PTVS Solder Profile

Surface Mount Solder Reflow Profile - PTVS Overvoltage Protectors
Surface Mount Packages are qualified by simulating the solder reflow conditions specified in
IPC/JEDEC J-STD-020, which defines soldering conditions for moisture reflow sensitivity
classification.
Users should ensure they do not exceed the scope of IPC/JEDEC J-STD-020 (Pb-Free) during
solder assembly.
Profile Feature
Profile Limits
Preheat temperature min. (Tsmin)
150oC
Preheat temperature max. (Tsmax)
200oC
Ramp time (Tsmax - Tsmin)
60 – 120 seconds
Ramp –up rate ( TL to Tp)
3 oC/second max
Liquidus temperature (TL)
217oC
Time maintained above TL
60-150 seconds
Peak package body temperature
245oC
Time within 5oC of peak temperature (tp)
30 seconds max
Ramp –down rate ( Tp to TL)
6 oC/second max
Time from 25oC to peak temperature
www.bourns.com
8 minutes max.
Oct 2015