MATERIAL DECLARATION SHEET CD216A-B SERIES Material Number Product Line Semiconductor Products Compliance Date RoHS Compliant 2004/8/2 Yea MSL No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Dice Silica compound 2.2 2 Solder Paste High-melting point solder 0.81 3 Lead frame &clip Copper Alloy 5.27 4 Epoxy material Green molding compound 7.78 5 Plating cover Sn plating cover 0.14 Total weight Headquarters Riverside CA 1 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. 7440-21-3 7440-02-0 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7439-89-6 7723-14-0 98% 2% 92.5% 5.0% 2.5% 99.950% 0.1% 0.034% 13.31% 0.27% 4.63% 0.25% 0.12% 32.48% 0.04% 0.01% 60676-86-0 83% 39.86% Epoxy resin 29690-82-2 13.5% 6.48% BTDA Silica, quartz Carbon black 2421-28-5 14808-60-7 1333-86-4 0.55% 2.4% 0.55% 0.26% 1.16% 0.26% Tin 7440-31-5 100% 0.87% Silicon Nickel Lead* Tin Silver Copper Iron Phosphorus Silica, amorphous, fused Subpart mass of total wt. (%) 13.58% 5.00% 32.53% 48.02% 0.87% 16.2 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 2015-4-27 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead) Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2