DATASHEET Laser Diode Driver with Serial Control and Write Current DAC ISL58781 Features The ISL58781 is a highly integrated laser diode driver designed to support multi-standard writable optical drives in CD, DVD, and Blu-Ray at various speeds. It is a ‘hybrid’ part having an interface compatible with a conventional LDD, but an internal architecture similar to a write strategy LDD. This combination adds versatility to the conventional interface. • Compatible with all Conventional Controllers Having a Serial Port, with Some Programming The rise and fall times and overshoot of the blue output are adjustable to compensate for high and low resistance lasers. There are two banks of write currents with a bank select line, BSEL. This eliminates the need to synchronize the serial port to the media. • Programmable Snubber on all Outputs • Compatible with Future Controllers Having Gray Coded WEN Lines for Glitchless High-Speed Operation • WEN Line Skew Detection • 1000mA Maximum Total Output • 10-bit x 10-bit Multiplying DAC Output Provides 10-bit Full Scale Adjustment and 10-bit Resolution at any Full Scale Output • Three Laser Outputs Allow Read/Write DVD, CD, and Blue Combinations The oscillator can be controlled by external LVDS lines, or internally activated through program assignment to any WEN state. • Analog Inputs Supports Read APC The WEN lines have internal 100Ω terminators. There is a skew detector on the WEN receiver outputs. • Programmable HFM On, Off and Cooling Levels The ISL58781 requires a single 5V supply. • Built-in ADC to Sample Laser Voltage Allows Power Reduction by Optimizing Headroom • HFM Oscillator Programmable to 100mAP-P and Range from 100MHz to >1GHz • Programmable Spread Spectrum for Low EMI • Built-in Thermal Sensor Aids in Thermal Design • Serial Input Works up to 50MHz • Pb-Free (RoHS Compliant) Applications • Combination DVD, CD, and Blue Writable Drives • BD Camcorders • BD Video Recorders December 3, 2015 FN6909.3 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Copyright Intersil Americas LLC 2009, 2011, 2013, 2015. All Rights Reserved Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries. All other trademarks mentioned are the property of their respective owners. ISL58781 Application Block Diagram 0.1µ 2.2µ 2.2µ BEAD 0.1µ 5V TO 9V 4.7µ 0.1µ WEB SCLK SDIO GND SEN IBLUE BEAD 5V 4.7µ MAIN BOARD CONTROLLER SERIAL INTERFACE TR TF OVERSHOOT ADJUST WEN0 WEN0B WDAC2 AMPLITUDE REGISTERS (8EA) WEN1 WEN1B WEN2 VSO WRITE REGISTER SELECTOR WDAC1 IOUT1 BLUE WDAC SKEW DETECT GND SCALE DAC WEN2B VSO AMPLITUDE OSCEN OSCENB LVDS OSC AND BUFFER SS BSEL FREQ X 0.1µ IOUT2 GAIN CONTROL RFREQ READ DAC + READ MAIN BOARD AFE + VSO IAPC REFERENCE BIAS AND POWER GND VSL ENA 0.1µ RSET 1µF ENA Submit Document Feedback 2 FN6909.3 December 3, 2015 ISL58781 Pin Configuration 23 IBLUE 24 GND 22 VSO WEN0B 2 21 IOUT1 WEN1 3 20 GND WEN1B 4 19 VSO THERMAL PAD WEN2 5 18 IOUT2 WEN2B 6 17 IOUT2 16 VSO OSCENB 8 15 ENA RSET 14 OSCEN 7 BSEL 9 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL58781. For more information on MSL please see techbrief TB363. WEN0 1 GND 13 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. VSL 12 1. Please refer to TB347 for details on reel specifications. 25 SEN 58781 CRZ -10 to +85 28 Ld QFN L28.4x5A 26 SDIO ISL58781 (28 LD QFN) TOP VIEW PACKAGE PKG. (Pb-free) DWG.