Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L12.3x3B
12 LEAD THIN QUAD FLAT NO LEAD PLASTIC PACKAGE
Rev 0, 10/07
3.00
0.5
BSC
A
B
6
12
10
PIN #1 INDEX AREA
6
3.00
4X 1.70 REF
PIN 1
INDEX AREA
9
1
7
3
0.10 M C A B
(4X)
0.15
4
6
0.25 +0.07 / -0.05
4
12X 0 . 4 ± 0 . 1
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
0 . 75
C
BASE PLANE
( 2 . 8 TYP )
1.70 )
SEATING PLANE
0.08 C
(
SIDE VIEW
0.6
C
0 . 50
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
0 . 25
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to JEDEC STD MO-229.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.20mm and 0.32mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1