ISL59114 ® Data Sheet September 21, 2006 YC (S-video) to Composite Video Driver with LPF The ISL59114 is a YC (S-video) reconstruction filter with a -3dB roll-off frequency of 9MHz and summer amplifier to create the composite video signal. Operating from a single supply ranging from +2.5V to +3.6V and drawing only 4.5mA quiescent current, the ISL59114 is ideally suited for low power, battery-operated applications. Additionally, an enable pin shuts the part down in under 14ns. Features • 3rd order 9MHz reconstruction filter • 40V/µs slew rate • Low supply current = 4.5mA • Maximum Power-down current <0.5µA • Supplies from 2.5V to 3.6V • Rail-to-rail output The ISL59114 is designed to meet the bandwidth and very low power requirements of battery-operated communication, instrumentation, and modern industrial applications such as video on demand, cable set-top boxes, MP3 players, and HDTV. The ISL59114 is offered in a space-saving µTQFN Pb-free package guaranteed to a 0.6mm maximum height constraint and specified for operation from -40°C to +85°C temperature range. • µTQFN package Pinout • Video on demand ISL59114 (10 LD µTQFN) TOP VIEW FN6184.2 • Pb-free plus anneal available (RoHS compliant) Applications • Video amplifiers • Portable and handheld products • Communications devices • Cable set-top boxes • Satellite set-top boxes • MP3 players GND 10 • HDTV • Personal video recorder YIN 1 9 YOUT ENCLAMP 2 8 CVBSOUT CIN 3 7 COUT Block Diagram + 65mV YIN ENCY 6 4 9MHz - + x2 YOUT x2 COUT x2 CVBSOUT 1uA ENCVBS 500mV 65mV CIN 5 9MHz - + ENCY VDD + ENCLAMP + 65mV - + ENCVBS Ordering Information PART NUMBER (Note) ISL59114IRUZ-T7 PART MARKING FJ TAPE AND REEL TEMP. RANGE (°C) 7” -40 to +85 PACKAGE (Pb-Free) 10 Ld µTQFN PKG. DWG. # L10.2.1x1.6A NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2006. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL59114 Absolute Maximum Ratings (TA = +25°C) ESD Classification Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2500V Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C Supply Voltage from VDD to GND . . . . . . . . . . . . . . . . . . . . . . . 4.2V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . VDD +0.3V to GND -0.3V Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 40mA Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VDD = 3.3V, TA = +25°C, RL = 150Ω to GND, unless otherwise specified. DESCRIPTION CONDITIONS MIN TYP MAX UNIT 3.6 V INPUT CHARACTERISTICS VDD Supply Voltage Range 2.5 IDD_CY Quiescent Supply Current - CY Amps Enabled VIN = 500mV, ENCY = VDD, ENCVBS = GND, no load 3.1 4.0 mA IDD Quiescent Supply Current VIN = 500mV, ENCY = ENCVBS = VDD, no load 4.5 6.0 mA IDD_OFF Shutdown Supply Current ENCY = ENCVBS = 0V 0.1 0.5 µA VY_CLAMP Y Input Clamp Voltage IY = -100µA -30 -15 10 mV IY_DOWN Y input Clamp Discharge Current VY = 0.5V 0.6 1 1.6 µA IY_UP Y Input Clamp Charge Current VY = -0.1V -3.4 -3.0 mA RY Y Input Resistance 0.5V < VY < 1V 10 VC_CLAMP C Input Clamp Voltage VY = 0.05V, IC = 0A 500 550 700 mV RC C Input Resistance VY = 0.05V, 0.25V < VC < 0.75V 2.0 2.5 3.0 kΩ IC C Input Bias Current VY = 0.3V -200 -2 200 nA VY_SYNC Y Input Sync Detect Voltage 100 150 200 mV VOLS Output Level Shift Voltage VIN = 0V, no