Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L20.3x4A
20 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 6/10
3.00
0.10 M C A B
0.05 M C
4 20x 0.25 +0.05
17
-0.07
A
B
A
16x 0.50
6
PIN #1
INDEX AREA
20
16
1
6
PIN 1
INDEX AREA
4.00
2.65 +/0.10
-0.15
11
0.10 (4X)
A
10
VIEW "A-A"
TOP VIEW
6
20x 0.40+/-0.10
1.65 +0.10
-0.15
7
BOTTOM VIEW
SEE
DETAIL "X"
0.10 C
SEATING PLANE
0.08 C
0.80 MAX
C
SIDE VIEW
(3.80)
(2.65)
(16x 0.50)
(20x 0.25)
(20x 0.60)
C
0 . 2 REF
(1.65)
(2.80)
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO-220VEGD-NJI.
either a mold or mark feature.
1