DATASHEET

EL8100, EL8101
®
Data Sheet
September 14, 2010
200MHz Rail-to-Rail Amplifiers
Features
The EL8100 and EL8101 represent single rail-to-rail
amplifiers with a -3dB bandwidth of 200MHz and slew rate of
200V/µs. Running off a very low 2mA supply current, the
EL8100 and EL8101 also feature inputs that go to 0.15V
below the VS- rail.
• 200MHz -3dB bandwidth
The EL8100 includes a fast-acting disable/power-down
circuit. With a 25ns disable and a 200ns enable, the EL8100
is ideal for multiplexing applications.
• Rail-to-rail output
The EL8100 and EL8101 are designed for a number of
general purpose video, communication, instrumentation, and
industrial applications. The EL8100 is available in 8 Ld SO
and 6 Ld SOT-23 packages and the EL8101 is available in a
5 Ld SOT-23 package. All are specified for operation over
the -40°C to +85°C temperature range.
Ordering Information
PART NUMBER
(Note 1)
PART
MARKING
FN7103.9
• 200V/µs slew rate
• Low supply current = 2mA
• Supplies from 3V to 5.0V
• Input to 0.15V below VS• Fast 25ns disable (EL8100 only)
• Low cost
• Pb-Free (RoHS compliant)
Applications
• Video amplifiers
• Portable/hand-held products
PKG.
DWG. #
PACKAGE
EL8100ISZ
8100ISZ
8 Ld SOIC
(Pb-Free)
M8.15E
EL8100ISZ-T7*
8100ISZ
8 Ld SOIC
(Pb-Free)
M8.15E
EL8100ISZ-T13*
8100ISZ
8 Ld SOIC
(Pb-Free)
M8.15E
EL8100IWZ-T7*
BASA
(Note 2)
6 Ld SOT-23
(Pb-free)
P6.064A
EL8100IWZ-T7A* BASA
(Note 2)
6 Ld SOT-23
(Pb-free)
P6.064A
EL8101IWZ-T7*
BATA
(Note 2)
5 Ld SOT-23
(Pb-Free)
P5.064A
EL8101IWZ-T7A* BATA
(Note 2)
5 Ld SOT-23
(Pb-Free)
P5.064A
• Communications devices
Pinouts
EL8100
(8 LD SOIC)
TOP VIEW
NC 1
IN- 2
IN+ 3
8 ENABLE
+
VS- 4
5 NC
OUT 1
1. These Intersil Pb-free plastic packaged products employ special
Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination
finish, which is RoHS compliant and compatible with both SnPb
and Pb-free soldering operations). Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet
or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
VS- 2
6 VS+
+ -
IN+ 3
5 ENABLE
4 IN-
EL8101
(5 LD SOT-23)
TOP VIEW
2. The part marking is located on the bottom of the part.
OUT 1
VS- 2
IN+ 3
1
6 OUT
EL8100
(6 LD SOT-23)
TOP VIEW
*Please refer to TB347 for details on reel specifications.
NOTES:
7 VS+
5 VS+
+ 4 IN-
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2003-2005, 2007, 2010. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
EL8100, EL8101
Absolute Maximum Ratings (TA = +25°C)
Thermal Information
Supply Voltage from VS+ to VS- . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to VS- -0.3V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V
Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 40mA
ESD Tolerance
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .300V
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C
Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C
Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are
at the specified temperature and are pulsed tests, therefore: TJ = TC = TA
Electrical Specifications
PARAMETER
VS+ = 5V, VS- = GND, TA = +25°C, VCM = 2.5V, RL to 2.5V, AV = 1, Unless Otherwise Specified.