load 60 130 200 mV AV_CY Voltage Gain, C-Y channel RL = 150Ω 1.95 1.99 2.04 V/V AV_CVBS Voltage Gain, CVBS channel RL = 150Ω 1.93 1.98 2.04 V/V ∆AV_CY C-to-Y Channel Gain Mismatch -1.75 ±0.5 1.75 % ∆AV_CVBS C/Y-to-CVBS Channel Gain Mismatch -3 ±0.7 3 % PSRR_CY DC Power Supply Rejection VDD = 2.5V to 3.6V 40 60 dB PSRR_CVBS DC Power Supply Rejection VDD = 2.5V to 3.6V 25 35 dB VOH Output Voltage High Swing VIN = 2V, RL = 150Ω to GND 2.85 3.2 V ISC Output Short-Circuit Current VIN = 2V, to GND through 10Ω 100 145 mA IENABLE ENCY, ENCVBS Input Current 0V < VEN < 3.3V -0.2 0.001 VIL Disable Threshold VIH Enable Threshold ROUT Shutdown Output Impedance +0.2 µA 0.8 V 2.0 EN = 0V, DC EN = 0V, f = 4.5MHz 2 MΩ V 5.0 7.5 3.4 kΩ kΩ FN6184.2 September 21, 2006 ISL59114 Electrical Specifications PARAMETER VDD = 3.3V, TA = +25°C, RL = 150Ω to GND, unless otherwise specified. (Continued) DESCRIPTION CONDITIONS MIN TYP MAX UNIT AC PERFORMANCE BW0.1dB BW3dB ±0.1dB Bandwidth -3dB Bandwidth Normalized Stopband Gain RSOURCE = 75Ω, RL = 150Ω, CL = 5pF 5.6 MHz RSOURCE = 500Ω, RL = 150Ω, CL = 5pF 3.9 MHz RSOURCE = 75Ω, RL = 150Ω, CL = 5pF 8.8 MHz RSOURCE = 500Ω, RL = 150Ω, CL = 5pF 7.8 MHz f = 27MHz, RSOURCE = 75Ω -28.5 dB f = 27MHz, RSOURCE = 500Ω -30.6 dB dG Differential Gain NTSC and PAL 0.10 % dP Differential Phase NTSC and PAL 0.5 ° D/DT Group Delay Variation f = 100kHz, 5MHz 5.4 ns SNR Signal to Noise Ratio 100% white signal 65 dB TON Enable Time VIN = 500mV, VOUT to 1% 200 ns TOFF Disable Time VIN = 500mV, VOUT to 1% 14 ns +SR Positive Slew Rate 20% to 80%, VIN = 1V step 30 40 50 V/µs -SR Negative Slew Rate 80% to 20%, VIN = 1V step -30 -40 -50 V/µs tF Fall Time 2.5VSTEP, 80% - 20% 25 ns tR Rise Time 2.5VSTEP, 20% - 80% 22 ns Connection Diagram + Y (luminance) S-video cable 65mV YIN 9MHz 0.1uF - + x2 YOUT YOUT 75 75 1uA 500mV C (chrominance) CIN 0.1uF ENCLAMP uC or tie to 3.3V ENCY ENCVBS 65mV 9MHz - + x2 COUT COUT 75 + + 65mV - + x2 CVBSOUT 75 75 CVBSOUT 75 Note: ENCLAMP is high for AC coupled inputs (as shown) ENCLAMP is low for DC coupled inputs 3 FN6184.2 September 21, 2006 ISL59114 Pin Descriptions PIN NUMBER PIN NAME DESCRIPTION 1 YIN 2 ENCLAMP 3 CIN 4 ENCY 5 VDD 6 ENCVBS 7 COUT 8 CVBSOUT 9 YOUT Luminance output 10 GND Ground Luminance input Enable clamp. Tie high for AC coupled inputs. Tie low for DC coupled inputs. Chrominance input Enable chrominance and luminance outputs Positive power supply Enable composite video output Chrominance output Composite video output Typical Performance Curves 5 0 NORMALIZED GAIN (dB) NORMALIZED GAIN (dB) 5 -0.1dB BW @ 5.6MHz -5 -10 -15 -20 -25 -30 -35 VDD = +3.3V RL = 150Ω 100k -20 -25 VDD = +3.3V RL = 150Ω 4.0 3.5 3.0 -1 -2 CL = 100pF -3 35M 1M 10M FREQUENCY RESPONSE (Hz) 100k FIGURE 2. GAIN vs FREQUENCY -3dB POINT 0 -4 VDD = +3.3V RL = 150Ω FIN = 100kHz 2.5 2.0 1.5 1.0 CL = 10pF -5 -6 100k -15 25M CL = 470pF VDD = +3.3V RL = 150Ω -28dB BW @ 27MHz -10 -35 1M 10M FREQUENCY RESPONSE (Hz) VOUT (VP-P) NORMALIZED GAIN (dB) 1 -3dB BW @ 8.8MHz -5 -30 FIGURE 1. GAIN vs FREQUENCY -0.1dB 2 0 1M 10M FREQUENCY RESPONSE (Hz) 0.5 25M FIGURE 3. GAIN vs FREQUENCY FOR VARIOUS CLOAD 4 0.0 0.0 0.5 1.0 1.5 2.0 2.5 VIN (VP-P) 3.0 3.5 4.0 FIGURE 4. MAXIMUM OUTPUT MAGNITUDE vs