Package Outline Drawing (POD)

Package Outline Drawing
Y22.15x15
22 I/O 15mmx15mmx3.6mm CUSTOM HDA MODULE
Rev 2, 9/13
PIN 1 INDICATOR
C = 0.35
DATUM A
13.00
15.00
A
B
1
5.00
7.30
0.10 C 2X
0.10 C 2X
13.60 ±0.15
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CAB
TOP VIEW
DATUM B
0.50
BOTTOM VIEW
1.50
3.7 MAX
0.10 C
0.10
0.10
4 17x (0.60±0.05)
0.08 C
MAX 0.025
DETAIL B
C A B
C
SEATING PLANE
SIDE VIEW
C
3
1.00
NOTES:
1.
All dimensions are in millimeters.
2.
All tolerances ± 0.10mm, unless otherwise noted.
3.
Represents the basic land grid pitch.
4.
The total number of smaller I/O pads is 17. All 17
I/O’s are centered in a fixed row and column matrix
at 1.0mm pitch BSC.
5.
Dimensioning and tolerancing per ASME Y14.5M-1994.
6.
Tolerance for exposed DAP edge location dimension.
1.00
1.00
4 17x (0.60±0.05)
1.00
TERMINAL TIP
DETAIL A
3
Plastic Packages for Integrated Circuits
A
B
C
D
E
F
13.60 ±0.15
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CAB
15.00
SEE DETAIL A
14 13 12 11 10 9 8 7 6 5 4 3 2 1
SEE DETAIL B
TERMINAL #A1
INDEX AREA
(7.5x7.5)
3.00
4.30
A1
A1
3.30
3.00
2.30
4.00
3.60
2.00
2.30
3.00
7.30
3.15
0.35
4.35
3.30
6.15
4.30
3.65
4.65
3.70
4.65
6.50
3.60
0.60
4.30
CENTERLINE POSITION DETAILS FOR THE 5 EXPOSED DAPS
DIMENSIONAL DETAILS FOR THE 5 EXPOSED PADS
BOTTOM VIEW
BOTTOM VIEW
Plastic Packages for Integrated Circuits
3.00
2
5.15
6.80
7.50
6.20
4.80
4.20
2.80
1.50
2.20
0.20
0.80
0.20
0.00
1.50
0.80
3.20
3.80
4.80
4.20
6.80
6.20
7.50
3
7.50
6.20
6.20
6.80
5.80
5.50
4.20
5.20
4.80
4.20
2.80
3.20
2.20
2.20
2.50
1.50
4.80
3.80
2.80
1.80
1.20
0.50
0.00
0.00
0.80
1.80
3.20
4.80
5.50
6.80
6.80
TERMINAL AND PAD EDGE DETAILS
BOTTOM VIEW
7.50
6.80
1.80
2.50
0.00
2.50
1.80
3.50
5.50
6.80
6.20
7.50
7.50
7.50
Plastic Packages for Integrated Circuits
7.50
6.80
6.22
5.22
4.50
4.50
4.22
3.30
3.22
2.50
2.22
2.50
1.50
0.88
1.22
6.22
6.79
7.50
4.22
4.79
3.79
1.30
3.22
0.22
0.79
0.22
0.10
0.00
0.10
0.79
2.79
2.22
1.30
4.79
6.79
6.22
5.79
5.30
4.79
4.79
3.79
4.10
2.79
2.79
1.79
2.70
4.22
3.90
2.22
1.30
0.45
0.00
0.18
0.00
0.83
7.50
6.79
0.25
0.60
0.17
1.83
2.15
2.10
3.15
2.63
3.15
3.88
3.98
4.48
4.30
4.15
4.55
5.40
4.98
SUGGESTED STENCIL OPENING CENTER POSITION
SUGGESTED STENCIL OPENING EDGE POSITION
TOP VIEW
TOP VIEW
6.55
6.75
7.50
5.20
6.25
5.55
4.15
5.15
4.00
3.68
3.75
2.48
2.75
1.45
2.15
0.15
0.55
1.45
7.50
2.85
7.50
4.85
7.50
6.05
4.60
4.65
3.25
3.08
1.00
1.35
0.65
3.65
5.65
7.50
6.65
4.45
7.50
4.50
5.65
6.48
6.45
6.15
7.50
5.48
3.45
Plastic Packages for Integrated Circuits
4.70
7.50
4
5.50
3.50
4.22
6.79
7.50
7.50
6.50
6.22
7.50
6.50
7.50
6.19
5.15
4.11
4.50
3.50
0.70
0.50
0.00
0.70
0.50
2.50
4.50
6.50
7.50
7.50
6.80
7.50
6.20
4.80
3.80
3.20
4.20
1.50
0.20
0.80
0.00
0.20
1.50
0.80
2.80
2.20
4.80
4.20
6.80
6.20
7.50
5
7.50
5.80
4.80
3.80
2.80
1.80
6.80
6.20
6.20
5.50
5.20
4.80
4.20
4.20
3.20
2.80
2.20
2.20
2.50
1.50
1.20
0.50
0.00
0.00
0.80
1.80
3.20
4.80
5.50
6.80
6.80
7.50
PCB LAND PATTERN
7.50
6.20
6.80
5.50
3.50
2.50
1.80
0.00
1.80
2.50
6.80
7.50
7.50
Plastic Packages for Integrated Circuits
7.50
6.80