Plastic Packages for Integrated Circuits Package Outline Drawing L4.2.00x1.25 4 LD OPTICAL CHIP ON BOARD PACKAGE (COB) Rev 3, 2/14 PIN 1 INDEX AREA 1.1 4 1 0.360 0.100 1.25 ± 0.05 1.00 ± 0.10 0.700 0.550 2.00 ± 0.05 PIN 3 EXTENDED PAD TOP VIEW PIN 3 EXTENDED PAD 0.450 2 3 0.330 1 BOTTOM VIEW PACKAGE OUTLINE 3x 0.700 1.1 0.100 4x 0.360 2x 0.700 1 0.800 TYPICAL RECOMMENDED LAND PATTERN NOTES: 1 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Pin 1 is diagonal to extended Pad Pin 3 on bottom surface.