TS19730CX6 Taiwan Semiconductor Single-Stage Low THD Buck-Boost PWM Control LED Driver DESCRIPTION FEATURES The TS19730 is a high power factor, low THD and high ● Low THD <10% accuracy constant current PWM controller. TS19730 ● Constant Current Accuracy within ±2.5% achieves high power factor and high efficiency by ● High Power Factor >0.9 discontinuous conduction mode (DCM). The line and ● Low BOM Cost load regulation of LED current are within ±2.5%. ● Discontinuous Conduction Mode Control TS19730 also provides gate driving voltage clamping, ● Gate Output Voltage Clamp VCC output ● LED Open Protection open/short circuit protection to increase IC performance. ● LED Short protection ● ● ● Over Current Protection (OCP) Over Thermal Protection (OTP) Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC. Halogen-free according to IEC 61249-2-21 over-voltage protection, and system ● APPLICATION SOT-26 ● LED lighting ● Down lights, Tube lamps, PAR Lamps, Bulbs Pin Definition: 1. VCC 2. GND 3. OUT 4. CL 5. COM 6. CS Note: MSL 3 (Moisture Sensitivity Level) per J-STD-020 ABSOLUTE MAXIMUM RATINGS (Note 1) PARAMETER SYMBOL LIMIT UNIT Power Supply Pin VCC 40 V CL Voltage to GND VCL -0.3 to 5.5 V OUT Voltage to GND VOUT -0.3 to 40 V CS Voltage to GND VCS -0.3 to 5.5 V VCOM -0.3 to 5.5 V Junction Temperature Range TJ -40 to +150 °C Storage Temperature Range TSTG -65 to +150 °C Lead Temperature (Soldering 10s) TLEAD 260 °C PD 0.3 W HBM 2 kV MM 200 V COM Voltage to GND Power Dissipation @ TA=25 °C ESD Rating (Human Body Mode) ESD Rating (Machine Mode) (Note2) (Note 2) 1 Version: B1601 TS19730CX6 Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT Thermal Resistance - Junction to Case RӨJC 106.6 °C/W Thermal Resistance - Junction to Ambient RӨJA 220 °C/W Note: RӨJA is the sum of the junction-to-case and case-to-ambient thermal resistances. The case thermal reference is defined at the solder mounting surface of the drain pins. RӨJA is guaranteed by design while RӨCA is determined by the user’s board design. RӨJA shown below for single device operation on FR-4 PCB in still air. Thermal Resistance is specified with the component mounted on a low effective thermal conductivity test board in free air at TA=25°C. RECOMMENDED OPERATING CONDITIONS PARAMETER (Note 3) SYMBOL CONDITIONS UNIT Power Supply Pin VCC 33 V CL Voltage to GND VCL -0.3 to 5 V OUT Voltage to GND VOUT -0.3 to 19 V CS Voltage to GND VCS -0.3 to 5 V VCOM -0.3 to 5 V Operating Junction Temperature Range TJ -40 to +125 °C Operating Ambient Temperature Range TOPA -40 to +85 °C COM Voltage to GND ELECTRICAL SPECIFICATIONS (VCC = 18V, TA = 25°C unless otherwise noted) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT VCC= VUVLO(on) -1V -- 45 -- μA With 1nF load on out pin -- 2.1 2.6 mA Supply Voltage Start-up Current Operating Current VCC(ST) IOPA UVLO(off) VUVLO(off) 7 8 9 V UVLO(on) VUVLO(on) 16 17.5 19 V VOVP 29 31 33 V Feedback Reference Voltage VFB 0.196 0.2 0.204 V Transconductance gm -- 58 -- μS IO-SINK -- 5.8 -- μA IO-SOURCE -- 5.8 -- μA -- 5 -- V OVP Level on VCC Pin Voltage Feedback Output Sink Current Output Source Current Current Sensing Open Loop Voltage VOLP Leading-Edge Blanking Time tLEB -- 400 -- ns tDELAY -- 100 -- ns VOCP -- 0.3 -- V fSTR -- 4.5 -- kHz Delay to Output CS Pin Open Current Limit CL Limit Voltage Switching Frequency Start Frequency 2 Version: B1601 TS19730CX6 Taiwan Semiconductor ELECTRICAL SPECIFICATIONS (VCC = 18V, TA = 25°C unless otherwise noted) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT Gate Driver Output Rising Time tRISE Load Capacitance =1nF -- 90 -- ns Falling Time tFALL Load Capacitance =1nF -- 40 -- ns -- 12.5 15 V Thermal Shutdown -- 150 -- °C Thermal Shutdown Release -- 120 -- °C VGATE-Clamp Thermal Section VGATE (Note 5,6) Note: 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. 