LLDB3/ LLDB3TG Taiwan Semiconductor Small Signal Product 150mW Bi-directional Trigger Diode FEATURES - Surface mounted device - Hermetically sealed glass - Matte Tin(Sn) terminal finish - All external surfaces are corrosion resistant and terminals are readily solderable MECHANICAL DATA - Case: Mini-MELF package Mini-MELF (LL34) - High temperature soldering guaranteed: 260°C/10s - Weight: 29 ± 2.5 mg Hermetically Sealed Glass - Terminal: Pure tin plated, lead free, solderable per MIL-STD-202, method 208 guaranteed - Pb free and RoHS compliant MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted) PARAMETER Repetitive Peak Forward Current Power Dissipation Pulse Width = 20µs Thermal Resistance (Junction to Ambient) (Note) Junction and Storage Temperature Range SYMBOL VALUE UNIT IFRM PD 2 150 A mW RθJA 400 TJ, TSTG - 40 to + 125 o C/W o C Notes: Valid provided that electrodes are kept at ambient temperature PARAMETER Break-Over Voltage Break-Over Voltage Symmetry Dynamic Breakdown Voltage SYMBOL LLDB3 LLDB3TG LLDB3 LLDB3TG LLDB3 LLDB3TG Output Voltage TYP MAX 28 32 36 30 32 34 ±3 + / -VBO ±2 △V 5 VO 5 9 IB Leakage Current Break-Over Current VBO MIN LLDB3 LLDB3TG IBO 10 100 - 15 TEST CONDITION UNIT C=22nF V C=22nF V IBO to IF=10mA V (Note) VB = 0.5VBO (Max) V µA C=22nF µA Notes: Test Circuit Document Number: DS_S1407002 Version: D14 LLDB3/ LLDB3TG Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 1 Admissible Power Dissipation Curve Power Dissipation (mW) 160 120 80 40 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 Ambient Tempeatature (oC) Fig. 3 Repetitive Peak Pulse Current VS. Pulse Duration (Maximum Values) Fig. 2 Relative Variation of VBO VS. Junction Temperature (Typical Values) 100 1.08 Repetitive Peak Pulse Current (A) VBO [Tj] / VBO [Tj=25°C] 1.07 1.06 1.05 1.04 1.03 1.02 1.01 1 25 50 75 100 125 10 1 0.1 1 10 tp (µs) Tj (°C) Document Number: DS_S1407002 VBO : Break-Over Voltage IBO : Break-Over Current ∆V : IB : Dynamic Breakover Voltage Leakage Current at VB=0.5*VBO VF : Voltage at Current IF=10mA 100 Version: D14 LLDB3/ LLDB3TG Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. MANUFACTURE CODE (Note) PACKING CODE GREEN COMPOUND CODE PACKAGE PACKING LLDB3 L1 G Mini-MELF (LL34) 2.5K / 7" Reel LLDB3TG L1 G Mini-MELF (LL34) 2.5K / 7" Reel MARKING Note: Indicator of manufacturing site for manufacture special control, if empty means no special control requirement EXAMPLE PREFERRED P/N PART NO. LLDB3 L1G LLDB3 LLDB3-N0 L1G LLDB3 Document Number: DS_S1407002 MANUFACTURE CODE N0 PACKING CODE GREEN COMPOUND CODE DESCRIPTION L1 G Green compound L1 G Green compound Version: D14 LLDB3/ LLDB3TG Taiwan Semiconductor Small Signal Product PACKAGE OUTLINE DIMENSIONS Mini-MELF (LL34) C DIM. B Unit (mm) Unit (inch) Min Max Min Max A 3.30 3.70 0.130 0.146 B 1.40 1.60 0.055 0.063 C 0.20 0.50 0.008 0.020 A SUGGESTED PAD LAYOUT Unit (mm) Unit (inch) Typ. Typ. A 1.25 0.049 B 2.00 0.079 C 2.50 0.098 D 5.00 0.197 DIM. Document Number: DS_S1407002 Version: D14 LLDB3/ LLDB3TG Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1407002 Version: D14