# IAPC 11 ISL58781CRZ-T13 (Notes 1, 2, 3) TEMP RANGE (°C) 27 SCLK PART MARKING 28 WEB PART NUMBER RFREQ 10 Ordering Information Pin Descriptions PIN NAME PIN NUMBER I/O PIN TYPE PIN DESCRIPTION WEN0, WEN0B 1, 2 I LVDS Write Enable 0. When WEN0 > WEN0B, the result is a logic 1 in the write current selection. Otherwise it is logic 0. WEN1, WEN1B 3, 4 I LVDS Write Enable 1. When WEN1 > WEN1B, the result is a logic 1 in the write current selection. Otherwise it is logic 0. WEN2, WEN2B 5, 6 I LVDS Write Enable 2. When WEN2 > WEN2B, the result is a logic 1 in the write current selection. Otherwise it is logic 0. OSCEN, OSCENB 7, 8 I LVDS Oscillator Enable. When OSCEN > OSCENB, the result is a logic 1, which may be used to turn on the oscillator. When 0, the oscillator will output a DC current that is programmable. BSEL 9 I Digital Bank Select input selects the write current register banks. RFREQ 10 I/O Analog A resistor from RFREQ to GND sets the range of the HFM frequency. IAPC 11 I Analog A 1k impedance current input; 100*IAPC flow to the output. This controls the read current, which may also include a current from an internal DAC. VSL 12 O Power The internal 2.5V regulator needs a 1µF capacitor from VSL to GND. Do not use VSL for other loads. GND 13, 20 RSET 14 I/O Analog I Digital Chip enable input (H = enable, L = disable) Power Supply voltage for the output drivers only (connect all pins) Ground Ground A resistor from RSET to analog ground calibrates the DAC full-scales ENA 15 VSO 16, 19, 22 IOUT2 17, 18 O Analog Laser diode output #2 IOUT1 21 O Analog Laser diode output #1 IBLUE 23 O Analog Blue laser diode output SEN 25 I Digital Serial control enable (H = enable, L = disable) SDIO 26 I/O Digital Serial data for parameters and control; in/out SCLK 27 I Digital Serial control clock WEB 28 I Digital Write enable Bar. When low, write current is enabled. PD Thermal The Thermal pad should be grounded and connected to a heat sink. NOTE: Pins with the same name are internally connected together; however, LDD pins must not be used for connecting together external components or features. Submit Document Feedback 3 FN6909.3 December 3, 2015 ISL58781 Absolute Maximum Ratings (TA = +25°C) Thermal Information VSO, Supply Voltages . . . . . . . . . . IBLUE, Voltage at IBLUE . . . . . . . . IOUT1,2, Output Current . . . . . . . . IBLUE, Output Current. . . . . . . . . . VIN, Logic Input Voltages . . . . . . . IIN, Current into RSET, RFREQ, IAPC . ESD Rating Human Body Model . . . . . . . . . . Thermal Resistance (Typical) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V . . . . . . . . . . . . 7V . . . . . . 1000mApk . . . . . . . 600mApk -0.5V to VSO +0.5V . . . . . . . . . . . 5mA . . . . . . . . . . . . . 2500V JA (°C/W) JC (°C/W) 28 Lead QFN (Notes 4, 5) . . . . . . . 37 2.9 PD, Maximum Power Dissipation . . . . . see curves on page 12 TS, Storage Temperature Range . . . . . . . . -60°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions TA, Ambient Temperature Range . . . . . . . . . -10°C to +85°C TJ, Junction Temperature Range . . . . . . . . -10°C to +150°C CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. For JC, the “case temp” location is the center of the exposed metal pad on the package underside. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications Unless otherwise indicated, all of the following tables are: VSO = VHI = 5V, RSET = 620, RFREQ = 4.7k, RLOAD-IOUT1/2 = 8 to GND, RLOAD-BLUE = 10 to VHI, PMAX = 0x3FF, Reg 1 21 = 88h, Reg x-00 bit6 = 0b, TA = +25°C. PARAMETER DESCRIPTION MIN TYP MAX UNIT 5.7 V 7.0 V DC ELECTRICAL SPECIFICATIONS VSO (Notes 6, 7) VIBLUE IBLUE pin; RLOAD = 10 IVSO Supply Current (No Current Output) 25 35 mA IS, dis(nom) Supply Current, Disable Mode 3.5 6 mA IS, dis(high) Supply Current; VSO = 5.5V, Disable Mode 3.9 7 mA VSO, good VSO Voltage above which STATUS: VDDOK = 1 3.5 V IBLUE-LEAK(SEL) VIBLUE = 7.0V; IBLUE is selected 150 400 µA IBLUE-LEAK(DE-SEL) VIBLUE = 7.0V; IBLUE is not selected 1.1 1.6 mA VIH Input Logic High Level VIL Input Logic Low Level VOH SDIO High Level, IL = -5mA VOL SDIO Low Level, IL = 5mA IINH Logic Input Current High Level IINL Logic Input Current Low Level 4.5 2.9 2.0 V 0.8 2.4 V V 0.4 V -15 +10 µA -15 +10 µA NOTES: 6. Required voltage at the device pins. Allowance must be made for any voltage drop between the power supply and the device. 7. Required voltage also depends on laser diode manufacturer and pickup optical efficiency. Also, see ROUT spec of WDAC. Submit Document Feedback 4 FN6909.3 December 3, 2015 ISL58781 PMAX DAC (10-bit) DC Specifications Standard conditions unless otherwise noted. PARAMETER DESCRIPTION CONDITIONS MIN DNL-PMAX Differential Non-Linearity (Note 8) INL-PMAX Integral Non-Linearity At 200h Resistive Load ~0V to ~3V ZS-PMAX Zero-Scale Error (Note 9) VRSET RSET Pin Voltage TYP -3.5 MAX UNIT +3.5 LSB +40 LSB -2 0 +2 LSB 1.03 1.06 1.11 V NOTES: 8. Differential non-linearity (DNL) is the differential between the measured and ideal 1 LSB change of any two adjacent codes. 9. Zero-scale error (ZS) is the deviation from zero current output when the digital input code is zero. IOUT1/2 Write Power DAC (10-bit) DC Specifications PARAMETER DESCRIPTION Standard conditions unless otherwise noted. CONDITIONS MIN MAX (Note 14) TYP (Note 14) -1.7 +1.0 UNIT DNL-W Differential Non-Linearity LSB INL-W Integral Non-Linearity At 200h Resistive Load ~0V to ~3V FSOUT-W620 Write DAC Full-Scale Output Current RSET = 620 WriteDAC = 0x3FF. Headroom depends on IOUT. Reg 1-21 = 8F FSOUT-H1.1 Write DAC Full-Scale Output Current WriteDAC = 0x3FF, Reg 1-21 = 8F Fixed Headroom = 1.1V PSRR-FS Power Supply Rejection -Full-Scale Current vs VSO (Note 10) -30 dB TC-FS-IOUT Temperature Coefficient -Full-Scale Current (Note 11) 0°C to +85°C -32 ppm/C ZS-W Zero-scale error (Note 12) ROUT-WDAC Write DAC Output Series Resistance WriteDAC = PMAX = 0x3FF PMAX bias overdriven (Note 13) +21 LSB 475 500 mA 700 773 -2 875 mA 0 +2 LSB 1.1 1.4 NOTES: 10. Full scale output current power supply sensitivity (SFS) is measured by varying the VSO from 4.5V to 5.5V DC and measuring the effect of this signal on the full-scale output current. 11. Full scale output current temperature coefficient (TFS) is given by delta (full scale output current)/(T). 12. Zero-scale error (ZS) is the deviation from zero current output when the digital input code is zero. 13. PMAX bias overdriven via RSET. 14. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. Submit Document Feedback 5 FN6909.3 December 3, 2015 ISL58781 IBLUE Write Power DAC (10-bit) DC Specifications Standard conditions unless otherwise noted. PARAMETER DESCRIPTION CONDITIONS MIN TYP MAX DNL-W Differential Non-Linearity -4.9 INL-W Integral Non-Linearity At fixed 2.5V headroom FSOUT-H2.0 Write DAC Full-Scale Output Current RSET = 620 WriteDAC = 0x3FF; Fixed Headroom = 2.0V; Reg 1-21 = 8F TRRANGE Tr Tf adjustment Range Reg 1-0A from X0h to X7h PSRR-FS Power Supply Rejection -Full -Scale Current TCFS-IBLUE +2.0 +60 380 UNIT LSB LSB 445 575 mA 1 ns vs VSO (Note 15) -40 dB Temperature Coefficient -Full-Scale Current (Note 16) 600 ppm/C ZS-W Zero-Scale Error VIOUT = 2V (Note 17) ROUT-WDAC Write DAC Output Series Resistance WriteDAC = PMAX = 0x3FF PMAX bias overdriven (Note 18) -8 0 +8 LSB 2.9 4.5 NOTES: 15. Full scale output current power supply sensitivity (SFS) is measured by varying the VSO from 4.5V to 5.5V DC and measuring the effect of this signal on the full-scale output current. 16. Full scale output current temperature coefficient (TFS) is given by delta (full scale output current)/(T). 17. Zero-scale error (ZS) is the deviation from zero current output when the digital input code is zero. 18. PMAX bias overdriven via RSET. IBLUE Read APC Amplifier DC Specifications PARAMETER Standard conditions unless otherwise noted. DESCRIPTION CONDITIONS MIN TYP MAX UNIT IAPCMIN-GAIN Current Gain @Min Gain Reg1-21h = 1X, IAPC = 0µA, 500µA 8 12 22 mA/mA IAPCMAX-GAIN Current Gain @ Max Gain Reg1-21h = FX, IAPC = 0µA, 500µA 180 220 280 mA/mA IAPCGAIN Current Gain IAPC = 0µA, 500µA 80 101 150 mA/mA IAPCOS Current Offset IAPC = 0µA -2 1 3 mA LINAPC Output Current Linearity IAPC = 0µA, 500µA, 1.0mA 0 6 % IOUT-R-APC Blue Read Output Current, Using IAPC Input IAPC = 1.5mA 150 RIN IAPC Input Impedance to GND 800 PSRRAPC IAPC Current Power Supply Rejection IOUT-average = 100mA, varying VSO OUT1/2 Read APC Amplifier DC Specifications PARAMETER 1300 -46 dB Standard condition unless otherwise noted. CONDITIONS MIN TYP MAX UNIT Reg1-21h = 1X, IAPC = 0µA, 500µA 10.5 14 17.5 mA/mA IAPCMAX-GAIN Current Gain @ Max Gain Reg1-21h = FX, IAPC = 0µA, 500µA 145 163 185 mA/mA IAPCGAIN Current Gain IAPC = 0µA, 500µA 82 92 108 mA/mA IAPCOS Current Offset IAPC = 0µA -2 1 3 mA LINAPC Output Current Linearity IAPC = 0µA, 500µA, 1.0mA 0 6 % IOUT-R-APC Read Output Current, Using IAPC Input IAPC = 1.5mA RIN IAPC Input Impedance to GND PSRRAPC IAPC Current Power Supply Rejection IAPC-IN = 0.45mA, varying VSO IAPCMIN-GAIN DESCRIPTION mA Current Gain @ Min Gain Submit Document Feedback 6 120 mA 800 1300 -48 dB FN6909.3 December 3, 2015 ISL58781 Read DAC (12-bit) DC Specifications PARAMETER Standard conditions unless otherwise noted. DESCRIPTION CONDITIONS DNL-R Read DAC Differential Non-Linearity PREAD: Reg 0-19 + Reg 1-09 INL-R Read DAC Integral Non-Linearity @ 900h on Resistive Load. 0V to ~3V IOUT-R-DAC-RED Read Output Current, Read DAC at Full-Scale, IOUT1 or IOUT2 PREAD = 0xFFF, IAPC = 0, Reg 1-21 = 8F PSRR-FS Power Supply Rejection - Ful-Scale Current varying the VSO (Note 14) TC-FS-IOUT Temperature Coefficient - Full-Scale Not including the RSET Current tempco (Note 20) 0°C to +85°C ZS-R Zero-Scale Error MIN MAX (Note 22) TYP (Note 22) VIOUT = 2V (Note 16) -2 +2 LSB +90 110 UNIT LSB 130 170 mA -42 dB -48 ppm/C -80 0 80 LSB NOTES: 19. Full scale output current power supply sensitivity (SFS) is measured by varying the VSO from 4.5V to 5.5V DC and measuring the effect of this signal on the full-scale output current. 