DESCRIPTION
CONDITIONS
MIN
(Note 3)
TYP
MAX
(Note 3)
UNIT
-6
-0.8
+6
mV
INPUT CHARACTERISTICS
VOS
Offset Voltage
TCVOS
Offset Voltage Temperature Coefficient Measured from TMIN to TMAX
IB
Input Bias Current
VIN = 0V
IOS
Input Offset Current
VIN = 0V
TCIOS
Input Bias Current Temperature
Coefficient
Measured from TMIN to TMAX
CMRR
Common Mode Rejection Ratio
VCM = -0.15V to +3.5V
CMIR
Common Mode Input Range
RIN
Input Resistance
CIN
Input Capacitance
AVOL
Open Loop Gain
-2.1
3
µV/°C
-1.5
µA
0.2
70
µA
2
nA/°C
90
dB
VS- -0.15
Common Mode
0.55
VS+ -1.5
V
16
MΩ
0.5
pF
90
dB
VOUT = +1.5V to +3.5V, RL = 150Ω to GND
80
dB
30
mΩ
VOUT = +1.5V to +3.5V, RL = 1kΩ to GND
75
OUTPUT CHARACTERISTICS
ROUT
Output Resistance
AV = +1
VOP
Positive Output Voltage Swing
RL = 1kΩ
4.85
4.9
V
RL = 150Ω
4.6
4.7
V
VON
Negative Output Voltage Swing
RL = 150Ω
100
150
mV
RL = 1kΩ
35
50
mV
IOUT
Linear Output Current
65
mA
ISC (source)
Short Circuit Current
RL = 10Ω
60
70
mA
ISC (sink)
Short Circuit Current
RL = 10Ω
120
140
mA
VS+ = 4.5V to 5.5V
75
100
dB
POWER SUPPLY
PSRR
Power Supply Rejection Ratio
IS-ON
Supply Current - Enabled
2
IS-OFF
Supply Current - Disabled
30
µA
2.4
mA
ENABLE (EL8100 ONLY)
tEN
Enable Time
200
ns
tDS
Disable Time
25
ns
2
FN7103.9
September 14, 2010
EL8100, EL8101
Electrical Specifications
PARAMETER
VS+ = 5V, VS- = GND, TA = +25°C, VCM = 2.5V, RL to 2.5V, AV = 1, Unless Otherwise Specified. (Continued)
DESCRIPTION
MIN
(Note 3)
CONDITIONS
TYP
MAX
(Note 3)
UNIT
VIH-ENB
ENABLE Pin Voltage for Power-up
0.8
V
VIL-ENB
ENABLE Pin Voltage for Shut-down
2
V
IIH-ENB
ENABLE Pin Input Current High
8.6
µA
IIL-ENB
ENABLE Pin Input for Current Low
0.01
µA
AV = +1, RF = 0Ω, CL = 5pF
200
MHz
AV = -1, RF = 1kΩ, CL = 5pF
90
MHz
AV = +2, RF = 1kΩ, CL = 5pF
90
MHz
AV = +10, RF = 1kΩ, CL = 5pF
10
MHz
AC PERFORMANCE
BW
-3dB Bandwidth
BW
±0.1dB Bandwidth
AV = +1, RF = 0Ω, CL = 5pF
20
MHz
Peak
Peaking
AV = +1, RF = 1kΩ, CL = 5pF
1
dB
GBWP
Gain Bandwidth Product
100
MHz
PM
Phase Margin
RL = 1kΩ, CL = 5pF
55
°
SR
Slew Rate
AV = 2, RL = 100Ω, VOUT = 0.5V to 4.5V
200
V/µs
tR
Rise Time
2.5VSTEP, 20% to 80%
8
ns
tF
Fall Time
2.5VSTEP, 20% to 80%
7
ns
OS
Overshoot
200mV step
10
%
tPD
Propagation Delay
200mV step
2
ns
tS
0.1% Settling Time
200mV step
20
ns
dG
Differential Gain
AV = +2, RF = 1kΩ, RL = 150Ω
0.035
%
dP
Differential Phase
AV = +2, RF = 1kΩ, RL = 150Ω
0.05
°
eN
Input Noise Voltage
f = 10kHz
10
nV/√Hz
iN+
Positive Input Noise Current
f = 10kHz
1
pA/√Hz
iN-
Negative Input Noise Current
f = 10kHz
0.8
pA/√Hz
160
NOTE:
3. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
Pin Descriptions
PIN NUMBER
EL8100IS
(8 Ld SOIC)
EL8100IW
(6 Ld SO- 23)
EL8101IW
5 Ld SOT-23)
1, 5
PIN NAME
DESCRIPTION
NC
Not connected
2
4
4
IN-
Inverting input
3
3
3
IN+
Non-inverting input
4
2
2
VS-
Negative power supply
6
1
1
OUT
Amplifier output
7
6
5
VS+
Positive power supply
8
5
3
ENABLE
Enable and disable input
FN7103.9
September 14, 2010
EL8100, EL8101
Simplified Schematic Diagram
VS+
I1
I2
Q5
Q7
R2
Q1
IN+
R8
VBIAS1
Q6
R3
R1
R7
R6
Q2
DIFFERENTIAL TO
SINGLE ENDED
DRIVE
GENERATOR
IN-
VBIAS2
Q3
OUT
Q4
Q8
R4
R5
R9
VS-
Typical Performance Curves
GAIN (dB)
2
4
VS = 5V
AV = 1
RL = 1kΩ
CL = 5pF
2
VOP-P = 200mV
GAIN (dB)
4
0
VOP-P = 1V
-2
-6
100k
1M
10M
RL = 330Ω
0
RL = 1kΩ
-2
RL = 100Ω
VOP-P = 2V
-4
VS = 5V
AV = 1
CL = 5pF
-4
100M
-6
100k
1G
1M
FIGURE 1. FREQUENCY RESPONSE FOR VARIOUS OUTPUT
VOLTAGE LEVELS
4
AV = 2
NORMALIZED GAIN (dB)
NORMALIZED GAIN (dB)
2
AV = 1
0
-2
AV = 5
-4
-6
100k
AV = 10
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 3. SMALL SIGNAL FREQUENCY RESPONSE FOR
VARIOUS NON-INVERTING GAINS
4
100M
1G
FIGURE 2. SMALL SIGNAL FREQUENCY RESPONSE FOR
VARIOUS RLOAD
4
VS = 5V
RL = 1kΩ
CL = 5pF
10M
FREQUENCY (Hz)
FREQUENCY (Hz)
2
VS = 5V
RL = 1kΩ
CL = 5pF
RF = 1kΩ
AV = -5
0
AV = -2
-2
AV = -10
-4
-6
100k
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 4. SMALL SIGNAL FREQUENCY RESPONSE FOR
VARIOUS INVERTING GAINS
FN7103.9
September 14, 2010
EL8100, EL8101
Typical Performance Curves (Continued)
10
CL = 15pF
CL = 11.5pF
1
CL = 8.3pF
CL = 56pF
8
CL = 5pF
-1
VS = 5V
-3 AV = 1
RL = 1kΩ
VOP-P = 200mV
-5
100k
1M
6
CL = 15pF
4
CL = 1.5pF
10M
CL = 35pF
VS = 5V
AV = 2
RL = 1kΩ
RF = RG = 1kΩ
2
100M
0
100k
1G
1M
FREQUENCY (Hz)
110
RF = RG = 500Ω
VS = 5V
AV = 2
RL = 1kΩ
CL = 5pF
0
100k
315
RL = 150Ω
GAIN (dB)
GAIN (dB)
2
30
225
RL = 150Ω
-10
10M
100M
1G
135
RL = 1kΩ
-50
1M
-90
1k
10k
45
100k
FREQUENCY (Hz)
1M
100M
-45
1G
FIGURE 8. OPEN LOOP GAIN AND PHASE vs FREQUENCY
-10
230
210
BANDWIDTH (MHz)
-30
CMRR (dB)
10M
FREQUENCY (Hz)
FIGURE 7. SMALL SIGNAL FREQUENCY RESPONSE FOR
VARIOUS RF AND RG
-50
-70
-90
1M
10M
100M
FREQUENCY (Hz)
FIGURE 9. COMMON-MODE REJECTION RATIO vs
FREQUENCY
5
AV = 1
190
170
150
130
110
90
70
-110
100k
1G
405
RL = 1kΩ
70
RF = RG = 1kΩ
6
4
100M
FIGURE 6. SMALL SIGNAL FREQUENCY RESPONSE FOR
VARIOUS CL
10
RF = RG = 2kΩ
10M
FREQUENCY (Hz)
FIGURE 5. SMALL SIGNAL FREQUENCY RESPONSE FOR
VARIOUS CL
8
CL = 5pF
PHASE (°)
3
GAIN (dB)
GAIN (dB)
5
50
3.0
RL = 1kΩ
CL = 5pF
3.5
AV = 2
4.0
4.5
5.0
5.5
VS (V)
