MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide 2014 Microchip Technology Inc. DS50002308A Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-637-3 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS50002308A-page 2 Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 2014 Microchip Technology Inc. Object of Declaration: MCP3912 ADC Evaluation Board for 16-Bit MCUs VP Development Tools 2014 Microchip Technology Inc. DS50002308A-page 3 MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE Table of Contents Preface ........................................................................................................................... 5 Introduction............................................................................................................ 5 Document Layout .................................................................................................. 5 Conventions Used in this Guide ............................................................................ 6 Recommended Reading........................................................................................ 7 The Microchip Web Site ........................................................................................ 7 Customer Support ................................................................................................. 7 Document Revision History ................................................................................... 7 Chapter 1. Product Overview 1.1 Overview ........................................................................................................ 8 1.2 What the MCP3912 ADC Evaluation Board for 16-Bit MCUs Contains ......... 9 Chapter 2. Hardware Description 2.1 PIM Module/MCP3912 Connection and Peripheral Usage Overview .......... 10 2.2 Analog Input Structure .................................................................................. 11 2.3 Universal Serial Bus (USB) .......................................................................... 12 Chapter 3. Firmware 3.1 PIC24FJ256GA110 Firmware Description ................................................... 13 3.2 Data Acquisition ........................................................................................... 13 3.3 UART Communication Protocol ................................................................... 14 Appendix A. Schematics and Layouts A.1 Introduction .................................................................................................. 15 A.2 Board – Power Schematic ........................................................................... 16 A.3 Board – ADC Schematic .............................................................................. 17 A.4 Board – Microcontroller (MCU) Schematic .................................................. 18 A.5 Board – PIM Module Schematic ................................................................. 19 A.6 Board – Top Silk .......................................................................................... 20 A.7 Board – Top Copper and Silk ....................................................................... 20 A.8 Board – Top Copper .................................................................................... 21 A.9 Board – Internal Plane 1 and Assembly Top ............................................... 22 A.10 Board – Internal Plane 2 and Assembly Top ............................................. 22 A.11 Board – Bottom Copper ............................................................................. 23 A.12 Board – Bottom Copper and SILK ............................................................. 23 A.13 Board – Bottom Silk ................................................................................... 24 Appendix B. Bill of Materials (BOM) Worldwide Sales and Service .................................................................................... 28 DS50002308A-page 4 2014 Microchip Technology Inc. MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE Preface NOTICE TO CUSTOMERS All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available. Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document. For the most up-to-date information on development tools, see the MPLAB® IDE online help. Select the Help menu, and then Topics to open a list of available online help files. INTRODUCTION This chapter contains general information that will be useful to know before using the MCP3912 ADC Evaluation Board for 16-Bit MCUs. Items discussed in this chapter include: • • • • • • Document Layout Conventions Used in this Guide Recommended Reading The Microchip Web Site Customer Support Document Revision History DOCUMENT LAYOUT This document describes how to use the MCP3912 ADC Evaluation Board for 16-Bit MCUs as a development tool to emulate and debug firmware on a target board. The manual layout is as follows: • Chapter 1. “Product Overview” – Provides important information about the MCP3912 ADC Evaluation Board for 16-Bit MCUs hardware. • Chapter 2. “Hardware Description” – Provides information about the evaluation board software. • Chapter 3. “Firmware” – Describes the MCP3912 ADC Evaluation Board for 16-Bit MCUs firmware. • Appendix A. “Schematics and Layouts”– Shows the schematic and board layouts for the MCP3912 ADC Evaluation Board for 16-Bit MCUs. • Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the MCP3912 ADC Evaluation Board for 16-Bit MCUs. 2014 Microchip Technology Inc. DS50002308A-page 5 MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide CONVENTIONS USED IN THIS GUIDE This manual uses the following documentation conventions: DOCUMENTATION CONVENTIONS Description Arial font: Italic characters Initial caps Quotes Underlined, italic text with right angle bracket Bold characters N‘Rnnnn Text in angle brackets < > Courier New font: Plain Courier New DS50002308A-page 6 Represents Examples Referenced books Emphasized text A window A dialog A menu selection A field name in a window or dialog A menu path MPLAB® IDE User’s Guide ...is the only compiler... the Output window the Settings dialog select Enable Programmer “Save project before build” A dialog button A tab A number in verilog format, where N is the total number of digits, R is the radix and n is a digit. A key on the keyboard Click OK Click the Power tab 4‘b0010, 2‘hF1 Italic Courier New Sample source code Filenames File paths Keywords Command-line options Bit values Constants A variable argument Square brackets [ ] Optional arguments Curly brackets and pipe character: { | } Ellipses... Choice of mutually exclusive arguments; an OR selection Replaces repeated text Represents code supplied by user File>Save Press <Enter>, <F1> #define START autoexec.bat c:\mcc18\h _asm, _endasm, static -Opa+, -Opa0, 1 0xFF, ‘A’ file.o, where file can be any valid filename mcc18 [options] file [options] errorlevel {0|1} var_name [, var_name...] void main (void) { ... } 2014 Microchip Technology Inc. Preface RECOMMENDED READING This user’s guide describes how to use MCP3912 ADC Evaluation Board for 16-Bit MCUs. Another useful document is listed below. The following Microchip document is available and recommended as a supplemental reference resource: • MCP3912 Data Sheet – “3V Four-Channel Analog Front End” (DS20005348A) THE MICROCHIP WEB SITE Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives CUSTOMER SUPPORT Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com. DOCUMENT REVISION HISTORY Revision A (September 2014) • Initial release of this document. 2014 Microchip Technology Inc. DS50002308A-page 7 MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE Chapter 1. Product Overview 1.1 OVERVIEW The MCP3912 ADC Evaluation Board for 16-Bit MCUs system provides the opportunity to evaluate the performance of the MCP3912 four-channel Analog Front End (AFE). It also provides a development platform for 16-bit microcontroller-based applications, using the existing 100-pin PIC® microcontroller Plug-in Module (PIM) systems that are compatible with Explorer 16 Evaluation Board (DM240001) and other high pin count PIC device based demo boards. The system comes with a programmed PIC24FJ256GA110 PIM module that communicates with the Energy Management Utility software for data exchange and ADC setup. The MCP3912 ADC Evaluation Board for 16-Bit MCUs uses the Energy Management Utility software for evaluation of the MCP3912 via a USB connection to the board. A download link for this software can be found on the evaluation board’s web page. For instructions on the use of this software, refer to the supporting documentation included within the application install package. 