MATERIAL DECLARATION SHEET CD1206-S01575 Material Number Product Line Diode Products Compliance Date RoHS Compliant No. Construction Element(subpart) 1 Jan 2005 Yes MSL 1 Homogeneous Material Material weight [mg] 1 Base Material Ceramic substrate 7.865 2 Silver Silver 0.329 3 Conductor Silver 0.573 4 Wafer Chip die 0.033 5 Encapsulant Epoxy 6 alloy electrode alloy 0.004 7 Plating Layer Pure tin 0.203 1.9 Total weight This Document was updated on: Homogeneous Material\ CASRN Substances if applicable Aluminum oxide 1344-28-1 >96 72.11 Silver 7440-22-4 90 2.72 Copper (II) oxide 1317-38-0 10 0.3 Silver 7440-22-4 100 5.25 Silicon 7440-21-3 60 0.18 Silver 7440-22-4 40 0.12 Silica 7631-86-9 75 13.06 Epoxy 9003-36-5 25 4.36 Ni 07440-02-0 80 0.032 Cr 07440-47-3 20 0.008 Tin 7440-31-5 100 1.86 Materials Mass % Subpart Material Mass % of mass of total total unit wt. wt. (%) 72.11 3.02 5.25 0.3 17.42 0.04 1.86 10.907 2014/11/17 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1