20. Full scale output current temperature coefficient (TFS) is given by delta (full scale output current)/(T). 21. Zero-scale error (ZS) is the deviation from zero current output when the digital input code is zero. 22. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and are not production tested. HFM (High Frequency Modulator) PARAMETER IMAX-RED-OFF-LINK Standard conditions unless otherwise noted. DESCRIPTION CONDITIONS MIN TYP MAX UNIT Max HFM Off DC Output, IOUT1 or IOUT2 in Link Mode HFMOFF = 0xFFF 90 120 160 mA IMAX-RED-OFF-UNLINK Max HFM Off DC Output, IOUT1 or IOUT2 in Unlink mode HFMOFF = 0xFFF 80 115 150 mA IMAX-BLUE-OFF Max HFM Off DC Output, IBLUE HFMOFF = 0xFFF 50 62 80 mA IMIN-RED-OFF Min HFM Off DC Output, IOUT1 or IOUT2 HFMOFF = 0x000 -3 0 3 mA IMIN-BLUE-OFF Min HFM Off DC Output, IBLUE HFMOFF = 0x000 -3 0 3 mA IMAX-RED-ON-LINK Max HFM Oscillator Output, IOUT1 or IOUT2 in Link Mode HFMON = Reg 0-17h = 0xFF 118 mAP-P IMAX-RED-ON-UNLINK Max HFM Oscillator Output, IOUT1 or IOUT2 in Unlink Mode HFMON = Reg 0-17h = 0xFF 114 mAP-P IMAX-BLUE-ON Max HFM Oscillator Output, IBLUE HFMON = 0xFF 60 mAP-P FOSC-HI-MAX Max HFM Frequency, High Range Reg 0-16 = FFh, Reg X-00 bit 6 = 0 900 1020 1250 MHz FOSC-HI-MIN Min HFM Frequency, High Range Reg 0-16 = 01h, Reg X-00 bit 6 = 0 120 175 240 MHz FOSC-LO-MAX Max HFM Frequency, Low Range Reg 0-16 = FFh, Reg X-00 bit 6 =1 425 525 625 MHz FOSC-LO-MIN Min HFM Frequency, Low Range Reg 0-16 = 01h, Reg X-00 bit 6 = 1 55 78 105 MHz PSRROSC-FREQ PSRR -HFM Frequency VSO from 4.5V to 5.0V PSRROSC-AMP-IOUT PSRR - HFM Amplitude PSRROSC-AMP-IBLUE 0.5 %/V 350MHz; HFMON = FFh; Link 3 %/V PSRR - HFM Amplitude 700MHz; HFMON = FFh; Link 1.2 %/V TFOSC400MAX HFM Frequency Temperature Coefficient Range from 200MHz to 400MHz 0 - 900 ppm/C TFOSC900MAX HFM Frequency Temperature Coefficient Range from 400MHz to 900MHz ±250 ppm/C VRFREQ RFREQ Pin Voltage RFREQ = 4.7k Submit Document Feedback 7 0.9 1.11 1.2 V FN6909.3 December 3, 2015 ISL58781 HFM (High Frequency Modulator) PARAMETER Standard conditions unless otherwise noted. (Continued) DESCRIPTION CONDITIONS MIN TYP MAX UNIT 0.1 0.525 1.1 % SS-WIDTH-RANGE Spread Spectrum Spreading Width Adjustment Range RFREQ = 4.7kReg 1-18 = 10h, Reg 0-16 = 26h; Reg X-00 bit 6 = 0 SS_Shift Shift of Center Frequency when SS is Enabled vs when it’s Disabled RFREQ = 4.7kReg 1-18-00h to 30h, Reg 0-16 = 26h; Reg X-00 bit 6=0 SS_Mod Spread Spectrum Modulation Frequency REG 1-18h Bit 7 = 0; Reg X-00 bit 6=0 30 53 80 kHz SS_Mod Spread Spectrum Modulation Frequency REG 1-18h Bit 7 = 1; Reg X-00 bit 6=0 15 34 55 kHz Serial Interface AC Performance PARAMETER 0.7 % Standard conditions unless otherwise noted. DESCRIPTION CONDITIONS MIN TYP MAX UNIT FSER SCLK Operating Range Static logic not limited at low frequency tEH SEN “H” Time @ 50MHz 320 ns tEL SEN “L” Time @ 50MHz 160 ns tERSR SEN Rising Edge to the First SCLK Rising Edge @ 50MHz 10 ns tCDS SDIO Set Up Time @ 50MHz 10 ns tCDH SDIO Hold Time @ 50MHz 10 ns tSREF Last SCLK Rising Edge to SEN Falling Edge @ 50MHz 10 ns tCC SCLK Cycle Time1 @ 50MHz 20 ns Duty SCLK “H” Duty Cycle @ 50MHz 40 tCDD SDIO Output Delay @ 50MHz tEDH SDIO Output Hold Time @ 50MHz LVDS Specifications PARAMETER 50 50 MHz 60 % 4 ns 2 ns Standard conditions unless otherwise noted. DESCRIPTION CONDITIONS MIN TYP MAX UNIT VIN-HIGH Maximum Single Line Voltage 2.4 V VIN-LOW Minimum Single Line Voltage 0 V CIN Input Capacitance 2 pF RIN Input Resistance VMIN Minimum Differential Voltage Submit Document Feedback 8 85 Signal tested with ±240mV differential input 240 100 115 mVPK FN6909.3 December 3, 2015 ISL58781 Laser Driver AC Performance PARAMETER Demoboard test, 10% duty cycle pulse, load = equivalent circuitry to [laser + flex cable] and/or as noted. VSO = 5V. TA = +25°C DESCRIPTION CONDITIONS MIN TYP MAX UNIT tR-IOUTx IOUT1/2 Write Rise Time (10% to 90%) 300mW Optical ML229U7 (Note 23) 1.3 ns tF-IOUTx IOUT1/2 Write Fall Time (10% to 90%) 300mW Optical ML229U7 (Note 23) 800 ps O/S-IOUTx IOUT1/2 Write Pulse Overshoot 300mW Optical ML229U7 (Note 23) 11 % tD-IOUTx IOUT1/2 Write Pulse Delay From (Note 23) LVDS = Zero crossing to IOUT rise 10% 5.3 ns tR-BLUE IBLUE Write Rise Time (10% to 90%) 250mW Optical (Note 23) 600 ps tF-BLUE IBLUE Write Fall Time (10% to 90%) 250mW Optical (Note 23) 450 ps O/S-BLUE IBLUE Write Pulse Overshoot 250mW Rising Optical (Note 23) 6 % tD-BLUE IBLUE Write Pulse Delay From (Note 23) LVDS = Zero crossing to IOUT rise 10% 5.2 ns INOISE-IOUTx IOUT1/2 Read Output Current Noise IOUT = 50mA, measured @ 10MHz 0.55 nA/Hz INOISE-IOUTx IOUT1/2 Read & HFM Output Current Noise IOUT = 50mA+30mAP-P; Measured @ 10MHz 0.96 nA/Hz INOISE-BLUE IBLUE Read Output Current Noise IOUT = 50mA, measured @ 10MHz 0.37 nA/Hz INOISE-BLUE IBLUE Read & HFM Output Current Noise IOUT = 50mA+10mAP-P; Measured @ 10MHz 0.47 nA/Hz BWAPC Read Amplifier 3dB Bandwidth 0.5 MHz IOUT = 50mA NOTE: 23. Limits established by characterization and are not production tested TABLE 1. AMPLITUDE SELECTION REGISTER ACTIVATION NAME ENA WEB CR0 Bit 2 WEN2 WEN1 WEN0 MSB BSEL = 0 LSB BSEL = 0 MSB BSEL = 1 LSB BSEL = 1 OFF 0 X x X X X X X X X READ 1 1 0 X X X 0-19 1-09 0-19 1-09 W0 1 0 1 0 0 0 0-10 2-10 0-11 2-11 W1 1 0 1 0 0 1 0-04 2-04 0-05 2-05 W2 1 0 1 0 1 0 0-06 2-06 0-07 2-07 W3 1 0 1 0 1 1 0-08 2-08 0-09 2-09 W4 1 0 1 1 0 0 0-0A 2-0A 0-0B 2-0B W5 1 0 1 1 0 1 0-0C 2-0C 0-0D 2-0D W6 1 0 1 1 1 0 0-0E 2-0E 0-0F 2-0F W7 1 0 1 1 1 1 0-12 2-12 0-13 2-13 NOTES: 24. There are two sets of write current registers. When BSEL = 1, bank 1 is selected. When BSEL = 0, bank 0 is selected. 25. Read and write are independent. Read is enabled with a control bit. 26. Register terminology is page Number-Register number (hex). Thus 1-09 is page 1, register 09h Submit Document Feedback 9 FN6909.3 December 3, 2015 ISL58781 Applications Information IOUT The data sheet values for oscillator current, and write current are based on an RSET of 620 when PMAX and WriteDAC are both set to full scale. The user may choose RSET to match the output current needs of the application. The PMAX DAC is biased by IRSET (= VRSET/RSET). See the “Typical Performance Curves” on page 10. The write channel output capability for a typical part is shown in Figure 1. The amount of IOUT will be limited by the available headroom voltage at the IOUTx pins. A four input DAC (Reg 1-0A bits 3, 2, 1, 0) can be used to control the amount