FIGURE 10. SMALL SIGNAL BANDWIDTH vs SUPPLY
VOLTAGE
FN7103.9
September 14, 2010
EL8100, EL8101
Typical Performance Curves (Continued)
2.5
2.0
10
PEAKING (dB)
IMPEDANCE (Ω)
100
1.0
0.1
1.5
1.0
0.5
0.01
10k
100k
1M
10M
0
3.0
100M
AV = 1
RL = 1kΩ
CL = 5pF
4.0
3.5
4.5
FREQUENCY (Hz)
-10
-45
-30
-55
PSRR-
-70
5.5
FIGURE 12. SMALL SIGNAL PEAKING vs SUPPLY VOLTAGE
DISTORTION (dBc)
PSRR (dB)
FIGURE 11. OUTPUT IMPEDANCE vs FREQUENCY
-50
5.0
VS (V)
PSRR+
VS = 5V
RL = 1kΩ
CL = 5pF
AV = 2
@1
HD2
MHz
@10
HD3
Hz
HD3@5M
-65
-75
z
HD2@5MH
HD2@
-85
-90
z
0MH
1MHz
HD3@1MHz
-110
1k
10k
100k
1M
10M
-95
100M
1
2
3
FIGURE 13. POWER SUPPLY REJECTION RATIO vs
FREQUENCY
GAIN (dB)
-30
-30
VS = 5V
AV = 1
RL = 1kΩ
CL = 5pF
VS = 5V
RL = 1kΩ
VO = 1VP-P for AV = 1
VO = 2VP-P for AV = 2
-40
-50
-70
-90
-110
1k
-50
-60
=2
AV
2@
D
H
-70
-80
3@
HD
-90
10k
100k
1M
10M
100M
1G
FREQUENCY (Hz)
FIGURE 15. DISABLED OUTPUT ISOLATION FREQUENCY
RESPONSE
6
5
FIGURE 14. HARMONIC DISTORTION vs OUTPUT VOLTAGE
DISTORTION (dBc)
-10
4
VOP-P (V)
FREQUENCY (Hz)
-100
H
@
D2
=1
AV
2
AV=
HD3@AV=1
1
10
40
FREQUENCY (MHz)
FIGURE 16. HARMONIC DISTORTION vs FREQUENCY
FN7103.9
September 14, 2010
EL8100, EL8101
Typical Performance Curves (Continued)
-60
1.0k
DISTORTION (dBc)
-65
HD
3@
-70
-75
HD
-80
AV =
2
HD2@A =1
V
3@
A
V=
AV =2
VOLTAGE NOISE (nV/√Hz)
CURRENT NOISE (pA/√Hz)
H D 2@
1
-85
-90
VS = 5V
VO = 1VP-P for AV = 1
VO = 2VP-P for AV = 2
-95
-100
100
1K
2K
100
IN+
1.0
IN0.1
10
100
1k
10k
100k
1M
10M
FREQUENCY (Hz)
RLOAD (Ω)
FIGURE 17. HARMONIC DISTORTION vs LOAD RESISTANCE
eN
10
FIGURE 18. VOLTAGE AND CURRENT NOISE vs FREQUENCY
VS = 5V, AV = 5, RL = 1kΩ TO 2.5V
VS = 5V, AV = 1, RL = 1kΩ TO 2.5V
5.0
5.0
2.5
2.5
0
0
10ns/DIV
2µs/DIV
FIGURE 19. LARGE SIGNAL TRANSIENT RESPONSE
FIGURE 20. OUTPUT SWING
VS = 5V, AV = 1, RL = 1kΩ TO 2.5V CL= 5pF
VS = 5V, AV = 5, RL = 1kΩ TO 2.5V
5.0
2.6
2.5
2.5
2.4
0
10ns/DIV
FIGURE 21. SMALL SIGNAL TRANSIENT RESPONSE
7
2µs/DIV
FIGURE 22. OUTPUT SWING
FN7103.9
September 14, 2010
EL8100, EL8101
Typical Performance Curves (Continued)
VS = ±2.5V, AV = 1, RL = 1kΩ
VS = ±2.5V, AV = 1, RL = 1kΩ
CH1
CH1
CH2
ENABLE
INPUT
ENABLE
INPUT
CH2
VOUT
OUTPUT
CH1, CH2, 0.5V/DIV, M = 20ns
CH1, CH2, 1V/DIV, M = 100ns
FIGURE 23. DISABLED RESPONSE
FIGURE 24. ENABLED RESPONSE
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
1.0
0.9
1.2
POWER DISSIPATION (W)
POWER DISSIPATION (W)
1.4
1.0 909mW
0.8
SO8
θJA = +110°C/W
0.6
435mW
0.4
SOT23-5/6
θJA = +230°C/W
0.2
0
0
25
0.8
0.7 625mW
0.6
0.5
0.3
0.2
SOT23-5/6
θJA = +256°C/W
0.1
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
SO8
θJA = +160°C/W
391mW
0.4
0
0
25
50
75 85 100
125
150
AMBIENT TEMPERATURE (°C)
FIGURE 25. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Description of Operation and Application
Information
The amplifiers have an input common mode voltage range
from 0.15V below the negative supply (VS- pin) to within
1.5V of the positive supply (VS+ pin). If the input signal is
outside the above specified range, it will cause the output
signal to be distorted.
Product Description
The EL8100, EL8101 are wide bandwidth, single supply, low
power and rail-to-rail output voltage feedback operational
amplifiers. Both amplifiers are internally compensated for
closed loop gain of +1 of greater. Connected in voltage
follower mode and driving a 1kΩ load, the EL8100, EL8101
have a -3dB bandwidth of 200MHz. Driving a 150Ω load, the
bandwidth is about 130MHz while maintaining a 200V/µs
slew rate. The EL8100 is available with a power-down pin to
reduce power to 30µA typically while the amplifier is
disabled.
Input, Output and Supply Voltage Range
The EL8100, EL8101 have been designed to operate with a
single supply voltage from 3V to 5.0V. Split supplies can also
be used as long as their total voltage is within 3V to 5.0V.
8
The output of the EL8100, EL8101 can swing rail-to-rail. As
the load resistance becomes lower, the ability to drive close
to each rail is reduced. For the load resistor 1kΩ, the output
swing is about 4.9V at a 5V supply. For the load resistor
150Ω, the output swing is about 4.6V.
Choice of Feedback Resistor and Gain Bandwidth
Product
For applications that require a gain of +1, no feedback
resistor is required. Just short the output pin to the inverting
input pin. For gains greater than +1, the feedback resistor
forms a pole with the parasitic capacitance at the inverting
input. As this pole becomes smaller, the amplifier’s phase
margin is reduced. This causes ringing in the time domain
FN7103.9
September 14, 2010
EL8100, EL8101
and peaking in the frequency domain. Therefore, RF has
some maximum value that should not be exceeded for
optimum performance. If a large value of RF must be used, a
small capacitor in the few Pico farad range in parallel with RF
can help to reduce the ringing and peaking at the expense of
reducing the bandwidth.
As far as the output stage of the amplifier is concerned, the
output stage is also a gain stage with the load. RF and RG
appear in parallel with RL for gains other than +1. As this
combination gets smaller, the bandwidth falls off.
Consequently, RF also has a minimum value that should not
be exceeded for optimum performance. For gain of +1,
RF = 0 is optimum. For the gains other than +1, optimum
response is obtained with RF between 300Ω to 1kΩ.
The EL8100, EL8101 have a gain bandwidth product of
100MHz. For gains ≥5, its bandwidth can be predicted by
Equation 1:
(EQ. 1)
Gain × BW = 100MHz
turn-on time is about 200ns. When disabled, the amplifier’s
supply current is reduced to 30µA typically, thereby
effectively eliminating the power consumption. The
amplifier’s power-down can be controlled by standard TTL or
CMOS signal levels at the ENABLE pin. The applied logic
signal is relative to VS- pin. Letting the ENABLE pin float or
applying a signal that is less than 0.8V above VS- will enable
the amplifier. The amplifier will be disabled when the signal
at the ENABLE pin is 2V above VS-.
Output Drive Capability
The EL8100, EL8101 do not have internal short circuit
protection circuitry. They have a typical short circuit current
of 70mA sourcing and 140mA sinking for the output is
connected to half way between the rails with a 10Ω resistor.
If the output is shorted indefinitely, the power dissipation
could easily increase such that the part will be destroyed.
Maximum reliability is maintained if the output current never
exceeds ±40mA. This limit is set by the design of the internal
metal interconnections.
Video Performance
Power Dissipation
For good video performance, an amplifier is required to
maintain the same output impedance and the same
frequency response as DC levels are changed at the output.
This is especially difficult when driving a standard video load
of 150Ω, because the change in output current with DC level.
Special circuitry has been incorporated in the
EL8100, EL8101 to reduce the variation of the output
impedance with the current output. This results in dG and dP
specifications of 0.03% and 0.05°, while driving 150Ω at a
gain of 2. Driving high impedance loads would give a similar
or better dG and dP performance.
With the high output drive capability of the EL8100, EL8101,
it is possible to exceed the +125°C absolute maximum
junction temperature under certain load current conditions.
Therefore, it is important to calculate the maximum junction
temperature for the application to determine if the load
conditions or package types need to be modified for the
amplifier to remain in the safe operating area.
Driving Capacitive Loads and Cables
The EL8100, EL8101 can drive 15pF loads in parallel with
1kΩ with less than 5dB of peaking at gain of +1. If less
peaking is desired in applications, a small series resistor
(usually between 5Ω to 50Ω) can be placed in series with the
output to eliminate most peaking. However, this will reduce
the gain slightly. If the gain setting is greater than 1, the gain
resistor RG can then be chosen to make up for any gain loss
which may be created by the additional series resistor at the
output.
When used as a cable driver, double termination is always
recommended for reflection-free performance. For those
applications, a back-termination series resistor at the
amplifier’s output will isolate the amplifier from the cable and
allow extensive capacitive drive. However, other applications
may have high capacitive loads without a back-termination
resistor. Again, a small series resistor at the output can help
to reduce peaking.
Disable/Power-Down
The EL8100 can be disabled and placed its output in a high
impedance state. The turn-off time is about 25ns and the
9
The maximum power dissipation allowed in a package is
determined according to Equation 2:
T JMAX – T AMAX
PD MAX = --------------------------------------------θ JA
(EQ. 2)
Where:
TJMAX = Maximum junction temperature
TAMAX = Maximum ambient temperature
θJA = Thermal resistance of the package
The maximum power dissipation actually produced by an IC
is the total quiescent supply current times the total power
supply voltage, plus the power in the IC due to the load, or:
For sourcing, Equation 3:
V OUT
PD MAX = V S × I SMAX + ( V S – V OUT ) × ---------------R
(EQ. 3)
L
For sinking, Equation 4:
(EQ. 4)
PD MAX = V S × I SMAX + ( V OUT – V S - ) × I LOAD
Where:
VS = Total supply voltage
ISMAX = Maximum quiescent supply current
FN7103.9
September 14, 2010
EL8100, EL8101
VOUT = Maximum output voltage of the application
RLOAD = Load resistance tied to ground
ILOAD = Load current
By setting the two PDMAX equations equal to each other, we
can solve the output current and RLOAD to avoid the device
overheat.
and VIN2 is passed through to the output. The
break-before-make operation ensures that more than one
amplifier isn’t trying to drive the bus at the same time.
