TPMR10D - TPMR10J Taiwan Semiconductor CREAT BY ART 10A, 200V - 600V High Current Density Switchmode Superfast Surface Mount Rectifiers FEATURES - Very low profile, typical height of 1.1mm - 175oC operating junction temperature - Glass passivated chip junction 3 - Low conduction loss - Low leakage current 1 - High forward surge capability 2 TO-277A (SMPC) - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 definition TYPICAL APPLICATIONS The devices were designed with a priority on VF to minimize the conduction losses as secondary rectification of SMPS, while the diodes remain fast enough to fit applications where the switching frequency is counted in tens of kilohertz. The miniature high power density surface mount packages is perfect for space constraint design. MECHANICAL DATA Case: TO-277A (SMPC) Molding compound, UL flammability classification rating 94V-0 Moisture sensitivity level: level 1, per J-STD-020 Packing code with suffix "G" means green compound (halogen-free) Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test Polarity: Indicated by cathode band Weight: 0.095 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL Marking code TPMR10D TPMR10G TPMR10J MR10D MR10G MR10J 200 400 600 UNIT Maximum repetitive peak reverse voltage VRRM Maximum average forward rectified current IF(AV) 10 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load IFSM 150 A TJ=25°C Maximum instantaneous forward voltage (1) @ 10 A Maximum reverse current @ rated VR TJ=125°C TJ=25oC o Maximum reverse recovery time TJ=125 C IF=1A, di/dt=-50A/μs, VR=30V IF=0.5A, IR=1A, IRR=0.25A Typical thermal resistance Typical junction capacitance (4) Operating junction temperature range Storage temperature range VF IR trr 0.95 1.20 1.80 0.86 1.00 - 5 10 250 500 - 35 40 8.4 (3) 78 RθJA CJ V μA 60 RθJL (2) V ns °C/W 140 pF TJ - 55 to +175 °C TSTG - 55 to +175 °C Note 1: Pulse test with PW=300μs, 1% duty cycle Note 2: Mounted on FR4 PCB with 16mm x 16mm Cu pad area Note 3: Free air, mounted on recommned pad Note 4: Measured at 1 MHz and Applied VR=4.0 Volts Document Number: DS_D1501002 Version: A15 TPMR10D - TPMR10J Taiwan Semiconductor ORDERING INFORMATION PART NO. PACKING CODE TPMR10x (Note 1, 2) S1 PACKING CODE SUFFIX PACKAGE PACKING SMPC 1,500/ 7" Plastic reel SMPC 6,000/ 13" Plastic reel G S2 Note 1: "X" defines voltage from 200V (TPMR10D) to 600V (TPMR10J) Note 2: Whole series with green compound (halogen-free) EXAMPLE PREFERRED PART NO. PART NO. PACKING CODE TPMR10D S1 TPMR10D S1G PACKING CODE DESCRIPTION SUFFIX G Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) FIG.1 MAXIMUM FORWARD CURRENT DERATING CURVE 12 8 6 4 RESISTER OR INDUCTIVE LOAD 2 0 0 25 50 75 100 125 150 175 INSTANTANEOUS FORWARD CURRENT (A) 100 10 AVERAGE FORWARD CURRENT (A) FIG. 2 TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS Pulse Width=300μs 1% Duty Cycle 200V 400V 600V 10 TJ=125°C 1 TJ=25°C 0.1 0 0.2 0.4 FIG. 3 MAXIMUM NON-REPETITIVE FORWARD PEAK SURGE CURRENT 150 125 100 75 50 25 0 10 NUMBER OF CYCLES AT 60 Hz 100 INSTANTANEOUS REVERSE CURRENT (μA) PEAK FORWARD SURGE CURRENT (A) 8.3ms Single Half Sine Wave 1 0.8 1 1.2 1.4 1.6 1.8 2 FIG. 4 TYPICAL REVERSE CHARACTERISTICS 200 175 0.6 FORWARD VOLTAGE (V) LEAD TEMPERATURE (°C) 100 TJ=125°C 10 1 0.1 TJ=25°C 0.01 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) Document Number: DS_D1501002 Version: A15 TPMR10D - TPMR10J Taiwan Semiconductor FIG. 5 TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE (pF) 1000 100 f=1.0MHz Vsig=50mVp-p 10 0.1 1 10 100 REVERSE VOLTAGE (V) PACKAGE OUTLINE DIMENSIONS TO-277A (SMPC) DIM. Unit (mm) Unit (inch) Min Max Min Max A 5.650 5.750 0.222 0.226 B 6.350 6.650 0.250 0.262 C 4.550 4.650 0.179 0.183 D 3.540 3.840 0.139 0.151 E 4.235 4.535 0.167 0.179 F 1.850 2.150 0.073 0.085 G 3.170 3.470 0.125 0.137 H I 1.043 1.000 1.343 1.300 0.041 0.039 0.053 0.051 J 1.930 2.230 0.076 0.088 K 0.175 0.325 0.007 0.013 L 1.000 1.200 0.039 0.047 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 4.80 0.189 B 4.72 0.186 C 1.40 0.055 D 1.27 0.050 E 6.80 0.268 F 1.04 0.041 MARKING DIAGRAM P/N = Marking Code YW = Date Code F = Factory Code Document Number: DS_D1501002 Version: A15 TPMR10D - TPMR10J Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1501002 Version: A15