of RC snubbing applied to the outputs. Read current may be controlled by either the Read DAC or the IAPC input. When set by PREAD, IREAD is limited to the data sheet value, whereas the IAPC input will allow a significantly higher value to be obtained. The ReadDAC and IAPC currents sum together. Glitches could occur if two or three WEN lines are changed simultaneously, and the propagation delay is different for the two lines between the inner circuits of the controller and the inner circuits of the LDD. Because the WEN lines are encoded, the selected write current will be correct before the change in code, and again after the code changes. But some other output could result momentarily if the propagation delays are not matched. The skew detector detects the first rising edge at the LVDS outputs. FOSC DAC. Although FOSC is relatively linear with DAC code, monotonicity is not guaranteed (see Figure 5). Under extreme conditions, where VSO = 4.5V and temperature is +125°C, the HFM frequency is only capable of 900MHz (see Figure 6). The oscillator may be turned on either by the OSCEN lines or by the WEN code selected. The particular code that selects the oscillator is under program control. The Pcool function is only available through the program control and WEN selection. The WEB enables write current. Thus WEN code 000 may also select a write current. Power The main power consumption is caused by the headroom voltage across the output stage (VSO - VIOUT) xIOUT. For IOUT1 and IOUT2, the VSO can be reduced below 5.0V (but above VSO-GOOD), as long as sufficient headroom voltage is available to obtain the desired output current. For the blue outputs, the built in ADC can be used to obtain the output voltage, which is also the headroom voltage. The HFM oscillator power consumption will increase with increasing frequency and amplitude (see Figure 7). Note that in the QFN package, the die is mounted directly on the thermal pad. This provides a very low thermal resistance Junction to thermal pad of just a few °C/W. The problem is in moving the heat from the thermal pad to some other heat sink. Figure 10 shows that when mounted well on a 4-layer PCB with 3 ground plane layers, and an area of 10cmx10cm, the JA is +37°C/W. The typical application will not afford this good of a heat sink. Both FOSC and RFREQ may be chosen to accommodate the desired range or operating point of the HFMFREQ Typical Performance Curves IOUT2 (mA) 1000 800 500 IOUT2 vs VHEAD vs PMAX CODE 3FFh (REG 1-21 = 88h) (VSO = 4.5V) (RSET = 620) 300h 200h 600 100h 400 80h 200 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 VHEADROOM (V) 3.5 FIGURE 1. IOUT WRITE CURRENT vs VSD vs IPMAX_BIAS Submit Document Feedback 10 3FFh 400 40h 4.0 4.5 IBLUE (mA) 1200 300h 300 200h 200 100h 100 0 40h 001h 0 1 2 3 4 5 VHEADROOM (V) 6 7 8 FIGURE 2. IBLUE vs PMAX vs VHEADROOM (VSO = 5.0V) (RSET = 620) (1-21 = FFh), (RLOAD = 10) FN6909.3 December 3, 2015 ISL58781 Typical Performance Curves IBLUE (mA) 250 IBLUE vs VHEAD vs PMAX CO (Reg 1-21 = 88h) (VSO = 4.5V) 200 300h 150 200h 100 100h 200 50 0 40h 0 1 2 3 4 VHEADROOM (V) 5 1000 6 1200 CR0 - 6 = 0b 400 CR0 - 6 = 1b 200 0x00 0x40 1 0x80 0xC0 4 VHEADROOM (V) 5 6 7 800 600 400 200 0 0x00 0xFF 0x40 0x80 0xC0 0xFF HFMFREQ CODE FIGURE 5. HFM CONTROL FIGURE 6. HFM