485DZ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN36 6x4, 0.4P
CASE 485DZ
ISSUE A
DATE 19 JUN 2015
1 36
SCALE 2:1
PIN ONE
REFERENCE
0.15 C
2X
ÏÏ
ÏÏ
0.15 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A B
D
E
DIM
A
A1
A3
b
D
D2
D3
D4
D5
E
E2
E3
E4
e
G
G1
H
H1
H2
L
L2
TOP VIEW
(A3)
A
0.10 C
0.08 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
D2
D4
D5
D3
7
G
G1
18
H
E2
E4
E3
H2
24
1
36
36X
BOTTOM VIEW
H1
b
0.10
M
C A B
0.05
M
C
30X
L
NOTE 3
6X
e
e/2
SUPPLEMENTAL
BOTTOM VIEW
L2
GENERIC
MARKING DIAGRAM*
RECOMMENDED
SOLDERING FOOTPRINT*
XXXXX
XXXXX
ALYWG
G
6X
0.30
2.37
2.85
0.78
36X
0.25
2X
1.29
30X
1
0.60
R0.15
1.37
4.30
1.25
1.45
0.78
1.23
DETAIL A
0.63
DETAIL A
1.13
3.26
MILLIMETERS
MIN
MAX
0.90
1.20
0.00
0.05
0.20 REF
0.15
0.25
6.00 BSC
4.95
5.05
0.91
1.01
3.04
3.14
2.70
2.80
4.00 BSC
2.44
2.54
1.14
1.24
2.29
2.39
0.40 BSC
0.52
0.62
0.43
0.53
1.35
1.45
0.60
0.70
0.57
0.68
0.30
0.50
0.15
0.35
0.40
PITCH
ALL SIDES
NO EXPOSED
METAL ALLOWED
0.66
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON97081F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN36 6X4, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON97081F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED.
22 APR 2015
A
REMOVED NOTE 5 AND MODIFIED DETAIL A IN SOLDERING FOOTPRINT. REQ.
BY M. TRINIDAD.
19 JUN 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
June, 2015 − Rev. A
Case Outline Number:
485DZ