail
DIA.
20.20
MIN.
(0.795)
12.80 - 13.20
(0.492 - 0.520)
7.9 - 10.9
(0.311 - 0.429)
Hub Detail
MAX. 14.4
(0.567)
Rim Detail
DIMENSIONS ARE :
MILLIMETERS
(INCHES)
JUNE 2008
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
SOT23-5
Recommended Printed Wiring Land Pattern Dimensions
Printed Wiring Land Pattern
1.90
(0.075)
1.00
(0.039)
2.60
(0.102)
0.70
(0.028)
0.95
(0.037)
DIMENSIONS ARE :
MILLIMETERS
(INCHES)
JUNE 2008
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications