Precision, Low Noise FGA™ Voltage References with Disable ISL21060 Features The ISL21060 FGA™ voltage references are low power, high precision voltage references fabricated on Intersil’s proprietary Floating Gate Analog technology. A new disable feature allows the device to shut down the output and reduce supply current drain from 15µA operating to <500nA. • Reference output voltage . . . . . . . . . . . . . . . . 2.048V, 2.500V, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.000V, 3.300V, 4.096V The ISL21060 family features guaranteed initial accuracy as low as ±1.0mV with drift down to 10ppm/°C. Noise is typically 10µVP-P (10Hz BW). This combination of high initial accuracy, low power and low output noise performance of the ISL21060 enables versatile high performance control and data acquisition applications with low power consumption. Pin Configuration • Initial accuracy . . . . . . . . . . . . . . . . . . . . . . . . ±1.0mV, ±2.5mV • Input voltage range - ISL21060-20 . . . . . . . . . . . . . . . . . . . . . . . . . . . - ISL21060-25 . . . . . . . . . . . . . . . . . . . . . . . . . . . - ISL21060-30 . . . . . . . . . . . . . . . . . . . . . . . . . . . - ISL21060-33 . . . . . . . . . . . . . . . . . . . . . . . . . . . - ISL21060-41. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5V to 5.5V 2.7V to 5.5V 3.2V to 5.5V 3.5V to 5.5V 4.3V to 5.5V • Output voltage noise . . . . . . . . . . . . . 10µVP-P (0.1Hz to 10Hz) • Supply current . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40µA (max) ISL21060 (6 LD SOT-23) TOP VIEW • Tempco . . . . . . . . . . . . . . . . . . . . . . . . 10ppm/°C, 25ppm/°C • Output current capability . . . . . . . . . . . . . . . . +10.0mA/-5mA • Operating temperature range. . . . . . . . . . . .-40°C to +125°C NC 1 6 VOUTF GND 2 5 VOUTS • Pb-Free (RoHS compliant) EN 3 4 VIN Applications • Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Ld SOT-23 • High resolution A/Ds and D/As Pin Descriptions PIN # PIN NAME 1 NC 2 GND 3 • Digital meters • Bar code scanners DESCRIPTION • Basestations No Connect; Do Not Connect or Connect to Ground • Battery management/monitoring Ground Connection • Industrial/instrumentation equipment EN Enable Input. Active High. Do not Float. 4 VIN Input Voltage Connection Related Literature 5 VOUTS Voltage Reference Output Connection (Sense) 6 VOUTF Voltage Reference Output Connection (Force) December 19, 2013 FN6706.6 1 • AN1835 “ISL21060EVAL1Z User’s Guide” CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2008, 2009, 2013. All Rights Reserved Intersil (and design) and FGA are trademarks owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL21060 Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING VOUT OPTION (V) GRADE (mV) TEMP. RANGE (ppm/°C) PACKAGE (Pb-Free) ISL21060BFH620Z-TK GACB (Note 4) 2.048 1.0 10 6 Ld SOT-23 P6.064A ISL21060CFH620Z-TK GACD (Note 4) 2.048 2.5 25 6 Ld SOT-23 P6.064A ISL21060BFH625Z-TK GAEA (Note 4) 2.500 1.0 10 6 Ld SOT-23 P6.064A ISL21060CFH625Z-TK GAGA (Note 4) 2.500 2.5 25 6 Ld SOT-23 P6.064A ISL21060BFH630Z-TK GAHA (Note 4) 3.000 1.0 10 6 Ld SOT-23 P6.064A ISL21060CFH630Z-TK GAJA (Note 4) 3.000 2.5 25 6 Ld SOT-23 P6.064A ISL21060CFH633Z-TK GAPA (Note 4) 3.300 2.5 25 6 Ld SOT-23 P6.064A ISL21060BFH641Z-TK GACC (Note 4) 4.096 1.0 10 6 Ld SOT-23 P6.064A ISL21060CFH641Z-TK GACE (Note 4) 4.096 2.5 25 6 Ld SOT-23 P6.064A PKG. DWG. # NOTES: 1. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21060BFH620, ISL21060BFH625, ISL21060BFH630, ISL21060BFH641, ISL21060CFH620, ISL21060CFH625, ISL21060CFH630, ISL21060CFH633, ISL21060CFH641. For more information on MSL, please see tech brief TB363. 4. The part marking is located on the bottom of the part. 2 FN6706.6 December 19, 2013 ISL21060 Absolute Voltage Ratings Thermal Information Max Voltage VIN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +6.5V VOUT to GND (10s). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VOUT + 1V Voltage on “DNC” pins . . . . . . . . . .No connections permitted to these pins ESD Rating Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5500V Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 550V Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2kV Thermal Resistance (Typical) θJA (°C/W) 6 Ld SOT-23 (Note 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 230 Continuous Power Dissipation (TA = +70°C, Note 7) Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C 6 Ld SOT-23, derate 5.88mW/°C above +70°C . . . . . . . . . . . . . . . 471mW Pb-free Reflow Profile (Note 6) . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Recommended Operating Conditions Temperature Range (Industrial) . . . . . . . . . . . . . . . . . . . . .-40°C to +125°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA NOTE: 5. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 6. Post-reflow drift for the ISL21060 devices will range from 100∝V to 1.0mV based on experimental results with devices tested in sockets and also on FR4 multi-layer PC boards. The design engineer must take this into account when considering the reference voltage after assembly. Electrical Specifications (ISL21060-20, VOUT = 2.048V) VIN = 3.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. PARAMETER DESCRIPTION VOUT Output Voltage VOA VOUT Accuracy @ TA = +25°C TC VOUT CONDITIONS MIN (Note 10) TYP MAX (Note 10) 2.048 UNIT V ISL21060B20 -1.0 +1.0 mV ISL21060C20 -2.5 +2.5 mV 10 ppm/°C 25 ppm/°C 5.5 V Output Voltage Temperature Coefficient ISL21060B (Note 7) ISL21060C VIN Input Voltage Range IIN Supply Current VEN = VIN 16 40 µA ΔVOUT /ΔVIN Line Regulation 2.5V < VIN < 5.5V 50 150 µV/V ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 10mA 3 50 µV/mA Sinking: -5mA ≤ IOUT ≤ 0mA 150 400 µV/mA 2.5 ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA tR Turn-on Settling Time VOUT = ±0.1% 300 µs Ripple Rejection f = 10kHz 75 dB eN Output Voltage Noise 0.1Hz ≤ f ≤ 10Hz 10 µVP-P VN Broadband Voltage Noise 10Hz ≤ f ≤ 1kHz 2.5 µVRMS Noise Density f = 1kHz 60 nV/√Hz ΔVOUT/ΔTA Thermal Hysteresis (Note 8) ΔTA = +165°C 100 ppm ΔVOUT/Δt Long Term Stability (Note 9) TA = +25°C 100 ppm OUTPUT DISABLE VENH Enable Logic High (ON) VENL Enable Logic Low (OFF) IINSD Shutdown Supply Current 3 1.6 VEN ≤ 0.35V V 0.4 0.8 V 1.5 µA FN6706.6 December 19, 2013 ISL21060 Electrical Specifications (ISL21060-25, VOUT = 2.500V) VIN = 3.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. PARAMETER DESCRIPTION VOUT Output Voltage VOA VOUT Accuracy @ TA = +25°C CONDITIONS MIN (Note 10) TYP MAX (Note 10) UNIT 2.500 V ISL21060B25 -1.0 +1.0 mV ISL21060C25 -2.5 +2.5 mV 10 ppm/°C TC VOUT Output Voltage Temperature Coefficient ISL21060B (Note 7) ISL21060C VIN Input Voltage Range IIN Supply Current VEN = VIN 16 ΔVOUT /ΔVIN Line Regulation 2.7V < VIN < 5.5V 50 150 µV/V ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 10mA 3 150 µV/mA 130 400 µV/mA 2.7 Sinking: -5mA ≤ IOUT ≤ 0mA 25 ppm/°C 5.5 V 40 µA ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA tR Turn-on Settling Time VOUT = ±0.1% 300 µs Ripple Rejection f = 10kHz 75 dB eN Output Voltage Noise 0.1Hz ≤ f ≤ 10Hz 10 µVP-P VN Broadband Voltage Noise 10Hz ≤ f ≤ 1kHz 2.5 µVRMS Noise Density f = 1kHz 60 nV/√Hz ΔVOUT/ΔTA Thermal Hysteresis (Note 8) ΔTA = +165°C 100 ppm ΔVOUT/Δt Long Term Stability (Note 9) TA = +25°C 100 ppm OUTPUT DISABLE VENH Enable Logic High (ON) VENL Enable Logic Low (OFF) IINSD Shutdown Supply Current 1.6 VEN ≤ 0.35V V 0.4 0.8 V 1.5 µA Electrical Specifications (ISL21060-30, VOUT = 3.000V) VIN = 3.5V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. PARAMETER DESCRIPTION VOUT Output Voltage VOA VOUT Accuracy @ TA = +25°C TC VOUT CONDITIONS MIN (Note 10) TYP MAX (Note 10) 3.000 UNIT V ISL21060B30 -1.0 +1.0 mV ISL21060C30 -2.5 +2.5 mV 10 ppm/°C 25 ppm/°C 5.5 V Output Voltage Temperature Coefficient ISL21060B (Note 7) ISL21060C VIN Input Voltage Range IIN Supply Current VEN = VIN 16 40 µA ΔVOUT /ΔVIN Line Regulation 3.2V < VIN < 5.5V 50 150 µV/V ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 10mA 3 50 µV/mA Sinking: -5mA ≤ IOUT ≤ 0mA 130 400 µV/mA 3.2 ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA tR Turn-on Settling Time VOUT = ±0.1% 300 µs 4 FN6706.6 December 19, 2013 ISL21060 Electrical Specifications (ISL21060-30, VOUT = 3.000V) VIN = 3.5V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. (Continued) PARAMETER DESCRIPTION CONDITIONS MIN (Note 10) TYP MAX (Note 10) UNIT Ripple Rejection f = 10kHz 75 dB eN Output Voltage Noise 0.1Hz ≤ f ≤ 10Hz 10 µVP-P VN Broadband Voltage Noise 10Hz ≤ f ≤ 1kHz 2.5 µVRMS Noise Density f = 1kHz 60 nV/√Hz ΔVOUT/ΔTA Thermal Hysteresis (Note 8) ΔTA = +165°C 100 ppm ΔVOUT/Δt Long Term Stability (Note 9) TA = +25°C 100 ppm OUTPUT DISABLE VENH Enable Logic High (ON) VENL Enable Logic Low (OFF) IINSD Shutdown Supply Current 1.6 VEN ≤ 0.35V V 0.4 0.8 V 1.5 µA Electrical Specifications (ISL21060-33, VOUT = 3.300V) VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. PARAMETER DESCRIPTION CONDITIONS VOUT Output Voltage VOA VOUT Accuracy @ TA = +25°C ISL21060C33 TC VOUT Output Voltage Temperature Coefficient (Note 7) ISL21060C VIN Input Voltage Range IIN Supply Current EN = VIN ΔVOUT /ΔVIN Line Regulation ΔVOUT/ΔIOUT Load Regulation MIN (Note 10) TYP MAX (Note 10) 3.300 -2.5 UNIT V +2.5 mV 25 ppm/°C 5.5 V 18 40 µA 3.5V < VIN < 5.5V 20 150 µV/V Sourcing: 0mA ≤ IOUT ≤ 10mA 10 50 µV/mA 120 400 µV/mA 3.5 Sinking: -5mA ≤ IOUT ≤ 0mA ISC Short Circuit Current TA = +25°C, VOUT tied to GND tR Turn-on Settling Time 50 mA VOUT = ±0.1% 300 µs Ripple Rejection f = 10kHz 75 dB eN Output Voltage Noise 0.1Hz ≤ f ≤ 10Hz 10 µVP-P VN Broadband Voltage Noise 10Hz ≤ f ≤ 1kHz 2.5 µVRMS Noise Density f = 1kHz 60 nV/√Hz ΔVOUT/ΔTA Thermal Hysteresis (Note 8) ΔTA = +165°C 100 ppm ΔVOUT/Δt Long Term Stability (Note 9) TA = +25°C 100 ppm OUTPUT DISABLE VENH Enable Logic High (ON) VENL Enable Logic Low (OFF) IINSD Shutdown Supply Current 5 1.6 VEN ≤ 0.35V V 0.4 0.8 V 1.5 µA FN6706.6 December 19, 2013 ISL21060 Electrical Specifications (ISL21060-41, VOUT = 4.096V) VIN = 5.0V, TA = -40°C to +125°C, IOUT = 0, unless otherwise specified. Boldface limits apply across the operating temperature range, -40°C to +125°C. PARAMETER DESCRIPTION VOUT Output Voltage VOA VOUT Accuracy @ TA = +25°C TC VOUT Output Voltage Temperature Coefficient (Note 7) CONDITIONS MIN (Note 10) TYP MAX (Note 10) UNIT 4.096 V ISL21060B41 -1.0 +1.0 mV ISL21060C41 -2.5 +2.5 mV ISL21060B 10 ppm/°C ISL21060C 25 ppm/°C 5.5 V VIN Input Voltage Range IIN Supply Current EN = VIN 20 40 µA ΔVOUT /ΔVIN Line Regulation 4.3V < VIN < 5.5V 50 150 µV/V ΔVOUT/ΔIOUT Load Regulation Sourcing: 0mA ≤ IOUT ≤ 10mA 10 50 µV/mA Sinking: -5mA ≤ IOUT ≤ 0mA 130 400 µV/mA 4.3 ISC Short Circuit Current TA = +25°C, VOUT tied to GND 50 mA tR Turn-on Settling Time VOUT = ±0.1% 300 µs Ripple Rejection f = 10kHz 75 dB eN Output Voltage Noise 0.1Hz ≤ f ≤ 10Hz 10 µVP-P VN Broadband Voltage Noise 10Hz ≤ f ≤ 1kHz 2.5 µVRMS Noise Density f = 1kHz 60 nV/√Hz ΔVOUT/ΔTA Thermal Hysteresis (Note 8) ΔTA = +165°C 100 ppm ΔVOUT/Δt Long Term Stability (Note 9) TA = +25°C 100 ppm OUTPUT DISABLE VENH Enable Logic High (ON) VENL Enable Logic Low (OFF) IINSD Shutdown Supply Current 1.6 VEN ≤ 0.35V V 0.4 0.8 V 1.5 µA NOTES: 7. Over the specified temperature range. Temperature coefficient is measured by the box method whereby the change in VOUT is divided by the temperature range; in this case, -40°C to +125°C = +165°C. 8. Thermal Hysteresis is the change of VOUT measured @ TA = +25°C after temperature cycling over a specified range, ΔTA. VOUT is read initially at TA = +25°C for the device under test. The device is temperature cycled and a second VOUT measurement is taken at +25°C. The difference between the initial VOUT reading and the second VOUT reading is then expressed in ppm. For Δ TA = +165°C, the device under test is cycled from +25°C to +125°C to -40°C to +25°C. 9. Long term drift is logarithmic in nature and diminishes over time. Drift after the first 1000 hours will be approximately 10ppm/√1khrs. 10. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design. 6 FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-30) (R 3.0020 17 3.0015 16 3.0010 UNIT 3 = 100kΩ) +125°C 15 UNIT 2 3.0000 14 IIN (µA) 3.0005 VOUT (V) EXT UNIT 1 2.9995 13 2.9990 12 2.9985 11 2.9980 -40 -20 0 20 40 60 80 100 10 120 +25°C -40°C 3.0 3.5 4.0 FIGURE 1. VOUT vs TEMPERATURE, 3 UNITS 100 1.8 90 80 +125°C 1.4 -40°C +25°C 60 IIN (µA) IIN (µA) 5.5 70 1.2 1.0 0.8 50 +125°C 40 30 0.6 +25°C 0.4 20 10 0.2 0.0 5.0 FIGURE 2. IIN vs VIN, 3 TEMPERATURES 2.0 1.6 4.5 VIN (V) TEMPERATURE (°C) -40°C 0 2 1 4 3 0 5 0 1 3 VENABLE (V) 2 VIN (V) FIGURE 3. IIN vs VIN [SLEEP MODE], 3 TEMPERATURES 4 5 6 FIGURE 4. IIN vs VENABLE, 3 TEMPERATURES 1.2 20 1.0 -10 +125°C ΔVOUT (µV) (NORMALIZED TO VIN = 5V) ΔVOUT (mV) 0.8 0.6 0.4 +25°C 0.2 -40°C 0.0 -0.2 -10 -5 0 OUTPUT CURRENT (mA) FIGURE 5. LOAD REGULATION 7 5 +25°C -40 +125°C -70 -100 -40°C -130 -160 3.0 3.5 4.0 4.5 5.0 5.5 VIN (V) FIGURE 6. LINE REGULATION OVER-TEMPERATURE FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-30) (R = 100kΩ) (Continued) 0 3.30 +125°C 3.25 -10 -20 3.20 +25°C PSRR (dB) DROPOUT VOLTAGE (V) EXT 3.15 3.10 3.05 -30 -40 -50 NO LOAD -60 -40°C 3.00 10nF -70 2.95 -10 -8 -6 -4 -2 0 LOAD CURRENT (mA) -80 10 1nF 100 1k 10k 100k 1M FREQUENCY (Hz) FIGURE 7. LOAD CURRENT vs DROPOUT FIGURE 8. PSRR AT DIFFERENT CAPACITIVE LOADS 100 90 NO LOAD 80 CH2 HIGH 4.80V ZOUT (Ω) 70 1nF 60 50 40 10nF 30 CH2 LOW -500mV 20 10 0 1 10 100 1k 10k 100k 1M FREQUENCY (Hz) FIGURE 10. TURN-ON TIME, NO LOAD FIGURE 9. ZOUT vs FREQUENCY CH2 HIGH 4.80V CH2 LOW -500mV FIGURE 11. TURN-ON TIME, 1kΩ 8 FIGURE 12. LOAD TRANSIENT RESPONSE, 1nF LOAD CAPACITANCE FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-30) (R EXT = 100kΩ) (Continued) FIGURE 14. LINE TRANSIENT RESPONSE, 1nF LOAD FIGURE 13. LOAD TRANSIENT RESPONSE, 100nF LOAD CAPACITANCE 3.5 3.0 +125°C 2.5 VOUT (V) 2.0 1.5 1.0 +25°C 0.5 -40°C 0.0 -0.5 FIGURE 15. LINE TRANSIENT RESPONSE, 100nF 9 0 1 2 3 VEN (V) 4 5 6 FIGURE 16. VOUT vs VENABLE FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-41) (R 4.100 = 100kΩ) 24 4.099 23 4.098 UNIT 3 22 4.097 UNIT 1 21 IIN (µA) VOUT (V) EXT 25 UNIT 1 4.096 UNIT 2 4.095 20 19 UNIT 2 18 4.094 UNIT 3 17 4.093 16 4.092 -40 10 60 15 4.3 110 4.5 4.7 4.9 FIGURE 17. VOUT vs TEMPERATURE, 3 UNITS 5.3 5.5 FIGURE 18. IIN vs VIN, 3 TEMPERATURES 0.6 100 90 +125°C 0.5 -40°C +25°C 80 70 0.4 +25°C 60 IIN (µA) IIN (µA) 5.1 VIN (V) TEMPERATURE (°C) 0.3 0.2 -40°C 50 +125°C 40 30 20 0.1 10 0.0 2 0 4 0 6 2 0 FIGURE 19. IIN vs VIN[SLEEP MODE], 3 TEMPERATURES FIGURE 20. IIN vs VENABLE, 3 TEMPERATURES 75 0.8 VOUT (µV) (NORMALIZED TO VIN = 5V) 0.6 ΔVOUT (mV) 0.4 0.2 +25°C +125°C 0 -0.2 -40°C -0.4 -0.6 -12 6 4 VENABLE (V) VIN (V) -10 -8 -6 -4 -2 0 LOAD CURRENT (mA) FIGURE 21. LOAD REGULATION 10 2 4 6 +125°C 25 +25°C -25 -40°C -75 -125 -175 4.0 4.2 4.4 4.6 4.8 5.0 5.2 5.4 5.6 VIN (V) FIGURE 22. LINE REGULATION OVER-TEMPERATURE FN6706.6 December 19, 2013 ISL21060 4.40 0 4.35 -10 +125°C 4.25 EXT = 100kΩ) (Continued) 1nF -20 4.30 PSRR (dB) DROPOUT VOLTAGE (V) Typical Performance Curves (ISL21060-41) (R +25°C 4.20 4.15 -30 -40 -50 -40°C 4.10 4.05 -8 -7 -6 -5 10nF NO LOAD -60 -70 -4 -3 -2 -1 0 LOAD CURRENT (mA) -80 10 100 1k 10k 100k 1M FREQUENCY (Hz) FIGURE 23. LOAD CURRENT vs DROPOUT FIGURE 24. PSRR AT DIFFERENT CAPACITIVE LOADS 160 NO LOAD 140 1nF 120 CH2 PK-PK -5.17V 100nF ZOUT (Ω) 100 80 10nF 60 40 20 0 1 10 100 1k 10k 100k 1M FREQUENCY (Hz) FIGURE 25. ZOUT vs FREQUENCY FIGURE 26. TURN-ON TIME, NO LOAD Δ: 8.20V @: 6.84V CH2 PK-PK 5.90V FIGURE 27. TURN-ON TIME, 1kΩ 11 CH2 PK-PK 2.12V FIGURE 28. LOAD TRANSIENT RESPONSE, 100nF LOAD CAPACITANCE FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-41) (R EXT = 100kΩ) (Continued) Δ: 2.05V @: 1.66V CH2 PK-PK 1.48V CH2 PK-PK 2.12V FIGURE 30. LINE TRANSIENT RESPONSE, 1nF LOAD FIGURE 29. LOAD TRANSIENT RESPONSE, 1nF LOAD CAPACITANCE Δ: 2.05V @: 1.66V 4.5 CH2 PK-PK 1.52V 4.0 3.5 VOUT (V) 3.0 2.5 2.0 1.5 -40°C 1.0 0.5 +125°C 0.0 0 FIGURE 31. LINE TRANSIENT RESPONSE, 100nF LOAD CAPACITANCE 12 1 2 3 VENABLE (V) 4 5 6 FIGURE 32. VOUT vs VENABLE FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-25) (R 2.5030 16 2.5025 15 2.5020 UNIT 1 IIN (µA) VOUT (V) +125°C +25°C 13 2.5010 2.5005 2.5000 = 100kΩ) 14 UNIT 2 2.5015 EXT UNIT 3 12 -40°C 11 2.4995 10 2.4990 9 2.4985 2.4980 -50 0 50 100 8 2.5 150 3.0 3.5 4.0 4.5 VIN (V) TEMPERATURE (°C) FIGURE 33. VOUT vs TEMPERATURE, 3 UNITS 5.5 6.0 FIGURE 34. IIN vs VIN, 3 TEMPERATURES 0.6 90 -40°C 80 0.5 +125°C +25°C 70 0.4 60 0.3 IIN (µA) IIN (µA) 5.0 +25°C 0.2 +125°C 50 40 30 -40°C 20 0.1 10 0.0 1 0 2 3 VIN (V) 5 4 0 0 6 1 FIGURE 35. IIN vs VIN [SLEEP MODE], 3 TEMPERATURES 50 -40°C 0.4 0 ΔVOUT (µV) ΔVOUT (mV) 0.2 +25°C 0 -50 -100 -40°C -0.1 -0.2 -0.4 -12 -150 LOAD REGULATION -0.3 6 5 +25°C +125°C +125°C 4 LINE REGULATION NORMALIZED AT VIN = 5 0.3 0.1 3 VENABLE (V) FIGURE 36. IIN vs VENABLE, 3 TEMPERATURES 0.6 0.5 2 NORMALIZED TO VOUT WITH NO LOAD -10 -8 -6 -4 -2 0 LOAD CURRENT (mA) FIGURE 37. LOAD REGULATION 13 2 4 6 -200 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VIN (V) FIGURE 38. LINE REGULATION OVER-TEMPERATURE FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-25) (R EXT = 100kΩ) (Continued) Δ: 3.80V @: 8.72V 3.00 CH2 PK-PK 5.83V DROPOUT VOLTAGE (V) 2.95 2.90 +125°C 2.85 2.80 2.75 2.70 +25°C 2.65 2.60 2.55 -40°C 2.50 2.45 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 LOAD CURRENT (mA) FIGURE 39. LOAD CURRENT vs DROPOUT FIGURE 40. TURN-ON TIME, NO LOAD Δ: 3.80V @: 8.72V Δ: 1.90V @: 3.40V CH2 PK-PK 5.80V CH2 PK-PK 1.54V FIGURE 42. LOAD TRANSIENT RESPONSE, 1nF LOAD CAPACITANCE FIGURE 41. TURN-ON TIME, 1kΩ Δ: 1.90V @: 3.40V CH2 PK-PK 1.30V FIGURE 43. LOAD TRANSIENT RESPONSE, 100nF LOAD CAPACITANCE 14 Δ: 1.90V @: 4.44V CH2 PK-PK 2.84V FIGURE 44. LINE TRANSIENT RESPONSE, 1nF LOAD FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-25) (R EXT = 100kΩ) (Continued) 3.0 2.5 -40°C 2.0 VOUT (V) 1.5 1.0 +125°C 0.5 0 -0.5 +25°C 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VENABLE (V) FIGURE 45. LINE TRANSIENT RESPONSE, 100nF FIGURE 46. VOUT vs VENABLE Typical Performance Curves (ISL21060-20) (R 2.052 = 100kΩ) 14 13 2.051 UNIT 2 +125°C 12 2.050 11 IIN (µA) VOUT (V) EXT UNIT 1 2.049 UNIT 3 2.048 10 9 8 2.047 7 2.046 -50 0 50 TEMPERATURE (°C) 100 6 150 3 2 5 4 VIN (V) 6 FIGURE 48. IIN vs VIN, 3 TEMPERATURES FIGURE 47. VOUT vs TEMPERATURE, 3 UNITS 90 0.7 +125°C 0.6 80 -40°C 70 0.5 +25°C 60 0.4 IIN (µA) IIN (µA) -40°C +25°C 0.3 50 +125°C 40 -40°C +25°C 30 0.2 20 0.1 0 10 0 1 3 2 4 5 VIN (V) FIGURE 49. IIN vs VIN [SLEEP MODE], 3 TEMPERATURES 15 6 0 0 1 2 3 4 5 6 VENABLE (V) FIGURE 50. IIN vs VENABLE, 3 TEMPERATURES FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-20) (R 0.6 50 -40°C 0.2 CHANGE IN OUTPUT (µV) VOLTAGE DIFF (mV) = 100kΩ) (Continued) 100 0.4 +25°C 0 -0.2 EXT +125°C -0.4 +25°C 0 -50 -100 -40°C -150 -200 +125°C -250 -300 -0.6 -12 -10 -8 -6 -4 -2 0 2 4 -350 6 2 3 4 VIN (V) LOAD (mA) FIGURE 51. LOAD REGULATION 5 6 FIGURE 52. LINE REGULATION OVER-TEMPERATURE 2.8 0 2.7 -10 2.6 -20 +125°C 2.5 PSRR (dB) DROPOUT VOLTAGE NO LOAD 2.4 +25°C 2.3 1nF -30 -40 -50 10nF -60 2.2 -40°C 2.1 2.0 -12 -10 -70 -8 -6 -4 -2 0 LOAD CURRENT (mA) -80 10 100 1k 10k 100k 1M FREQUENCY (Hz) FIGURE 53. LOAD CURRENT vs DROPOUT FIGURE 54. PSRR AT DIFFERENT CAPACITIVE LOADS 90 80 NO LOAD 70 ZOUT (Ω) 60 10nF 50 40 1nF 30 20 10 0 1 10 100 1k 10k 100k 1M FREQUENCY (Hz) FIGURE 55. ZOUT vs FREQUENCY 16 FIGURE 56. TURN-ON TIME, NO LOAD FN6706.6 December 19, 2013 ISL21060 Typical Performance Curves (ISL21060-20) (R FIGURE 57. TURN-ON TIME, 1kΩ EXT = 100kΩ) (Continued) FIGURE 58. LOAD TRANSIENT RESPONSE, 1nF LOAD CAPACITANCE FIGURE 60. LINE TRANSIENT RESPONSE, 1nF LOAD FIGURE 59. LOAD TRANSIENT RESPONSE, 100nF LOAD CAPACITANCE 2.5 2.0 -40°C VOUT (V) 1.5 1.0 0.5 +125°C 0.0 -0.5 FIGURE 61. LINE TRANSIENT RESPONSE, 100nF 17 +25°C 0 1 2 3 VENABLE (V) 4 5 6 FIGURE 62. VOUT vs VENABLE FN6706.6 December 19, 2013 ISL21060 FGA Technology Board Assembly Considerations The ISL21060 voltage reference floating gate references possess very low drift and supply current. The charge stored on a floating gate cell is set precisely in manufacturing. The reference voltage output itself is a buffered version of the floating gate voltage. The resulting reference device has excellent characteristics which are unique in the industry and include very low temperature drift, high initial accuracy, and almost zero supply current. Also, the reference voltage itself is not limited by voltage bandgaps or zener settings, so a wide range of reference voltages can be programmed (standard voltage settings are provided, but customer-specific voltages are available). FGA™ references provide high accuracy and low temperature drift but some PC board assembly precautions are necessary. Normal Output voltage shifts of 100µV to 1mV can be expected with Pb-free reflow profiles or wave solder on multi-layer FR4 PC boards. Precautions should be taken to avoid excessive heat or extended exposure to high reflow or wave solder temperatures, this may reduce device initial accuracy. The process used for these reference devices is a floating gate CMOS process, and the amplifier circuitry uses CMOS transistors for amplifier and output drive. This circuitry provides excellent accuracy with a trade-off in output noise level and load regulation due to the MOS device characteristics. These limitations are addressed with circuit techniques discussed in other sections. Micropower Supply Current and Output Enable The ISL21060 consumes extremely low supply current due to the proprietary FGA technology. Low noise performance is achieved using optimized biasing techniques. Supply current is typically 16µA and noise is 10µVP-P, benefitting precision, low noise portable applications, such as handheld meters and instruments. The ISL21060 devices have the EN pin, which is used to Enable/Disable the output of the device. When disabled, the reference circuitry itself remains biased at a highly accurate and reliable state. When enabled, the output is driven to the reference voltage in a relatively short time (about 300∝s). This feature allows multiple references to be connected and one of them selected. Another application is to disable any loads that draw significant current, saving power in standby or shutdown modes. Board Mounting Considerations For applications requiring the highest accuracy, board mounting location should be reviewed. The device uses a plastic SOIC package, which will subject the die to mild stresses when the PC board is heated and cooled and slightly changes shape. Placing the device in areas subject to slight twisting can cause degradation of the accuracy of the reference voltage due to these die stresses. It is normally best to place the device near the edge of a board, or the shortest side, as the axis of bending is most limited at that location. Mounting the device in a cutout also minimizes flex. Obviously, mounting the device on flexprint or extremely thin PC material will likewise cause loss of reference accuracy. 18 Post-assembly x-ray inspection may also lead to permanent changes in device output voltage and should be minimized or avoided. If x-ray inspection is required, it is advisable to monitor the reference output voltage to verify excessive shift has not occurred. If large amounts of shift are observed, it is best to add an X-ray shield consisting of thin zinc (300µm) sheeting to allow clear imaging, yet block x-ray energy that affects the FGA™ reference. Special Applications Considerations In addition to post-assembly examination, there are also other X-ray sources that may affect the FGA™ reference long term accuracy. Airport screening machines contain X-rays and will have a cumulative effect on the voltage reference output accuracy. Carry-on luggage screening uses low level X-rays and is not a major source of output voltage shift, although if a product is expected to pass through that type of screening over 100 times it may need to consider shielding with copper or aluminum. Checked luggage X-rays are higher intensity and can cause output voltage shift in much fewer passes, so devices expected to go through those machines should definitely consider shielding. Note that just two layers of 1/2 ounce copper planes will reduce the received dose by over 90%. The leadframe for the device which is on the bottom also provides similar shielding. If a device is expected to pass through luggage X-ray machines numerous times, it is advised to mount a 2-layer (minimum) PC board on the top, and along with a ground plane underneath will effectively shield it from 50 to 100 passes through the machine. Since these machines vary in X-ray dose delivered, it is difficult to produce an accurate maximum pass recommendation. Noise Performance and Reduction The output noise voltage in a 0.1Hz to 10Hz bandwidth is typically 10µVP-P. The noise measurement is made with a bandpass filter made