5V
VIN
-
1k
1K
FIGURE 27. SYNC PULSE REMOVER
1.0V
0.5V
VIN
0V
1.0V
0.5V
VOUT
0V
M = 10µs/DIV
FIGURE 28. VIDEO SIGNAL
+2.5V
B 2MHz
1VP-P
+
75Ω
-2.5V
Typical Applications
1k
1K
Video Sync Pulse Remover
Multiplexer
VOUT
75Ω
As with any high frequency device, a good printed circuit
board layout is necessary for optimum performance. Lead
lengths should be as sort as possible. The power supply pin
must be well bypassed to reduce the risk of oscillation. For
normal single supply operation, where the VS- pin is
connected to the ground plane, a single 4.7µF tantalum
capacitor in parallel with a 0.1µF ceramic capacitor from VS+
to GND will suffice. This same capacitor combination should
be placed at each supply pin to ground if split supplies are to
be used. In this case, the VS- pin becomes the negative
supply rail.
Many CMOS analog to digital converters have a parasitic
latch up problem when subjected to negative input voltage
levels. Since the sync tip contains no useful video
information and it is a negative going pulse, we can chop it
off. Figure 27 shows a gain of 2 connections for EL8100,
EL8101. Figure 28 shows the complete input video signal
applied at the input, as well as the output signal with the
negative going sync pulse removed.
75Ω
VS-
75Ω
Power Supply Bypassing and Printed Circuit
Board Layout
For good AC performance, parasitic capacitance should be
kept to a minimum. Use of wire-wound resistors should be
avoided because of their additional series inductance. Use
of sockets should also be avoided if possible. Sockets add
parasitic inductance and capacitance that can result in
compromised performance. Minimizing parasitic capacitance
at the amplifier’s inverting input pin is very important. The
feedback resistor should be placed very close to the
inverting input pin. Strip line design techniques are
recommended for the signal traces.
VS+
+
75Ω
VOUT
+2.5V
A 2MHz
2VP-P
75Ω
+
-
75Ω
-2.5V
1k
1K
ENABLE
FIGURE 29. TWO TO ONE MULTIPLEXER
Besides the normal power-down usage, the ENABLE pin of
the EL8100 can be used for multiplexing applications.
Figure 29 shows two EL8100s with the outputs tied together,
driving a back terminated 75Ω video load. A 2VP-P 2MHz
sine wave is applied to Amp A and a 1VP-P 2MHz sine wave
is applied to Amp B. Figure 30 shows the ENABLE signal
and the resulting output waveform at VOUT. Observe the
break-before-make operation of the multiplexing. Amp A is
on and VIN1 is passed through to the output when the
ENABLE signal is low and turns off in about 25ns when the
ENABLE signal is high. About 200ns later, Amp B turns on
10
FN7103.9
September 14, 2010
EL8100, EL8101
RF
1kΩ
0V
-0.5V
ENABLE
VIN
-1.5V
C1
RG
47µF 500Ω
5V
RT
75Ω
-2.5V
5V
-
R3
C3
470µF 75Ω
VOUT
+
R1
10k
1V
75Ω
0V
B
A
R2
10k
-1V
C2
220µF
FIGURE 32. 5V SINGLE SUPPLY INVERTING VIDEO LINE
DRIVER
M = 50ns/DIV
FIGURE 30. ENABLE SIGNAL
Single Supply Video Line Driver
5V
5
4
NORMALIZED GAIN (dB)
The EL8100, EL8101 are wideband rail-to-rail output op
amplifiers with large output current, excellent dG, dP, and low
distortion that allow them to drive video signals in low supply
applications. Figure 31 is the single supply non-inverting
video line driver configuration and Figure 32 is the inverting
video ling driver configuration. The signal is AC-coupled by
C1. R1 and R2 are used to level shift the input and output to
provide the largest output swing. RF and RG set the AC gain.
