Hermetic Packages for Integrated Circuits Package Outline Drawing K2.A 2 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE Rev 1, 4/12 0.030 (0.762) REF PIN NO. 1 ID OPTIONAL POSITIVE LEAD INDICATOR (NO. 1) 0.019 (0.483) 0.050 (1.270) BSC 0.015 (0.381) A 1 2 PIN NO. 1 ID AREA 0.093 (2.362) 0.081 (2.057) A 0.240 (6.10) 0.500 (12.70) MIN 0.220 (5.59) TOP VIEW 0.210 (5.33) 0.190 (4.83) 0.050 (1.270) 0.041 (1.041) 0.0065 (0.1651) 0.0045 (0.1143) 0.014 (0.356) REF SIDE VIEW 0.0065 (0.1651) 0.0045 (0.1143) LEAD FINISH NOTES: 0.0095 (0.2413) BASE METAL 0.0045 (0.1143) 0.019 (0.48) 0.015 (0.38) 0.0015 (0.04) MAX 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. Alternately, a tab may be used to identify pin one. 2. If a pin one identification mark is used in addition to a tab, the limits of the tab dimension do not apply. 3. The maximum limits of lead dimensions (section A-A) shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 0.022 (0.56) 0.015 (0.38) 3 SECTION A-A 1 4. Dimensioning and tolerancing conform to ANSI Y14.5M-1982. 5. Dimensions: Inch (mm). Controlling dimension: Inch.