1.1.1 Feature Highlights • Four-channel ADC MCP3912 output display using serial communication to the PC software interface. • Simultaneous 57 ksps at OSR32 address loop ALL or 95 dB SINAD at OSR512 performance on MCP3912. • System and ADC performance analysis through graphical PC tools showing noise histogram, frequency domain (FFT), time domain scope plot and statistical numerical analysis. • Robust hardware design with analog grounding and analog/digital separation, allowing low noise evaluation of the MCP3912 device; includes separate power supplies and power planes on a four-layer board. • PICtail™ Plus connectors for Explorer 16 daughter board compatibility. DS50002308A-page 8 2014 Microchip Technology Inc. Product Overview FIGURE 1-1: 1.2 MCP3912 Evaluation Board. WHAT THE MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUS CONTAINS This MCP3912 ADC Evaluation Board for 16-Bit MCUs kit includes: • • • • MCP3912 ADC Evaluation Board for 16-Bit MCUs (Part number ADM00499) PIC24FJ256GA110 PIM USB Cable Important Information Sheet 2014 Microchip Technology Inc. DS50002308A-page 9 MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE Chapter 2. Hardware Description 2.1 PIM MODULE/MCP3912 CONNECTION AND PERIPHERAL USAGE OVERVIEW The MCP3912 ADC Evaluation Board for 16-Bit MCUs contains a 100-pin PIM socket compatible with Microchip’s PIM modules. The system comes with one PIM module, the PIC24FJ256GA110. LD2 LD3 RA9/10 RD11/12/13 CONTROL SWITCHES (X3) RF4/U2RX UART SERIAL TO PC COMMUNICATION RF5/U2TX OC1/RG6 OSC1 DGND DVDD OSC2 AGND AVDD Clock Generation/ Phase Correction RA14/ADC_DR RG9/ADC_CS RG6/ADC_SCK RG7/ADC_MISO RG8/ADC_MOSI PIM Module FIGURE 2-1: DS50002308A-page 10 RESET DR CS SCK SDO SDI SPI Serial Interface SINC3 Digital Filter RA5/ADC_RESET SINC3 Digital Filter Current Boost Circuit INT VREF Delta Sigma Multi-Level Modulator PGA Delta Sigma Multi-Level Modulator PGA + CH0+ - CH0- + CH3+ - CH3- MCP3912 Digital Connection Overview PIM/MCP3912 Connections. 2014 Microchip Technology Inc. Hardware Description Ports A, D and G are used for signals such as push buttons, output LEDs, CS and MCLR (for the MCP3912 data mode setting). Output Compare 1 is used for clock generation in the MCP3912. Serial communication is achieved through the MSSP module 1. The MCP3912 device is an Analog Front End (AFE) with four ADCs featuring a second order modulator and a third order sinc filter, plus a first order sinc filter used for higher OSR values. The delta-sigma A/D converters have an adjustable oversampling ratio. The CLKIN pin of the MCP3912 is the oversampling clock (MCLK) input. The MCP3912 ADC Evaluation Board for 16-Bit MCUs offers two different options for the MCP3912 master clock (MCLK). The default setting for the ADC internal clock is an external clock driven by the MCU. 2.1.1 Using the Crystal X1 The MCP3912 ADC Evaluation Board for 16-Bit MCUs is populated with a 10 MHz crystal, used as a clock source by placing jumpers in the following position on the MCP3912 Digital I/O header block: CLKOUT CLKIN CLKIN FIGURE 2-2: 2.1.2 XTAL XTAL PIM OC1 ADC Clock Selection Jumpers – External Crystal. Driving the Clock with the PIM Module The PIC MCU can be used to generate the CLKIN (MCLK) signal for the MCP3912, setting the ADC sample rate through the use of the output compare module OC1. To use this feature, make the following jumper change to the MCP3912 Digital I/O header block: CLKOUT CLKIN CLKIN FIGURE 2-3: XTAL XTAL PIM OC1 ADC Clock Selection Jumpers – Clock from MCU. The frequency of the OC1 output is based on the PR1 bit settings in the firmware. 2.2 ANALOG INPUT STRUCTURE Four differential input paths allow external signal sources to be easily connected to the MCP3912 inputs. Screw-terminal connectors J1, J4, J7, J21, J23, J25, J27 and J29 are 3-pin connectors that act as both screw-type and clip-on post connectors. Note: To use a screw-terminal connector as a post connector, pull up the blue plastic top to access the posts. The connectors J1, J4, J7, J21, J23 and J25 can be used to force either channel from a differential to single-ended configuration. R4 and R11 (on CH0), R19 and R21 (on CH1) R18 and R65 (on CH2), R69 and R71 (on CH3), R75 and R77 (on CH4) and R81 and RR83 (on CH5) act as locations for burden resistor connectors for any current transformer inputs. 2014 Microchip Technology Inc. DS50002308A-page 11 MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide 2.3 UNIVERSAL SERIAL BUS (USB) The MCP3912 ADC Evaluation Board for 16-Bit MCUs also contains a USB connection for connecting the evaluation board to a PC. There is an MCP2200 USB to UART converter on the board that creates a virtual COMM port on the PC. The MCP3912 ADC Evaluation Board for 16-Bit MCUs also features an RS-232 connector, just in case it is required. The RS-232 line driver is connected to the same UART pins of the MCU. For this reason, a 3-pin jumper (J16) is present on the evaluation board to select which serial communication will be used: USB or RS-232. The following figure summarizes the connections between the ADC, MCU, USB to serial converter and the RS-232 line driver. USB MCP2200 PIM Module MCP3912 ADC USB RG6/SCK1 SCK RG7/ADC_MISO RG8/ADC_MOSI SDO TX RX RS-232 Driver RS-232 RF5/U2TX SDI RF4/U2RX RX TX FIGURE 2-4: USB Block Diagram. The MCP2200 is powered from the USB with 5V. The Q1 transistor (see Appendix A. “Schematics and Layouts”) is used to disconnect the board from the PC when it is powered-down to avoid power consumption. By changing the jumper J9 setting, the user can select the source of the power supply for the board to be either +5V derived from the USB or an external +9V power supply. Since the PIC24F runs at 3.3V, a level shifter was used to modify the signal level to 5V as required by the MCP2200; this is done with U11 (see Appendix A. “Schematics and Layouts”). The 7.3728 MHz value of the crystal is required to achieve the correct baud rate values for higher speed. This design uses a baud rate of 921.6 kbaud and for this baud rate, the register (U1BRG) value is 3 (decimal). DS50002308A-page 12 2014 Microchip Technology Inc. MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE Chapter 3. Firmware 3.1 PIC24FJ256GA110 FIRMWARE DESCRIPTION 3.1.1 MCU Initialization The microcontroller used for the code example is the 16-bit XLP with 16 MIPS PIC24FJ256GA110. The MCU has remappable pins and output compare with a dedicated time base. The MCU uses a 7.3278 MHz crystal for the clock and the internal PLL to increase the frequency by four times. The uncommon crystal value was chosen to obtain the correct baud rate, even for high baud rates. The remappable pins are configured to make the PIM compatible with the Explorer 16 development board. The MCP3912 is linked with the MCU through the SPI1 port. The ADC clock is given by OC1. The DR pin of the MCP3912 is tied to external Interrupt 2. Serial data transmission is carried out through the UART2 module. For transmission, OC2 interrupt is used; for receiving, the _U1RX Interrupt is used. The UART communication speed is 921.6 kbaud. OC2 is used for the serial transmission to create short bursts of data that can be processed by the MCP2200. Sending too many characters, with no time between them at the current baud rate, will cause the MCP2200 to lose data. Note: 3.2 The PIC24FJ256GA110 must be Rev. A5 or newer in order for this code example to work. DATA ACQUISITION External Interrupt 2 is used for detecting the end of conversion on the MCP3912. In the INT2 Interrupt, the data samples are read from the ADC using SPI. When a new buffer begins to be read, Timer 4 is started. This is set as a 32-bit timer together with Timer 5. Timer 4 will be stopped when the buffer is full, and is used to measure the sampling speed. Before reading the data samples, the MCU investigates the address loop setting (READ <1:0> bits) in the STATUSCOM register and adjusts the read sequence accordingly (when the address is not incremented automatically in hardware, the MCU has to do that in firmware, leading to a longer read sequence). The acquired samples are written in four long vectors created in the RAM of the MCU. The four vectors hold the first, second and third byte from both channels. The vectors have a length of 2048. The value of Timer 4 and the values of the other registers inside the ADC are stored in a vector called “internal_registers[26]”. 