C2 isolates the virtual ground potential. RT and R3 are the
termination resistors for the line. C1, C2 and C3 are selected
big enough to minimize the droop of the luminance signal.
3
2
1
AV = 2
0
-1
AV = -2
-2
-3
-4
-5
100K
1M
10M
FREQUENCY (Hz)
100M 200M
FIGURE 33. VIDEO LINE DRIVER FREQUENCY RESPONSE
VIN
C1
47µF
R1
10k
R3
C3
470µF 75Ω
+
RT
75Ω
VOUT
-
R2
10k
75Ω
RG
1kΩ
RF
1kΩ
C2
220µF
FIGURE 31. 5V SINGLE SUPPLY NON INVERTING VIDEO LINE
DRIVER
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
11
FN7103.9
September 14, 2010
EL8100, EL8101
Package Outline Drawing
M8.15E
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 0, 08/09
4
4.90 ± 0.10
A
DETAIL "A"
0.22 ± 0.03
B
6.0 ± 0.20
3.90 ± 0.10
4
PIN NO.1
ID MARK
5
(0.35) x 45°
4° ± 4°
0.43 ± 0.076
1.27
0.25 M C A B
SIDE VIEW “B”
TOP VIEW
1.75 MAX
1.45 ± 0.1
0.25
GAUGE PLANE
C
SEATING PLANE
0.10 C
0.175 ± 0.075
SIDE VIEW “A
0.63 ±0.23
DETAIL "A"
(0.60)
(1.27)
NOTES:
(1.50)
(5.40)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5.
The pin #1 identifier may be either a mold or mark feature.
6.
Reference to JEDEC MS-012.
TYPICAL RECOMMENDED LAND PATTERN
12
FN7103.9
September 14, 2010
EL8100, EL8101
Package Outline Drawing
P5.064A
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 0, 2/10
1.90
0-3°
D
A
0.08-0.20
5
4
PIN 1
INDEX AREA
2.80
3
1.60
3
0.15 C D
2x
2
5
(0.60)
0.20 C
2x
0.95
SEE DETAIL X
B
0.40 ±0.05
3
END VIEW
0.20 M C A-B D
TOP VIEW
10° TYP
(2 PLCS)
2.90
5
H
0.15 C A-B
2x
C
1.45 MAX
1.14 ±0.15
0.10 C
SIDE VIEW
SEATING PLANE
(0.25) GAUGE
PLANE
0.45±0.1
0.05-0.15
4
DETAIL "X"
(0.60)
(1.20)
NOTES:
(2.40)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to guage plane.
5.
This dimension is measured at Datum “H”.
6.
Package conforms to JEDEC MO-178AA.
(0.95)
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
13
FN7103.9
September 14, 2010
EL8100, EL8101
Package Outline Drawing
P6.064A
6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 0, 2/10
1.90
0-3°
0.95
D
0.08-0.20
A
5
6
4
PIN 1
INDEX AREA
2.80
3
1.60
3
0.15 C D
2x
1
(0.60)
3
2
0.20 C
2x
0.40 ±0.05
B
5
SEE DETAIL X
3
0.20 M C A-B
D
TOP VIEW
2.90
5
END VIEW
10° TYP
(2 PLCS)
0.15 C A-B
2x
H
1.14 ±0.15
C
SIDE VIEW
0.10 C
0.05-0.15
1.45 MAX
SEATING PLANE
DETAIL "X"
(0.25) GAUGE
PLANE
0.45±0.1
4
(0.60)
(1.20)
NOTES:
(2.40)
(0.95)
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
3.
Dimension is exclusive of mold flash, protrusions or gate burrs.
4.
Foot length is measured at reference to guage plane.
5.
This dimension is measured at Datum “H”.
6.
Package conforms to JEDEC MO-178AA.
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
14
FN7103.9
September 14, 2010