Plastic Packages for Integrated Circuits Package Outline Drawing L8.2x3B 8 LEAD EXTREME THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE (XDFN) Rev 2, 05/15 0 . 50 BSC 2 . 00 BSC 4 b A 1 B 0.10 M C A B 4 6 PIN 1 INDEX AREA 0.15 8 0.4 ± 0.1 (4X) 3 . 00 BSC 6 1.45 + 0.1/ -0.15 PIN 1 INDEX AREA TOP VIEW 5 1.35+0.1/ -0.15 BOTTOM VIEW PACKAGE OUTLINE ( 6 x 0.50 BSC ) ( 8 x 0.25 ) DETAIL "X" 0.10 C C 0.31 ~ 0.40 SEATING PLANE 0.08 C ( 1.45 ) SIDE VIEW ( 1.35 ) TYPICAL RECOMMENDED LAND PATTERN 0 . 127 REF 0 . 00 MIN. 0 . 05 MAX. ( 8 X 0.60 ) ( 8 x 0.20 ) C DETAIL "X" NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.18mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Package thickness does not include any sawing burr as part of thickness measurement. 1