2014 Microchip Technology Inc. DS50002308A-page 13 MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide 3.3 UART COMMUNICATION PROTOCOL The serial connection is used to send the acquired data to the PC at a speed of 921.6 kbaud, and the MCP2200 is used for the UART-to-USB conversion. The communication uses handshaking, meaning that the board will not send data to the PC unless the board receives a command from the PC. The UART transmission is triggered by the output compare module OC2.This allows the data to be transmitted to the PC in short bursts that are separated by a dead time. This method of sending data allows the MCP2200 to handle the high throughput. If the entire amount of data is sent continuously to the PC at the current baud rate, the MCP2200 will not be able to process the data for correct USB transfer. After a complete transmission, the UART RX interrupt is enabled by increasing its priority relative to all other interrupts. In this interrupt, the MCU needs to receive the values of the internal registers as the user is setting them in the PC GUI. DS50002308A-page 14 2014 Microchip Technology Inc. MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE Appendix A. Schematics and Layouts A.1 INTRODUCTION This appendix contains the following schematics of the MCP3912 ADC Evaluation Board for 16-Bit MCUs: • • • • • • • • • • • • 2014 Microchip Technology Inc. Board – Power Schematic Board – ADC Schematic Board – Microcontroller (MCU) Schematic Board – PIM Module Schematic Board – Top Silk Board – Top Copper and Silk Board – Top Copper Board – Internal Plane 1 and Assembly Top Board – Internal Plane 2 and Assembly Top Board – Bottom Copper Board – Bottom Copper and SILK Board – Bottom Silk DS50002308A-page 15 BOARD – POWER SCHEMATIC 32:(5 5V 8 1 S 10k 0603 5 USB_EN 0603 G 4 SI1307EDL & 0.1uF 0603 & 10uF 16V 0.1uF 1206 0603 GND GND 1 - 1 3 2 ' MRA4005 10uF 20V TANT-B GND GND MCP1754S-3.3V VIN VOUT GND - LM1117-5V VIN VOUT GND 1 GND 2 986% 9,1 3.3D & & 0.1uF 0603 10uF 1206 73 73 Via_2.5x1.5 Via_2.5x1.5 5 GND GND GND GND 3 3.3A / & & 0.1uF 0603 10uF 1206 0.1uF 0603 GND /' GREEN & GND GND - 1x2 GND 9(;7 5V 0603 GND GND 2x2 1 2 3.3D Net Tie GND GNDA DS50002308A-page 16 3$' Bumpon Hemisphere Black Schematics and Layouts & 3 GND 2 8 3 3 1 4 2 9V 3 1k U3 32:(5 9,1 VIN VOUT GND & D 1k 86%6WDQGE\3URWHFWLRQ MCP1825S-3.3V 1 5V_USB 2 5V_USB 5 2 2014 Microchip Technology Inc. A.2 2014 Microchip Technology Inc. A.3 BOARD – ADC SCHEMATIC $'& - 3.3D 1 2 RA14/3912_DR 1x3 5 0603 - GNDA GNDA 1k 1% GNDA 2x3 5 1k 5 GNDA 1x3 5 0603 1k 1k 1% - GNDA 5 3 1 6 4 2 0603 1 2 3 - &+ *1' &+ 5 GNDA 1k 1% 5 1x3 5 0603 1k 1% - GNDA 5 3 1 6 4 2 1 2 3 0603 GNDA GNDA 1k 1% 5 GNDA 1x3 5 0603 1k 1k 1% GNDA GNDA 1k 1% 0603 1% 0603 1% 0603 1% - 5 3 1 6 4 2 0603 1 2 3 - &+ *1' &+ 0603 1% 2x3 1k 5 0603 1% GNDA 5 GNDA 2x3 5 1k & 1k 1% 0603 0.1uF 0603 GNDA 5 & 1k 1% 0603 0.1uF 0603 3.3A 3.3D 5 0603 1% 5 10R 0603 10R 0603 & 0603 0.1uF 5 & 1k 1% 0603 0.1uF 0603 GNDA 5 & 1k 1% 0603 0.1uF 0603 & 1k 1% 0603 0.1uF 0603 GNDA 5 & 1k 1% 0603 0.1uF 0603 GNDA 1 GNDA & 1k 1% 0603 0.1uF 0603 GNDA 5 & 1k 1% 0603 0.1uF 0603 16 2 3 CH1CH1+ 4 5 CH2+ CH2- 6 7 CH3CH3+ REFIN+ REFIN- 5 0.1uF RA5/3912_RESET RG8/3912_SDI RG7/3912_SDO RG6/3912_SCK RG9/3912_CS RA14/3912_DR RF4/PMPA9/U2RX RF5/PMPA8/U2TX GND 8 CH0+ CH0- 5 - 0603 & 0.1uF 0603 GNDA GNDA 8 9 14 15 MCP3912 AVDD DVDD AGND DGND DGND CH0+ CH0CH1CH1+ CH2+ CH2CH3CH3+ REFIN+ REFIN- RESET SDI SDO SCK CS DR OSC2 OSC1/CLKI NC NC NC NC NC 28 20 17 27 5 26 100R 25 5 24 10R 235 18 10R 22 21 19 13 12 11 10 2x8 GND GND 0603 5 0603 10R 5 0603 0603 0603 10R 5 10R 0603 RA5/3912_RESET RG8/3912_SDI RG7/3912_SDO RG6/3912_SCK RG9/3912_CS RA14/3912_DR $'&&/2&.6(/(&7 - 5 (&&3 0603 10R RD3/3912_CLKIN ;7$/ ; ;7$/ ; & 2x3 0603 SF 5 1M 1% 0603 GND ; 10MHz & DS50002308A-page 17 SF 0603 GND Schematics and Layouts - 1k 5 & 2x3 5 &+ *1' &+ 0603 1% GNDA 1k 5 0603 1% 0603 1k 15 13 11 9 7 5 3 1 16 14 12 10 8 6 4 2 GNDA 1k 1k 1% 5 3 1 6 4 2 0603 1 2 3 &+ *1' &+ 5 1 3 5 2 4 6 5 - 5 1x2 BOARD – MICROCONTROLLER (MCU) SCHEMATIC /&' 0.1uF 0603 0603 4.7k & 0603 GND 0.1uF 5 1k 0603 1k 0603 5 0603 3.3D 0603 3.3D 1k 5 1k GND /' GREEN RED 1 2 3 4 5 6 7 8 9 10 RC13 GND & 0.1uF 0603 0.1uF & 0603 0.1uF & RD14/U1CTS 0.1uF 0603 GND 20 19 18 17 16 15 14 13 12 11 EN FORCE_OFF C1+ VCC V+ GND C1T1OUT C2+ R1IN C2R1OUT V- FORCE_ON T2OUT T1N R2IN T2IN R2OUT R2OUTI TIINVALID NVALID 3.3D GND RX 0603 RF5/PMPA8/U2TX TX 1k 4.7k 0603 3 2 1 12MHz 1k 0603 0603 /' 2 3 5 1k 1 6 2 7 3 8 4 9 5 - GND GND 1 6: 4 0603 RD12 RG9/3912_CS RG6/3912_SCK RG7/3912_SDO RG8/3912_SDI GND RB8/AN8 RA9/PMPA7 GND RA15/INT4 RF12/U2CTS 3.3D 5V 9V 2 3 4.7k 0603 5 1k RG15 RG12 RA0/TMS RA4/TDI RA6 RB6/AN6/PGC RB5/AN5 RB10/PMPA13 RB12/PMPA11 RB14/PMPA1 RC1 RC3 RC13 SPST & 0.1uF 0603 GND GND 3.3D 8 VDD VSS OSC1 D+ OSC2 DRST VUSB GP7/TxLED D GP0 GP6/RxLED D GP1 GP5 GP2 GP4 CTS GP3 RX TX RTS