MATERIAL DECLARATION SHEET CDNBS04-B SERIES Material Number Product Line Semiconductor Products Compliance Date RoHS Compliant 01 Jan 2006 Yes MSL No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Dice Silica compound 3.25 2 Solder Paste High-melting point solder 11.25 3 Lead frame &clip Copper Alloy 40.19 4 5 Epoxy material Plating cover Epoxy molding compound Sn plating cover Total weight Headquarters Riverside CA 69.06 1.25 1 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Silicon Lead* Nickel Lead* Tin Silver Copper Zinc Iron Phosphorus Silica 7440-21-3 7439-92-1 7440-02-0 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-66-6 7439-89-6 7723-14-0 14808-60-7 96.5% 2.5% 1.0% 92.5% 5.0% 2.5% 99.95% 0.004% 0.010% 0.034% 70% 2.50% 0.07% 0.03% 8.32% 0.45% 0.23% 32.14% 0.00% 0.00% 0.01% 38.67% Epoxy resin 29690-82-2 15% 8.29% 9003-35-4 10.0% 5.53% 1309-64-4 2.5% 1.38% 40039-93-8 2.5% 1.38% 7440-31-5 99.5% 1.00% Phenolformaldehyde polymer Antimony trioxide Bisphenol A diglycidyl ether Tin Subpart mass of total wt. (%) 2.60% 9.00% 32.15% 55.25% 1.00% 125 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET This Document was updated on: 2015-4-27 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead) 7(c)-I.Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2