INPUT MAGNITUDE FN6184.2 September 21, 2006 ISL59114 Typical Performance Curves (Continued) 0 270 180 VDD = +3.3V RL = 150Ω VDD = +3.3V -10 GAIN (dB) PHASE (°) -20 90 0 -90 -30 -40 -50 -60 -180 -270 100k -70 1M 10M FREQUENCY (Hz) -80 100k 100M 1M 10M FREQUENCY (Hz) 100M FIGURE 6. PSRR vs FREQUENCY FIGURE 5. PHASE vs FREQUENCY -30 VDD = +3.3V -40 YIN TO COUT GAIN (dB) -50 -60 -70 -80 CIN TO YOUT -90 -100 100k 1M 10M FREQUENCY (Hz) 50M FIGURE 8. ISOLATION vs FREQUENCY FIGURE 7. OUTPUT IMPEDANCE vs FREQUENCY SUPPLY CURRENT (mA) 7 6 5 4 3 2 1 0 0.0 FIGURE 9. MAXIMUM OUTPUT vs LOAD RESISTANCE 5 NO LOAD NO INPUT 0.5 1.0 1.5 2.0 2.5 3.0 SUPPLY VOLTAGE (V) 3.5 4.0 FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE FN6184.2 September 21, 2006 ISL59114 3.5 3.6 3.0 3.0 2.5 AMPLITUDE (V) AMPLITUDE (V) Typical Performance Curves (Continued) VDD = +3.3V RL = 150Ω VOUT = 2.5VP-P 2.0 1.5 TRISE = 26.4ns 1.0 0.0 -120 -60 0 2.4 1.8 POSITIVE SLEW RATE = 41.1V/µs 1.2 NEGATIVE SLEW RATE = -40.8V/µs 0.6 TFALL = 26.9ns 0.5 VDD = +3.3V RL = 150Ω VOUT = 1VP-P 0.0 -60 60 120 180 240 300 360 420 480 540 TIME (ns) 2.5 60 120 180 240 TIME (ns) 300 360 420 480 FIGURE 12. SLEW RATE FIGURE 11. LARGE SIGNAL STEP RESPONSE 3.0 0 3.0 VDD = +3.3V RL = 150Ω VDD = +3.3V RL = 150Ω 2.5 ENABLE SIGNAL AMPLITUDE (V) AMPLITUDE (V) DISABLE SIGNAL 2.0 1.5 1.0 0.5 0.0 2.0 1.5 1.0 0.5 0.0 OUTPUT SIGNAL -0.5 -60 -30 0 30 60 90 120 TIME (ns) 150 180 OUTPUT SIGNAL -0.5 -20 210 FIGURE 13. ENABLE TIME HARMONIC DISTORTION (dBc) HARMONIC DISTORTION (dBc) 10 TIME (ns) 20 30 40 -30 THD VDD = +3.3V RL = 150Ω VOUT = 2VP-P -40 -50 -60 3rd HD 2nd HD -70 -80 0 FIGURE 14. DISABLE TIME -20 -30 -10 1M 10M FREQUENCY (Hz) FIGURE 15. HARMONIC DISTORTION vs FREQUENCY 6 -40 THD -50 -60 3rd HD -70 2nd HD -80 0.5 1.0 1.5 2.0 2.5 OUTPUT VOLTAGE (VP-P) 3.0 FIGURE 16. HARMONIC DISTORTION vs OUTPUT VOLTAGE FN6184.2 September 21, 2006 ISL59114 Typical Performance Curves (Continued) 16 -3dB BANDWIDTH (MHz) VDD = +3.3V RL = 150Ω VDD = +3.3V RL = 150Ω 14 12 10 8 6 4 2 80 140 200 260 320 380 440 500 INPUT RESISTANCE (Ω) FIGURE 18. -3dB BANDWIDTH vs INPUT RESISTANCE FIGURE 17. GROUP DELAY vs FREQUENCY 44 VIN = 1VP-P RL = 150Ω SLEW RATE (V/µs) 43 POSITIVE SLEW RATE 42 41 40 39 NEGATIVE SLEW RATE 38 37 2.0 2.5 3.0 3.5 SUPPLY VOLTAGE (V) 4.0 FIGURE 19. SLEW RATE vs SUPPLY VOLTAGE NOISE FLOOR ( nV/ Hz ) 100 10 2 4 10kHz 6 8 1 100kHz 2 4 6 8 1 1MHz 2 4 4.2MHz FREQUENCY (Hz) FIGURE 20. UNWEIGHTED NOISE FLOOR 7 FN6184.2 September 21, 2006 ISL59114 Typical Performance Curves (Continued) JEDEC JESD51-3 AND SEMI G42-88 (SINGLE LAYER) TEST BOARD 3 0.7 0.6 515mW 0.5 θ POWER DISSIPATION (W) POWER DISSIPATION (W) 0.8 µT QF N1 19 4° 0 C/ W JA = 0.4 0.3 0.2 0.1 0 0 25 75 85 100 50 125 150 AMBIENT TEMPERATURE (°C) FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 2.5 2 1.5 1 775mW θJ 0.5 µT Q A =12 FN1 0 9°C /W 0 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Application Information The Sallen Key Low Pass Filter The ISL59114 is a single-supply rail-to-rail triple (two in, three out) video amplifier with internal sync tip clamps, a typical -3dB bandwidth of 9MHz and slew rate of about 40V/µs. The Y and C channels are internally mixed to create a third CVBS (composite) video output. This part is ideally suited for applications requiring high composite and s-video performance with very low power consumption. As the performance characteristics and features illustrate, the ISL59114 is optimized for portable video applications. The Sallen Key is a classic low pass configuration. This provides a very stable low pass function, and in the case of the ISL59114, a three-pole roll-off at 9MHz. The three-pole function is accomplished with an RC low pass network placed in series with and before the Sallen Key. One pole provided by the RC network and poles two and three provided by the Sallen Key for a nice three-pole roll-off at 9MHz. Internal Sync Clamp Embedded video DACs typically use ground as their most negative supply. This places the sync tip voltage at a minimum of 0V. Presenting a 0V input to most single supply amplifiers will saturate the output stage of the amplifier resulting in a clipped sync tip and degraded video image. The ISL59114 features an internal sync clamp and offset function that level shifts the entire video signal to the optimum level before it reaches the amplifiers’ input stage. These features also help avoid saturation of the output stage of the amplifier by setting the signal closer to the best voltage range. The simplified block diagram on the front page shows the basic operation of the ISL59114’s sync clamp. The Y input’s AC-coupled video sync signal is pulled negative by a current source at the input. When the sync tip goes below the comparator threshold, the comparator output goes high, pulling up on the Y input through the diode, forcing current into the coupling capacitor until the voltage at the Y input is again 0V, and the comparator turns off. This forces the sync tip clamp to always be 0V, setting the offset for the entire video signal. 8 Output Coupling The ISL59114 can be AC or DC coupled to its output. When AC coupling, a 220µF coupling capacitor is recommended to ensure that low frequencies are passed, preventing video “tilt” or “droop” across a line. The ISL59114’s internal sync clamp makes it possible to DC couple the output to a video load, eliminating the need for any AC coupling capacitors, saving board space, cost, and eliminating any “tilt” or offset shift in the output signal. The trade off is larger supply current draw, since the DC component of the signal is now dissipated in the load resistor. Typical load current for AC coupled signals is 5mA compared to 10mA for DC coupling. Output Drive Capability The ISL59114 does not have internal short circuit protection circuitry. If the output is shorted indefinitely, the power dissipation could easily overheat the die or the current could eventually compromise metal integrity. Maximum reliability is maintained if the output current never exceeds ±40mA. This limit is set by the design of the internal metal interconnect. Note that for transient short circuits, the part is robust. Short circuit protection can be provided externally with a back match resistor in series with the output placed close as possible to the output pin. In video applications this would be a 75Ω resistor and will provide adequate short circuit protection to the device. Care should