RD0/SDO1 RD2 RD4 RD6 RD8 RD10/SCK1 RD12 3.3D RE0/PMPD0 RE2/PMPD2 RE4/PMPD4 RE6/PMPD6 5 0.1uF 0603 GND GND 20 19 18 17 16 15 14 13 12 11 USB_P USB_N GND GND 1 6: 4 2 3 4.7k 0603 5 0603 1k RD13 SPST & USB_EN 0.1uF 0603 GND & 0.1uF 0603 GND '$7$9,(:3257 86% GND GND 3.3D U9-RX 1 2 3 4 GND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 - 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 MEC1-160-02-L-D-A 8 B2 B1 GND VCCB VCCA OE A2 A1 8 7 6 5 5V_USB 3.3D RF5/PMPA8/U2TX - 0&3 1 5V_USB USB_N 2 USB_P 3 VBUS S DD+ 4 U9-RX 1 2 3 1 RD11 5 9 RED, GREEN 5V_USB 0603 1k 3.3D TXS0102 5(' 5 SPST GND MCP2200 5 *5((1 4 DS50002308A-page 18 GND 3 4.7k 0603 & 1 2 3 4 5 6 7 8 9 10 RB2/SS1/AN2 RF6/INT0/SCK1 RF7 RF8 GND RB0/AN0 RB3/AN3 GND RE9 RD14/U1CTS 3.3D 5V 9V RG0 RG1 & GND 5 MCLR 0.1uF 0603 GND 5V_USB ; 2 3.3D RX GND TX RD15/U1RTS RC14 5V_USB 0603 1k GND ID 5 GND - 1x3 5 RF2/U1RX RF3/U1TX RG2/SCL1 RG3/SDA1 GND RB1/AN1 RB4/AN4 GND RE8/INT1 RD15/U1RTS 3.3D 5V 9V RF0 RF1 RB2/SS1/AN2 RF6/INT0/SCK1 RF7 RF8 GND RB0/AN0 RB3/AN3 GND RE9 RD14/U1CTS 3.3D 5V 9V RG0 RG1 RF4/PMPA9/U2RX RF5/PMPA8/U2TX RA2/SCL2 RA3/SDA2 GND RB9/AN9 RA10/PMPA6 GND RA14/3912_DR RF13/U2RTS 3.3D 5V 9V RG0 RG1 RG9/3912_CS RG6/3912_SCK RG7/3912_SDO RG8/3912_SDI GND RB8/AN8 RA9/PMPA7 GND RA15/INT4 RF12/U2CTS 3.3D 5V 9V RG13 RG14 RA1/TCK RA5/3912_RESET RA7 RB7/AN7/PGD MCLR RB11/PMPA12 RB13/PMPA10 RB15/PMPA0 RC2 RC4/SDI1 RC14 RG15 RG12 RA0/TMS RA4/TDI RA6 RB6/AN6/PGC RB5/AN5 RB10/PMPA13 RB12/PMPA11 RB14/PMPA1 RC1 RC3 RC13 RD1/HOLD RD3/3912_CLKIN RD5 RD7 RD9 RD11 RD13 3.3D RE1/PMPD1 RE3/PMPD3 RE5/PMPD5 RE7/PMPD7 RD0/SDO1 RD2 RD4 RD6 RD8 RD10/SCK1 RD12 3.3D RE0/PMPD0 RE2/PMPD2 RE4/PMPD4 RE6/PMPD6 GND GND 1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 - 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 33 35 37 39 41 43 45 47 49 51 53 55 57 59 61 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 65 67 69 71 73 75 77 79 81 83 85 87 89 91 93 95 97 99 101 103 105 107 109 111 113 115 117 119 66 68 70 72 74 76 78 80 82 84 86 88 90 92 94 96 98 100 102 104 106 108 110 112 114 116 118 120 MEC1-160-02-X-D Edge Card RF2/U1RX RF3/U1TX RG2/SCL1 RG3/SDA1 GND RB1/AN1 RB4/AN4 GND RE8/INT1 RD15/U1RTS 3.3D 5V 9V RF0 RF1 RF4/PMPA9/U2RX RF5/PMPA8/U2TX RA2/SCL2 RA3/SDA2 GND RB9/AN9 RA10/PMPA6 GND RA14/3912_DR RF13/U2RTS 3.3D 5V 9V RG0 RG1 RG13 RG14 RA1/TCK RA5/3912_RESET RA7 RB7/AN7/PGD MCLR RB11/PMPA12 RB13/PMPA10 RB15/PMPA0 RC2 RC4/SDI1 RC14 RD1/HOLD RD3/3912_CLKIN RD5 RD7 RD9 RD11 RD13 3.3D RE1/PMPD1 RE3/PMPD3 RE5/PMPD5 RE7/PMPD7 GND Schematics and Layouts 0603 1k 5 4 0.1uF 0603 GND 5 1 6: & 8 5 5 GND SN75C3223PWR U8-RX 3 SPST 0.1uF 0603 GND GND 0603 2 4.7k 0603 3.3D GND GND & 4 & /' 2 GND RA10/PMPA6 5 RA2/SCL2 RA3/SDA2 0603 10R RA9/PMPA7 3.3D 1 6: 0 1uF 0603 5 5 GND RF4/PMPA9/U2RX U8-RX 1uF 0603 GND 3.3D 1 & 5V 1 & 0603 1k VSS SDA SCL RST VDD 4 3 2 1 5 & 5 5 A K 2 3.3D 7 6 C1- C1+ VOUT NHD-C0216CIZ-FSW-FBW-3V3 8 2014 Microchip Technology Inc. A.4 BOARD – PIM MODULE SCHEMATIC 3.3D GND GND 3.3D 3.3D 3.3D 3,&,&' 5 10k 0603 15 36 45 65 75 31 U10 PIC32MX775 1M OSC2 OSC1 DS50002308A-page 19 RG0 RG1 RG2/SCL1 RG3/SDA1 RG6/3912_SCK RG7/3912_SDO RG8/3912_SDI RG9/3912_CS RG12 RG13 RG14 RG15 90 89 57 56 10 11 12 14 96 97 95 1 3.3D 5 10R 0603 GND 5 5 1k 0603 1k 0603 3.3D 5 5 0603 10R 0603 0R GND & & 0.1uF 0603 10uF 1206 GND VDDCORE GND MCLR VBUS VUSB VCAP/VDDCORE VDD VDD VDD VDD VDD VDD AVDD VSS VSS VSS VSS VSS AVSS TMS/RA0 TCK/RA1 SCL2/RA2 SDA2/RA3 TDI/RA4 TDO/RA5 TRCLK/RA6 TRD3/RA7 VREF-/CVREF-/AERXD2/PMA7/RA9 VREF+/CVREF+/AERXD3/PMA6/RA10 AETXCLK/SCL1/INT3/RA14 AETXEN/SDA1/INT4/RA15 PGED1/AN0/CN2/RB0 PGEC1/AN1/CN3/RB1 AN2/C2IN-/CN4/RB2 AN3/C2IN+/CN5/RB3 AN4/C1IN-/CN6/RB4 AN5/C1IN+/VBUSON/CN7/RB5 PGEC2/AN6/OCFA/RB6 PGED2/AN7/RB7 AN8/C1OUT/RB8 AN9/C2OUT/RB9 AN10/CVREFOUT/PMA13/RB10 AN11/ERXERR/AETXERR/PMA12/RB11 AN12/ERXD0/AECRS/PMA11/RB12 AN13/ERXD1/AECOL/PMA10/RB13 AN14/ERXD2/AETXD3/PMALH/PMA1/RB14 AN15/ERXD3/AETXD2/OCFB/PMALL/PMA0/CN12/RB15 C1RX/ETXD1/PMD11/RF0 C1TX/ETXD0/PMD10/RF1 SDA3/SDI3/U1RX/RF2 USBID/RF3 SDA5/SDI4/U2RX/PMA9/CN17/RF4 SCL5/SDO4/U2TX/PMA8/CN18/RF5 SCL3/SDO3/U1TX/RF8 AC1RX/SS4/U5RX/U2CTS/RF12 AC1TX/SCK4/U5TX/U2RTS/RF13 SDO1/OC1/INT0/RD0 OC2/RD1 OC3/RD2 OC4/RD3 OC5/PMWR/CN13/RD4 PMRD/CN14/RD5 ETXEN/PMD14/CN15/RD6 ETXCLK/PMD15/CN16/RD7 RTCC/EMDIO/AEMDIO/IC1/RD8 SS1/IC2/RD9 SCK1/IC3/PMCS2/PMA15/RD10 EMDC/AEMDC/IC4/PMCS1/PMA14/RD11 ETXD2/IC5/PMD12/RD12 ETXD3/PMD13/CN19/RD13 