Reliability Data Report Product Family R528 LTC6652 / LTC6655 Reliability Data Report Report Number: R528 Report generated on: Mon Jan 18 14:01:05 PST 2016 OPERATING LIFE TEST PACKAGE TYPE SOIC/MSOP Totals SAMPLE SIZE 594 594 OLDEST DATE NEWEST DATE K DEVICE HRS CODE CODE (+125°C) 0715 - 0919 - 594 594 1 No. of FAILURES 2,3 0 0 HIGHLY ACCELERATED STRESS TEST AT +130 DEG C / 85% RH PACKAGE TYPE SOIC/MSOP Totals SAMPLE SIZE 297 297 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES 4 CODE CODE (+85°C) 1046 - 1440 - 874 874 0 0 K DEVICE HRS No. of FAILURES PRESSURE COOKER TEST AT 15 PSIG , +121 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/MSOP 1111 Totals 1,111 OLDEST DATE NEWEST DATE CODE CODE 0646 1413 114 0 - - 114 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES CODE CODE CYCLES 0646 - 1413 - 540 540 0 0 OLDEST DATE NEWEST DATE K DEVICE No. of FAILURES TEMP CYCLE FROM -65 TO 150 DEG C PACKAGE TYPE SOIC/MSOP Totals SAMPLE SIZE 1196 1,196 THERMAL SHOCK FROM -65 TO 150 DEG C PACKAGE TYPE SAMPLE SIZE CODE CODE CYCLES SOIC/MSOP 1516 0648 1413 581 0 Totals 1,516 - - 581 0 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 0646 - 1046 - 323 323 0 0 HIGH TEMPERATURE BAKE AT 150 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/MSOP Totals 333 333 (1) Assumes Activation Energy = 0.7 Electron Volts (2) Failure Rate Equivalent to +55 °C, 60% Confidence Level =19.95 FITS (3) Mean Time Between Failure in Years = 5722.67 (4) Assumes 20X Acceleration from 85 °C to +130 °C Note 1: 1 FIT = 1 Failure in One Billion Hours. Note 2: HAST, Temp Cycle & Thermal Shock are subjected to J-STD-020 MSL Preconditioning Reliability Data Report Report Number: R528 Report generated on: Mon Jan 18 14:01:05 PST 2016 HIGH TEMPERATURE BAKE AT 175 DEG C PACKAGE TYPE SAMPLE SIZE SOIC/MSOP 616 Totals 616 OLDEST DATE NEWEST DATE K DEVICE HRS No. of FAILURES CODE CODE 0648 - 1440 462 0 - 462 0