still be taken not to stress the device with a short at the output. FN6184.2 September 21, 2006 ISL59114 Power Dissipation With the high output drive capability of the ISL59114, it is possible to exceed the +125°C absolute maximum junction temperature under certain load current conditions. Therefore, it is important to calculate the maximum junction temperature for an application to determine if load conditions or package types need to be modified to assure operation of the amplifier in a safe operating area. The maximum power dissipation allowed in a package is determined according to: T JMAX – T AMAX PD MAX = -------------------------------------------Θ JA Where: TJMAX = Maximum junction temperature Power Supply Bypassing Printed Circuit Board Layout As with any modern operational amplifier, a good printed circuit board layout is necessary for optimum performance. Lead lengths should be as short as possible. The power supply pin must be well bypassed to reduce the risk of oscillation. For normal single supply operation, a single 4.7µF tantalum capacitor in parallel with a 0.1µF ceramic capacitor from VS+ to GND will suffice. Printed Circuit Board Layout For good AC performance, parasitic capacitance should be kept to minimum. Use of wire wound resistors should be avoided because of their additional series inductance. Use of sockets should also be avoided if possible. Sockets add parasitic inductance and capacitance that can result in compromised performance. TAMAX = Maximum ambient temperature ΘJA = Thermal resistance of the package The maximum power dissipation actually produced by an IC is the total quiescent supply current times the total power supply voltage, plus the power in the IC due to the load, or: for sourcing: V OUT PD MAX = V S × I SMAX + ( V S – V OUT ) × ---------------R L for sinking: PD MAX = V S × I SMAX + ( V OUT – V S ) × I LOAD Where: VS = Supply voltage ISMAX = Maximum quiescent supply current VOUT = Maximum output voltage of the application RLOAD = Load resistance tied to ground ILOAD = Load current All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 9 FN6184.2 September 21, 2006 ISL59114 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN) D 6 INDEX AREA A L10.2.1x1.6A B N 10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS E SYMBOL 2X MIN NOMINAL MAX 1 2X 2 0.10 C TOP VIEW C A 0.05 C SEATING PLANE 1 0.45 0.50 0.55 - A1 - - 0.05 - 0.127 REF - b 0.15 0.20 0.25 5 D 2.05 2.10 2.15 - E 1.55 1.60 1.65 - A1 e SIDE VIEW k 0.20 - - L 0.35 0.40 0.45 (DATUM A) PIN #1 ID A A3 0.10 C 4xk 2 NX L 0.50 BSC - NX b e 2 Nd 4 3 Ne 1 3 0 12 - NOTES: 5 BOTTOM VIEW CL (A1) L 5 e SECTION "C-C" TERMINAL TIP C C 4 Rev. 3 6/06 0.10 M C A B 0.05 M C 3 (ND-1) X e - 10 (DATUM B) N-1 - N θ N NX (b) NOTES 0.10 C FOR ODD TERMINAL/SIDE b 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on D and E side, respectively. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. 9. Same as JEDEC MO-255UABD except: No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm "L" MAX dimension = 0.45 not 0.42mm. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389. 2.50 1.75 0.05 MIN L 2.00 0.80 0.275 0.10 MIN DETAIL “A” PIN 1 ID 0.50 0.25 LAND PATTERN 10 10 FN6184.2 September 21, 2006