AETXD0/SS3/U4RX/U1CTS/CN20/RD14 AETXD1/SCK3/U4TX/U1RTS/CN21/RD15 C2RX/PMD8/RG0 C2TX/ETXERR/PMD9/RG1 D+/RG2 PMD0/RE0 D-/RG3 PMD1/RE1 ECOL/SCK2/U6TX/U3RTS/PMA5/CN8/RG6 PMD2/RE2 ECRS/SDA4/SDI2/U3RX/PMA4/CN9/RG7 PMD3/RE3 ERXDV/AERXDV/ECRSDV/AECRSDV/SCL4/SDO2/U3TX/PMA3/CN10/RG8 PMD4/RE4 ERXCLK/AERXCLK/EREFCLK/AEREFCLK/SS2/U6RX/U3CTS/PMA2/CN11/RG9 PMD5/RE5 TRD1/RG12 PMD6/RE6 TRD0/RG13 PMD7/RE7 TRD2/RG14 AERXD0/INT1/RE8 AERXERR/RG15 AERXD1/INT2/RE9 17 38 58 59 60 61 91 92 28 29 66 67 25 24 23 22 21 20 26 27 32 33 34 35 41 42 43 44 6 7 8 9 63 73 74 64 72 76 77 78 81 82 83 84 68 69 70 71 79 80 47 48 93 94 98 99 100 3 4 5 18 19 RA0/TMS RA1/TCK RA2/SCL2 RA3/SDA2 RA4/TDI RA5/3912_RESET RA6 RA7 RA9/PMPA7 RA10/PMPA6 RA14/3912_DR RA15/INT4 RD5 RB0/AN0 RB1/AN1 RB2/SS1/AN2 RB3/AN3 RB4/AN4 RB5/AN5 RB6/AN6/PGC RB7/AN7/PGD RB8/AN8 RB9/AN9 RB11/PMPA12 RB10/PMPA13 RB12/PMPA11 RB13/PMPA10 RB14/PMPA1 RB15/PMPA0 5 1k 0603 1k 0603 5($&7,9(3:5 - 4 3 3.3D 3.3D & RD6 & 0.1uF 0.1uF 0603 0603 GND GND RD0/SDO1 RD1/HOLD RD2 RD3/3912_CLKIN RD4 RD5 RD6 RD7 RD8 RD9 RD10/SCK1 RD11 RD12 RD13 RD14/U1CTS RD15/U1RTS 3.3D RD10/SCK1 RD0/SDO1 RD1/HOLD RD8 & 0.1uF 0.1uF 0603 0603 GND GND 2 GND GND 1 6 5 7 RD10/SCK1 RD0/SDO1 RD1/HOLD 1 6 5 7 3 8 CS SCK SI/SIO0 SO/SIO1 3.3D 3.3D 3.3D 3.3D & & & & & 0.1uF 0603 0.1uF 0603 0.1uF 0603 0.1uF 0603 0.1uF 0603 GND GND GND GND GND 3.3D & 0.1uF 0603 GND 8 2 SIO2 - 4 3 3.3D RC4/SDI1 RD7 RD10/SCK1 RD0/SDO1 RD1/HOLD VSS 4 8 GND GND 1 6 5 7 3 GND 8 CS 2 3.3D RC4/SDI1 HOLD/SIO3 SIO2 RD9 RD10/SCK1 RD0/SDO1 RD1/HOLD VSS 4 GND 1 6 5 7 3 VCC SCK SI/SIO0 SO/SIO1 8 2 3.3D RC4/SDI1 HOLD/SIO3 SIO2 8 8 RED 2 23LC1024 VCC 1k 0603 /' 8 SCK SI/SIO0 SO/SIO1 1k 0603 1 23LC1024 CS 5 HCPL-181 1x2 HOLD/SIO3 23LC1024 3.3D VCC 5 $&7,9(3:5 RED 1 3 3.3D & 8 RD4 38/6(2873876 /' HCPL-181 1x2 RC1 RC2 RC3 RC4/SDI1 OSC1 RC13 RC14 OSC2 RE0/PMPD0 RE1/PMPD1 RE2/PMPD2 RE3/PMPD3 RE4/PMPD4 RE5/PMPD5 RE6/PMPD6 RE7/PMPD7 RE8/INT1 RE9 5 CS VSS VCC SCK SI/SIO0 SO/SIO1 4 8 2 GND 3.3D RC4/SDI1 HOLD/SIO3 SIO2 23LC1024 VSS 4 GND Schematics and Layouts RF0 RF1 RF2/U1RX RF3/U1TX RF4/PMPA9/U2RX RF5/PMPA8/U2TX RF8 RF12/U2CTS RF13/U2RTS RD8 3,002'8/( T2CK/RC1 T3CK/AC2TX/RC2 T4CK/AC2RX/RC3 T5CK/SDI1/RC4 OSC1/CLKI/RC12 SOSCI/CN1/RC13 SOSCO/T1CK/CN0/RC14 OSC2/CLKO/RC15 87 88 52 51 49 50 53 40 39 RG2/SCL1 0603 1% RG3/SDA1 1M 5 0603 1% ENVREG 1 2 16 37 46 62 86 30 0R 0603 2 GND GND GND GND GND GND 85 5 2.2k 0603 1 2 3.3D 3.3D 3.3D 3.3D 3.3D ENVREG 3.3D 55 5 2.2k 0603 1 VDDCORE 5 1 2 RF6/INT0/SCK1 54 22pF 0603 5 3.3D 13 22pF 0603 ; 7.3728MHz 1x6 RF7 & MCLR 3.3D GND RB7/AN7/PGD RB6/AN6/PGC MCLR & 2 - 6 5 4 3 2 1 2014 Microchip Technology Inc. A.5 MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide A.6 BOARD – TOP SILK A.7 BOARD – TOP COPPER AND SILK DS50002308A-page 20 2014 Microchip Technology Inc. Schematics and Layouts A.8 BOARD – TOP COPPER 2014 Microchip Technology Inc. DS50002308A-page 21 MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide A.9 BOARD – INTERNAL PLANE 1 AND ASSEMBLY TOP A.10 BOARD – INTERNAL PLANE 2 AND ASSEMBLY TOP DS50002308A-page 22 2014 Microchip Technology Inc. Schematics and Layouts A.11 BOARD – BOTTOM COPPER A.12 BOARD – BOTTOM COPPER AND SILK 2014 Microchip Technology Inc. DS50002308A-page 23 MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide A.13 BOARD – BOTTOM SILK DS50002308A-page 24 2014 Microchip Technology Inc. MCP3912 ADC EVALUATION BOARD FOR 16-BIT MCUs USER’S GUIDE Appendix B. Bill of Materials (BOM) TABLE B-1: BILL OF MATERIALS (BOM) Qty Reference Description 40 C3, C4, C5, C10, C11, C12, C14, C16, C18, C27, C28, C29, C30, C31, C32, C33, C34, C35, C36, C37, C38, C39, C40, C41, C42, C43, C46, C47, C50, C51, C52, C53, C54, C55, C56, C61, C64, C65, C66, C67 Cap. ceramic 0.1 µF 16V 10% X7R 0603 TDK Corporation C1608X7R1C104K 3 C13, C44, C45 Cap. ceramic 10 µF 16V 10% X5R SMD 1206 TDK Corporation C3216X5R1C106K 1 C15 Cap. Tant. 10 µF 20V 10% 2.1Ohm SMD B AVX Corporation TAJB106K020RNJ 1 C17 Cap. ceramic 10 µF 10V 20% X7R SMD 1206 TDK Corporation C3216X7R1A106M 4 C6, C7, C25, C26 Cap. ceramic 22 pF 50V 10% C0G SMD 0603 TDK Corporation C1608C0G1H220J 2 C62, C63 Cap. ceramic 1 µF 10V 20% X7R SMD 0603 TDK Corporation C1608X7R1A105M 1 D1 Diode Rect. MRA4005 1.1V 1A 600V DO-214AC_SMA ON Semiconductor® MRA4005T3G 5 J3, J7, J21, J23, Conn. header-2.54 Male 2x3 TH vert. J25 Samtec, Inc. TSW-103-08-L-D 4 J6, J12, J13, J19 Conn. header-2.54 