CONTROL; VSO = 4.5V; TEMP = +125°C 90 10 80 HFMON = 80 HFMON = FF 70 60 50 40 HFMON = 01 0 HFMON = 40 100 200 300 400 500 600 700 800 900 1G CHCLK FREQ (MHz) FIGURE 7. HFM OSCILLATOR CURRENT CONSUMPTION Submit Document Feedback 11 NOISE (nARMS/(Hz)) ISO CONSUMPTION (mA) 0.441mA 3 CR0 - 6 = 0b HFMFREQ CODE 30 2 RFREQ = 3900 1000 800 0 0 FIGURE 4. IBLUE READ vs VHEADROOM vs IAPC, (REG 1-212 = 88h) (VSO = 5.0V) (RSET = 620) RFREQ = 4700 600 0.836mA 0mA FOSC (MHz) 1200 1.228mA 100 80h 0 1.622mA 150 50 FIGURE 3. IBLUE WRITE CURRENT vs VDS vs IPMAX_BIAS FOSC (MHz) 250 (RSET = 620) 3FFh IBLUE (mA) 300 (Continued) 50mA + 30mAP-P 1.0 50mA 0.1 0.1 1M 10M 100M FREQUENCY (Hz) FIGURE 8. IOUTx NOISE vs FREQUENCY FN6909.3 December 3, 2015 ISL58781 Typical Performance Curves (Continued) 700 BANDWIDTH (kHz) NOISE (nARMS/(÷Hz)) 10.0 50mA + 10mAP-P 1.0 50mA 0.1 0.1 1M 10M 100M 600 500 400 300 200 0.0 0.6 FREQUENCY (Hz) POWER DISSIPATION (W) 4.0 2.4 3.0 FIGURE 10. IOUT/IAPC BANDWIDTH vs IAPC FIGURE 9. IBLUE NOISE vs FREQUENCY 4.5 1.2 1.8 IAPC (mA) JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - QFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 3.378W 3.5 JA = 3.0 2.5 2.0 QF N2 8 +3 7° C/ W 1.5 1.0 0.5 0 0 125 25 50 75 85 100 AMBIENT TEMPERATURE (°C) 150 FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Submit Document Feedback 12 FN6909.3 December 3, 2015 ISL58781 0.100 ±0.03 SEATING PLANE 0.00-0.05 0.2000 0.150 ±0.05 0.6250 NOTE: THE TIE BAR DIMENSIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE FIGURE 12. TIE BAR LOCATION FOR 4X5 QFN Submit Document Feedback 13 FN6909.3 December 3, 2015 ISL58781 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION CHANGE 12/3/15 FN6909.3 Removed ISL58781CRZ-EVAL from Ordering Information table. 7/22/13 FN6909.2 Updated datasheet by changing Logo, removed side bar with part number, copyright on page 1 and changed Product Information verbiage to About Intersil verbiage on page 14. 11/12/09 FN6909.1 Added Figure 12 “TIE BAR LOCATION FOR 4X5 QFN” on page 13 Added “Pin Number” column to “Pin Descriptions” on page 3 On page 7: In HFM spec Table, for IMAX-RED-OFF-LINK, IMAX-RED-OFF-UNLINK & IMAXBLUE-OFF parameters, changed "HFMOFF = 0x7FF" test condition to "HFMOFF = 0xFFF": since HFMOFF DAC is 12 bits now. On page 7: In HFM spec Table, Reg 1-21h=x7h for Imax_Blue_ON: Imax_Blue_On (Blue HFM ON amplitude) does not depend on Reg 1-21h setting. So, deleted "Reg 1-21h=x7h" condition 9/2/09 FN6909.0 Initial release. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9001 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com Submit Document Feedback 14 FN6909.3 December 3, 2015 ISL58781 Package Outline Drawing L28.4x5A 28 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 06/08 2.50 4.00 B 22 5.00 PIN #1 INDEX AREA 28 23 6 PIN 1 INDEX AREA (4X) 6 24X 0.50 A 1 3.50 Exp. DAP 3.50 0.10 M C A B 4 28X 0.25 0.15 8 15 9 14 SIDE VIEW TOP VIEW 2.50 Exp. DAP 28X 0.400 BOTTOM VIEW SEE DETAIL "X" ( 3.80 ) 0.10 C Max 0.90 ( 2.50) C SEATING PLANE 0.08 C SIDE VIEW ( 4.80 ) ( 24X 0.50) ( 3.50 ) C 0 . 2 REF 5 0 . 00 MIN. 0 . 05 MAX. (28X .250) DETAIL "X" ( 28 X 0.60) TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. Submit Document Feedback 15 The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. FN6909.3 December 3, 2015