Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L4.2.00x1.25
4 LD OPTICAL CHIP ON BOARD PACKAGE (COB)
Rev 3, 2/14
PIN 1
INDEX AREA
1.1
4
1 0.360
0.100
1.25 ± 0.05
1.00 ± 0.10
0.700
0.550
2.00 ± 0.05
PIN 3
EXTENDED PAD
TOP VIEW
PIN 3
EXTENDED PAD
0.450
2
3
0.330
1
BOTTOM VIEW
PACKAGE OUTLINE
3x 0.700
1.1
0.100
4x 0.360
2x 0.700
1
0.800
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Pin 1 is diagonal to extended Pad Pin 3 on bottom surface.