Male 1x2 TH vert. FCI 77311-118-02LF 1 J8 Conn. header-2.54 Male 2x8 TH vert. FCI 68602-116HLF 1 J9 Conn. header-2.54 100V 2A Male 2x2 TH 3M vert. 961204-6404-AR 1 J10 Conn. power jack 2.5mm CUI Inc PJ-002B 1 J11 Conn. header-2.54 Male 1x6 TH vert. FCI 68001-106HLF 1 J14 Conn. DSUB 250V 2A DB-9-RA_F TE Connectivity 1 J15 Conn. USB Mini USB-B Female SMD R/A Hirose Electric Co., Ltd. 1 J16 Conn. header-2.54 Male 1x3 TH vert. Molex® 90120-0763 1 J17 Conn. Mini Edge Card MEC1 1mm Female 2x60 SMD vert. Samtec, Inc. MEC1-160-02-L-D-A Note 1: Manufacturer Part Number 1734354-2 UX60-MB-5ST The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2014 Microchip Technology Inc. DS50002308A-page 25 MCP3912 ADC Evaluation Board for 16-Bit MCUs User’s Guide TABLE B-1: Qty BILL OF MATERIALS (BOM) Reference Description Manufacturer Part Number 4 J20, J22, J24, J26 Conn. terminal female 1x3 TH R/A Keystone Electronics Corp. 8723 1 J20, J22, J24, J26 Pluggable terminal blocks 24 pin break-away header Keystone Electronics Corp. 8724 1 L1 Ferrite 300mA 0.5R SMD 1806 Laird Technologies® LI1806C151R-10 1 LCD1 Display LCD NHD-C0216CIZ-FSW-FBW-3V3 16x2 Alpha 3.3V TH Newhaven Display NHD-C0216CIZ-FSW-FBW-3V3 2 LD1, LD2 Diode LED green 1.7V 20 mA 0603 OSRAM Opto Semiconductors GmbH. LG L29K-G2J1-24-Z 1 LD3 Diode LED red 2V 25 mA 0603 OSRAM Opto Semiconductors GmbH. LS Q976-NR-1-0-20-R18 2 LD4, LD5 Diode LED red 1.65V 30 mA RAD T-1_3/4 Kingbright Corp WP7113LSRD 1 LD6 Diode LED bi red, green 1.95V, 2.1V 30mA 0805 Kingbright Corp APHBM2012SURKCGKC 1 Q1 Trans. Fet. P-CH SI1307EDL -12V -850 mA 290mW SOT-323-3 Vishay Siliconix SI1307EDL-T1-GE3 1 R5 Res. 100 OHM 1/10W 1% 0603 SMD Panasonic® ERJ-3EKF1000V 9 R6, R7, R8, R9, Res. TKF 10R 5% 1/10W SMD 0603 R10, R12, R14, R17, R54 Yageo Corporation RC0603JR-0710RL 8 R16, R67, R68, R73, R74, R79, R80, R85 Res. TKF 1k 1% 1/10W SMD 0603 Panasonic ERJ-3EKF1001V 2 R20, R42 Res. TKF 1M 1% 1/10W SMD 0603 Panasonic ERJ-3EKF1004V 20 R25, R26, R29, R30, R35, R37, R45, R46, R47, R49, R50, R51, R52, R55, R56, R57, R59, R60, R63, R98 Res. TKF 1k 5% 1/10W SMD 0603 Panasonic ERJ-3GEYJ102V 2 R28, R62 Res. TKF 10k 5% 1/10W SMD 0603 Panasonic ERJ-3GEYJ103V 2 R27,R32 Res. TKF 0R 1/10W SMD 0603 Panasonic ERJ-3GEY0R00V 6 R33, R36, R44, R48, R53, R58 Res. TKF 4.7k 5% 1/10W SMD 0603 Yageo Corporation RC0603JR-074K7L 2 R38, R39 Res. TKF 2.2k 5% 1/10W SMD 0603 Panasonic ERJ-3GEYJ222V 4 SW1, SW2, SW3, SW4 Switch SPST 12V 50 mA TL3301NF160QG/TR SMD E-Switch®, Inc. TL3301NF160QG/TR 1 U4 IC Power LM1117-5V SOT-223-3 National Semiconductor LM1117MPX-5.0/NOPB 2 U6, U7 IC Photo HCPL-181 4-SMD Avago Technologies HCPL-181-00CE 1 U8 IC Transceiver SN75C3223PWR TSSOP-20 Texas Instruments SN75C3223PWR 4 U10 Socket PIM 100 pin female TH Oupiin 2246-1X25G00SU 1 U11 IC Transceiver TXS0102 US-8 Texas Instruments TXS0102DCUR Crystal 10 MHz 18pF SMD HC49/US Abracon® ABLS-10.000MHZ-B4-T 1 X1 Corporation Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. DS50002308A-page 26 2014 Microchip Technology Inc. Bill of Materials (BOM) TABLE B-1: Qty BILL OF MATERIALS (BOM) Reference Description Manufacturer Part Number 1 X2 Crystal 7.3728 MHz 18 pF SMD HC49/US Abracon Corporation 1 X3 Resonator 12 MHz 0.1% SMD CSTCE-G Murata Electronics® CSTCE12M0G15L99-R0 1 U2 MCHP Ana. LDO MCP1825S-3.3V SOT-223-3 Microchip Technology Inc. MCP1825S-3302E/DB 1 U3 MCHP Ana. LDO MCP1754ST-3302E/DB Microchip SOT-223-3 Technology Inc. MCP1754ST-3302E/DB 1 U5 IC ADC 8 Ch Delta Sigma SSOP-28 Microchip Technology Inc. MCP3912 1 U9 MCHP Int. USB MCP2200 SSOP-20 Microchip Technology Inc. MCP2200-I/SS 4 U12, U13, U14, U15 MCHP Mem. SRAM 23LC1024 TSSOP-8 Microchip Technology Inc. 23LC1024-I/ST 5 PAD1 Mech. HW Rubber Pad Bumpon Hemisphere 0.44" x 0.20" Black 3M SJ-5003 (BLACK) 0 R18, R64, R65, R66, R69, R70, R71, R72, R75, R76, R77, R78, R81, R82, R83, R84 DO NOT POPULATE – Res. TKF 1k 1% 1/10W SMD 0603 Panasonic ERJ-3EKF1001V 0 R31, R34 DO NOT POPULATE – Res. TKF 10R 5% Yageo 1/10W SMD 0603 RC0603JR-0710RL 0 R40, R41 DO NOT POPULATE – Res. TKF 1k 5% 1/10W SMD 0603 Panasonic ERJ-3GEYJ102V 0 R43 DO NOT POPULATE – Res. TKF 1M 1% 1/10W SMD 0603 Panasonic ERJ-3EKF1004V Note 1: ABLS-7.3728MHZ-B4-T The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in manufacturing uses all RoHS-compliant components. 2014 Microchip Technology Inc. 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