Plastic Packages for Integrated Circuits Package Outline Drawing L20.3x4A 20 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 0, 6/10 3.00 0.10 M C A B 0.05 M C 4 20x 0.25 +0.05 17 -0.07 A B A 16x 0.50 6 PIN #1 INDEX AREA 20 16 1 6 PIN 1 INDEX AREA 4.00 2.65 +/0.10 -0.15 11 0.10 (4X) A 10 VIEW "A-A" TOP VIEW 6 20x 0.40+/-0.10 1.65 +0.10 -0.15 7 BOTTOM VIEW SEE DETAIL "X" 0.10 C SEATING PLANE 0.08 C 0.80 MAX C SIDE VIEW (3.80) (2.65) (16x 0.50) (20x 0.25) (20x 0.60) C 0 . 2 REF (1.65) (2.80) 0 . 00 MIN. 0 . 05 MAX. TYPICAL RECOMMENDED LAND PATTERN DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be 7. JEDEC reference drawing: MO-220VEGD-NJI. either a mold or mark feature. 1