MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 26 February 2016, 07:55 GMT
Diotec Semiconductor AG
DUNS-Nummer: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations Autorisiert durch:
Udo Steinebrunner, Product Manager, -
Deklaration gilt ab: 1 January 2004 [Approved on 30 January 2015, 15:09 GMT]
Materialien und Stoffe
Verwendung/Andordnung
Chip (die)
Die attach
Encapsulation
Leadfinish
Leadframe
Page 1
Material
group
Other
inorganic
materials
Lead and Lead
alloys
EP (Epoxy
resin)
Tin plating
Copper (e.g.
copper
amounts in
cable
harnesses)
% w/w des
Materials
im Artikel
3.40000%
2.10000%
16.70000%
6.80000%
71.00000%
Substances in the
material
CAS Number
% w/w
des Stoffs
im Artikel
Nickel
7440-02-0
1.00000%
Gold
7440-57-5
11.50000%
Polydimethyl
siloxane
63148-62-9
25.00000%
Silicon
7440-21-3
62.50000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY
TRIOXIDE
1309-64-4
0.80000%
Tetrabromobisphenol
A (TBBPA)
79-94-7
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
Copper
7440-50-8
0.80000%
Silver
7440-22-4
3.70000%
Tin
7440-31-5
95.50000%
Nickel
8049-31-8
0.40000%
Copper
7440-50-8
99.60000%
Report generated: 26 February 2016, 07:55 GMT
Full Material Declaration for attached parts list
Beigefügte Artikelliste
Part number
Artikelbezeichnung
Artikelmasse
Artikelmasse
UoM
DO-213AB/MELF
Diode SMD
0.12
g
Page 2
Report generated: 26 February 2016, 07:55 GMT