Package Outline Drawing Y22.15x15 22 I/O 15mmx15mmx3.6mm CUSTOM HDA MODULE Rev 2, 9/13 PIN 1 INDICATOR C = 0.35 DATUM A 13.00 15.00 A B 1 5.00 7.30 0.10 C 2X 0.10 C 2X 13.60 ±0.15 fff CAB TOP VIEW DATUM B 0.50 BOTTOM VIEW 1.50 3.7 MAX 0.10 C 0.10 0.10 4 17x (0.60±0.05) 0.08 C MAX 0.025 DETAIL B C A B C SEATING PLANE SIDE VIEW C 3 1.00 NOTES: 1. All dimensions are in millimeters. 2. All tolerances ± 0.10mm, unless otherwise noted. 3. Represents the basic land grid pitch. 4. The total number of smaller I/O pads is 17. All 17 I/O’s are centered in a fixed row and column matrix at 1.0mm pitch BSC. 5. Dimensioning and tolerancing per ASME Y14.5M-1994. 6. Tolerance for exposed DAP edge location dimension. 1.00 1.00 4 17x (0.60±0.05) 1.00 TERMINAL TIP DETAIL A 3 Plastic Packages for Integrated Circuits A B C D E F 13.60 ±0.15 fff CAB 15.00 SEE DETAIL A 14 13 12 11 10 9 8 7 6 5 4 3 2 1 SEE DETAIL B TERMINAL #A1 INDEX AREA (7.5x7.5) 3.00 4.30 A1 A1 3.30 3.00 2.30 4.00 3.60 2.00 2.30 3.00 7.30 3.15 0.35 4.35 3.30 6.15 4.30 3.65 4.65 3.70 4.65 6.50 3.60 0.60 4.30 CENTERLINE POSITION DETAILS FOR THE 5 EXPOSED DAPS DIMENSIONAL DETAILS FOR THE 5 EXPOSED PADS BOTTOM VIEW BOTTOM VIEW Plastic Packages for Integrated Circuits 3.00 2 5.15 6.80 7.50 6.20 4.80 4.20 2.80 1.50 2.20 0.20 0.80 0.20 0.00 1.50 0.80 3.20 3.80 4.80 4.20 6.80 6.20 7.50 3 7.50 6.20 6.20 6.80 5.80 5.50 4.20 5.20 4.80 4.20 2.80 3.20 2.20 2.20 2.50 1.50 4.80 3.80 2.80 1.80 1.20 0.50 0.00 0.00 0.80 1.80 3.20 4.80 5.50 6.80 6.80 TERMINAL AND PAD EDGE DETAILS BOTTOM VIEW 7.50 6.80 1.80 2.50 0.00 2.50 1.80 3.50 5.50 6.80 6.20 7.50 7.50 7.50 Plastic Packages for Integrated Circuits 7.50 6.80 6.22 5.22 4.50 4.50 4.22 3.30 3.22 2.50 2.22 2.50 1.50 0.88 1.22 6.22 6.79 7.50 4.22 4.79 3.79 1.30 3.22 0.22 0.79 0.22 0.10 0.00 0.10 0.79 2.79 2.22 1.30 4.79 6.79 6.22 5.79 5.30 4.79 4.79 3.79 4.10 2.79 2.79 1.79 2.70 4.22 3.90 2.22 1.30 0.45 0.00 0.18 0.00 0.83 7.50 6.79 0.25 0.60 0.17 1.83 2.15 2.10 3.15 2.63 3.15 3.88 3.98 4.48 4.30 4.15 4.55 5.40 4.98 SUGGESTED STENCIL OPENING CENTER POSITION SUGGESTED STENCIL OPENING EDGE POSITION TOP VIEW TOP VIEW 6.55 6.75 7.50 5.20 6.25 5.55 4.15 5.15 4.00 3.68 3.75 2.48 2.75 1.45 2.15 0.15 0.55 1.45 7.50 2.85 7.50 4.85 7.50 6.05 4.60 4.65 3.25 3.08 1.00 1.35 0.65 3.65 5.65 7.50 6.65 4.45 7.50 4.50 5.65 6.48 6.45 6.15 7.50 5.48 3.45 Plastic Packages for Integrated Circuits 4.70 7.50 4 5.50 3.50 4.22 6.79 7.50 7.50 6.50 6.22 7.50 6.50 7.50 6.19 5.15 4.11 4.50 3.50 0.70 0.50 0.00 0.70 0.50 2.50 4.50 6.50 7.50 7.50 6.80 7.50 6.20 4.80 3.80 3.20 4.20 1.50 0.20 0.80 0.00 0.20 1.50 0.80 2.80 2.20 4.80 4.20 6.80 6.20 7.50 5 7.50 5.80 4.80 3.80 2.80 1.80 6.80 6.20 6.20 5.50 5.20 4.80 4.20 4.20 3.20 2.80 2.20 2.20 2.50 1.50 1.20 0.50 0.00 0.00 0.80 1.80 3.20 4.80 5.50 6.80 6.80 7.50 PCB LAND PATTERN 7.50 6.20 6.80 5.50 3.50 2.50 1.80 0.00 1.80 2.50 6.80 7.50 7.50 Plastic Packages for Integrated Circuits 7.50 6.80