2. Devices are ESD sensitive. Handing precaution recommended. 3. Thermal Resistance is specified with the component mounted on a low effective thermal conductivity test board in free air at TA=25°C. 4. The device is not guaranteed to function outside its operating conditions. 5. Guaranteed by design. 6. Auto Recovery Type. ORDERING INFORMATION PART NO. PACKAGE PACKING TS19730CX6 RFG SOT-26 3,000pcs / 7” Reel 3 Version: B1601 TS19730CX6 Taiwan Semiconductor BLOCK DIAGRAM Fig. 1 PIN DESCRIPTION PIN NO. NAME 1 VCC FUNCTION 2 GND Ground return for all internal circuitry. 3 OUT Gate driver output. 4 CL 5 COM 6 CS Power supply pin for all internal circuitry. Current limit. Output pin of error amplifier. Input current sense pin. TYPICAL APPLICATION CIRCUIT Fig. 2 4 Version: B1601 TS19730CX6 Taiwan Semiconductor APPLICATION INFORMATION Start-up Current The typical start-up current is around 45μA. Very low start-up current allows the PWM controller to increase the value of start-up resistor and then reduce the power dissipation. UVLO(Under Voltage Lockout) A hysteresis UVLO comparator is implemented in TS19730. The turn-on and turn-off thresholds level are fixed at 17.5V and 8V respectively. This hysteresis shown in Fig.3 ensures that the start-up capacitor will be adequate to supply the chip during start-up. For quick start-up of the LED driver, the start-up resistor should be matched with the start-up capacitor. Fig. 3 LEB(Leading-Edge Blanking) Each time the power MOSFET is switched on, a turn-on spike will inevitably occur at the sense resistor. To avoid fault trigger, a 400ns leading-edge blanking time is built in. Conventional RC filtering can therefore be omitted. During this blanking period, the current-limit comparator is disabled and cannot switch off the gate driver. OCP(Over Current Protection) The TS19730 has built-in cycle by cycle over current protection function on CL pin. As the CL pin voltage is larger than VOCP (0.3V), the gate output will be turned off immediately to avoid the driver board to be burned out. Application Information (Continue) OVP (Over Voltage Protection) on VCC To prevent the LED driver from being damaged, the TS19730 has an implemented OVP function on VCC. When the VCC voltage is higher than the VOVP (31V), the output gate driver circuit will be shut down immediately to stop the switching of power MOSFET. The VCC pin OVP function is an auto recovery type protection. If the OVP condition happens, the pulses will be stopped until the VCC pin voltage is down to the UVLO off level. The TS19730 is working in an auto-recovery mode as shown in Fig. 4. Fig. 4 Gate Clamp Driver is clamped to 12.5V by an internal clamping circuit to avoid the Gate of MOSFET to get damaged. 5 Version: B1601 TS19730CX6 Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS (Unit: Millimeters) SOT-26 SUGGESTED PAD LAYOUT (Unit: Millimeters) MARKING DIAGRAM SA = Device Code Y W L = Year Code D =2014 E =2015 F =2016 G =2017 H =2018 J =2019 K =2020 = Week Code A~Z =wk1~wk26 A~Z = wk27~wk52 = Lot Code A~Z 6 Version: B1601 TS19730CX6 Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 7 Version: B1601