of a 1-pole high-pass filter with a corner frequency at 0.1Hz and a 2-pole low-pass filter with a corner frequency at 12.6Hz to create a filter with a 9.9Hz bandwidth. Noise in the 10kHz to 1MHz bandwidth is approximately 100µVP-P with no capacitance on the output. This noise measurement is made with a 2 decade bandpass filter made of a 1-pole high-pass filter with a corner frequency at 1/10 of the center frequency and 1-pole low-pass filter with a corner frequency at 10x the center frequency. Load capacitance up to 1µF can be added to improve transient response. FN6706.6 December 19, 2013 ISL21060 Turn-On Time The ISL21060 devices have low supply current and thus the time to bias-up internal circuitry to final values will be longer than with higher power references. Normal turn-on time is typically 300µs. Circuit design must take this into account when looking at power-up delays or sequencing. Temperature Coefficient The limits stated for temperature coefficient (tempco) are governed by the method of measurement. The overwhelming standard for specifying the temperature drift of a reference is to measure the reference voltage at two temperatures take the total variation, (VHIGH – VLOW), and divide by the temperature extremes of measurement (THIGH – TLOW). The result is divided by the nominal reference voltage (at T = +25°C) and multiplied by 106 to yield ppm/°C. This is the “Box” method for specifying temperature coefficient. VOUT Kelvin Sensing The voltage output for the ISL21060 has both a force and a sense output. This enables remote kelvin sensing for highly accurate voltage setting with long traces and higher current loads. The VOUTF (force) can be routed to the load with the shortest, widest trace possible. The VOUTS (sense) is routed with a narrower trace to the point of the actual load where it is connected to the VOUTF trace. The VOUTF and VOUTS traces must always be connected. If there is only a short trace to the load or even a very light load, then they can be connected at or near the ISL21060 device. 19 FN6706.6 December 19, 2013 ISL21060 Typical Application Circuits +2.7 TO 5.5V 10µF 0.1µF LOGIC ENABLE VIN EN VOUTF VOUTS ISL21060-25 VOUT = 2.50V GND 0.001µF VCC RH VOUT X9119 (UNBUFFERED) + SDA 2-WIRE BUS EL8178 SCL VSS - VOUT (BUFFERED) RL FIGURE 63. 2.5V FULL SCALE LOW-DRIFT, 10-BIT ADJUSTABLE VOLTAGE SOURCE WITH LOW POWER DISABLE +2.75V TO 5.5V 0.1µF LOGIC ENABLE 10µF VIN EN VOUTF VOUTS ISL21060-25 VOUT = 2.50V GND VOUT SENSE SEPARATE COPPER TRACE FOR SENSE INPUT LOAD FIGURE 64. KELVIN SENSED LOAD For additional products, see www.intersil.com/en/products.html Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/en/support/qualandreliability.html Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 20 FN6706.6 December 19, 2013 ISL21060 Package Outline Drawing P6.064A 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE Rev 0, 2/10 1.90 0-3° 0.95 D 0.08-0.20 A 5 6 4 PIN 1 INDEX AREA 2.80 3 1.60 3 0.15 C D 2x 1 (0.60) 3 2 0.20 C 2x 0.40 ±0.05 B 5 SEE DETAIL X 3 0.20 M C A-B D TOP VIEW 2.90 5 END VIEW 10° TYP (2 PLCS) 0.15 C A-B 2x H 1.14 ±0.15 C SIDE VIEW 0.10 C 0.05-0.15 1.45 MAX SEATING PLANE DETAIL "X" (0.25) GAUGE PLANE 0.45±0.1 4 (0.60) (1.20) NOTES: (2.40) (0.95) 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5M-1994. 3. Dimension is exclusive of mold flash, protrusions or gate burrs. 4. Foot length is measured at reference to guage plane. 5. This dimension is measured at Datum “H”. 6. Package conforms to JEDEC MO-178AA. (1.90) TYPICAL RECOMMENDED LAND PATTERN 21 FN6706.6 December 19, 2013