567GF

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP16, 1.56x1.56
CASE 567GF
ISSUE D
DATE 24 APR 2014
SCALE 4:1
ÈÈ
ÈÈ
PIN A1
REFERENCE
D
A
B
A3
A2
E
0.10 C
2X
DETAIL A
0.10 C
2X
TOP VIEW
A2
DETAIL A
0.10 C
0.05 C
A1
DIM
A
A1
A2
A3
b
D
E
e
MILLIMETERS
MIN
MAX
−−−
0.60
0.17
0.23
0.33
0.39
0.04 BSC
0.24
0.29
1.56 BSC
1.56 BSC
0.40 BSC
GENERIC
MARKING DIAGRAM*
A
NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
SEATING
PLANE
C
SIDE VIEW
XXXXX
ALYWW
G
e/2
16X
b
e
0.05 C A B
0.03 C
e
D
e/2
C
B
A
1
2
3
4
BOTTOM VIEW
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
WW
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.40
PITCH
16X
0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON85355E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP16, 1.56X1.56
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON85355E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY M. HILTON.
15 NOV 2012
A
MOVED PIN ONE INDICATOR OF MARKING DIAGRAM FROM LOWER LEFT
CORNER TO UPPER LEFT CORNER. REQ. BY M. HILTON.
11 DEC 2012
B
CORRECTED GENERIC MARKING DIAGRAM INFORMATION AND CHANGED
DIMENSION A3 TO MIN AND MAX. REQ. BY M. HILTON.
07 JAN 2013
C
CORRECTED GENERIC MARKING DIAGRAM. REQ. BY M. HILTON.
10 APR 2014
D
CHANGED A3 DIMENSION FROM 0.02 MIN & 0.04 MAX TO 0.04 BSC. REQ. BY M.
HILTON.
24 APR 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. C
Case Outline Number:
567GF