PANASONIC AYF531035

AYF53
For FPC/FFC*
FPC connectors
(0.5mm pitch)
Back lock
Y5B/Y5BW
Series
FEATURES
1. Low profile, space saving back lock
type with improved lever operability
2. Mechanical design freedom
achieved by top and bottom double
contacts
3. Wide selection, including a type
with a small number of pins
Low profile and space saving design of
1.0 mm high and 3.20 mm deep (3.70
mm with lever)
Y5B and Y5BW can have a minimum of
four and two contacts respectively,
maximum reduction in design packaging.
Y5B
Y5BW
RoHS compliant
1.00
Unit: mm
Structure to lock
notches on both ends
of the FPC with
holding contacts
Applicable FPC shape
With notches
(1) The inserted FPC can be temporarily held until the lever is
closed.
(2) When the lever is closed, the holding contacts lock the
FPC by its through-holes and notches, enhancing the FPC
holding force.
* (Y5BW is compatible with FPC only.)
0
3.2
4 pin contacts (Y5B: minimum)
4. Wiring patterns can be placed
underneath the connector.
5. Man-hours for assembly can be
reduced by delivering the connectors
with their levers opened.
6. Y5BW features advanced
functionality, including a structure to
temporarily hold the FPC and a higher
holding force.
The FPC holding contacts located on
both ends of the connector facilitate
positioning of FPC and further enhance
the FPC holding force.
APPLICATIONS
A wide range of digital equipment,
including mobile phones,
smartphones, PCs, digital still camera,
and digital video camera. Ideal for
touch panels and LCD backlights,
which require connectors with a small
number of pins.
ORDERING INFORMATION
AYF 5
3
5
53: FPC Connector 0.5 mm pitch
(Back lock)
Number of pins (2 digits)
Function
3: Top and bottom double contacts (Y5B)
6: Top and bottom double contacts, lock holding type (Y5BW)
Surface treatment (Contact portion / Terminal portion)
5: Au plating/Au flash plating (Ni barrier)
ACCTB1E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/
AYF53
PRODUCT TYPES
Y5B
Height
Number of pins
4
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
1.0 mm
Y5BW
Part number
AYF530435
AYF530535
AYF530635
AYF530835
AYF531035
AYF531235
AYF531435
AYF531635
AYF532435
AYF532835
AYF533035
AYF533235
AYF533435
AYF534035
AYF534235
AYF535035
Number of pins
2
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
Part number
AYF530265
AYF530365
AYF530465
AYF530665
AYF530865
AYF531065
AYF531265
AYF531465
AYF532265
AYF532665
AYF532865
AYF533065
AYF533265
AYF533865
AYF534065
AYF534865
Packing
Inner carton (1-reel)
Outer carton
5,000 pieces
10,000 pieces
Notes: 1. Order unit;
For volume production: 1-inner carton (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
Electrical
characteristics
Item
Rated current
Rated voltage
Insulation resistance
Specifications
0.5A/pin contact (Except for holding contact)
50V AC/DC
Min. 1,000MΩ (initial)
Breakdown voltage
250V AC for 1 min.
Contact resistance
Mechanical
characteristics
FPC holding force
Ambient temperature
Storage temperature
Max. 100mΩ
Y5B: Min. 0.2N/pin contacts × pin contacts (initial)
Y5BW: Min. 0.2N/pin contacts × pin contacts + 2.0N
(initial)
–55°C to +85°C
Conditions
Using 250V DC megger (applied for 1 min.)
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Based on the contact resistance measurement method
specified by JIS C 5402.
Measurement of the maximum force applied until the
inserted compatible FPC is pulled out in the insertion axis
direction while the connector lever is closed
No freezing at low temperatures. No dew condensation.
–55°C to +85°C (product only)
–40°C to +50°C (emboss packing)
Conformed to MIL-STD-202F, method 107G
Thermal shock resistance
(with FPC inserted)
Order Temperature (°C)
1
–55 −30
2
3
85 +30
4
–55 −30
5 cycles,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
Environmental
characteristics
Humidity resistance
(with FPC inserted)
Saltwater spray resistance
(with FPC inserted)
H2S resistance
(with FPC inserted)
Soldering heat resistance
Lifetime
characteristics
Unit weight
Insertion and removal life
Time (minutes)
30
Max. 5
30
Max. 5
120 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
24 hours,
insulation resistance min. 100MΩ,
contact resistance max. 100mΩ
48 hours,
contact resistance max. 100mΩ
Peak temperature: 260°C or less
300°C within 5 sec. 350°C within 3 sec.
Bath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Reflow soldering
Soldering iron
20 times
Repeated insertion and removal: min. 10 sec./time
Bath temperature 40±2°C,
humidity 90 to 95% R.H.
Bath temperature 35±2°C,
saltwater concentration 5±1%
Y5B (50 pin contacts): 0.16 g
2. Material and surface treatment
Part name
Molded portion
Material
Housing: LCP resin (UL94V-0)
Lever: LCP resin (UL94V-0)
Contact
Copper alloy
Holding contact portion
Soldering terminals portion
Copper alloy
Copper alloy
Panasonic Corporation
Automation Controls Business Unit
Surface treatment
—
Contact portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Terminal portion; Base: Ni plating, Surface: Au plating
Base: Ni plating, Surface: Au plating
industrial.panasonic.com/ac/e/
ACCTB1E 201204-T
AYF53
DIMENSIONS (Unit: mm)
The CAD data of the products with a
CAD Data
mark can be downloaded from: http://industrial.panasonic.com/ac/e/
Y5B
A
CAD Data
0.50±0.10
1.00±0.10
(3.70)
Number of pins/
dimension
4
4.00
3.36
1.50
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
4.50
5.00
6.00
7.00
8.00
9.00
10.00
14.00
16.00
17.00
18.00
19.00
22.00
23.00
27.00
3.86
4.36
5.36
6.36
7.36
8.36
9.36
13.36
15.36
16.36
17.36
18.36
21.36
22.36
26.36
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
(1.76)
1.60
(Suction
area)
Terminal coplanarity
0.30
0.1
0.50
(Contact and
soldering terminals)
B±0.20
2.90
3.20
(0.15)
(1.50)
(FPC
insertion
depth)
(0.32)
(0.15)
C±0.20
Y5B RECOMMENDED FPC/FFC DIMENSIONS
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
(A+1)±0.05
A±0.03
(FPC) 0.35±0.03
(FFC) 0.30±0.03
20
0.
1.50 min.
(Exposed part
of the conductor)
R
5
6
8
10
12
14
16
24
28
30
32
34
40
42
50
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
0.30±0.03
A
A
0.50±0.10
3.70
1.60
(Suction
area)
(1.76)
1.00±0.10
CAD Data
Terminal coplanarity
B±0.20
0.1
(0.30)
(Contact, holding
(0.50)
contact and
soldering terminals)
(0.15)
(1.50)
(FPC
insertion
depth)
D±0.20
C±0.20
Panasonic Corporation
(0.32)
(0.15)
2.90
3.20
(0.32)
(0.15)
ACCTB1E 201204-T
C
1.50
Cutting direction
Cut FPC from the copper foil side
to the reinforcing plate side.
Y5BW
B
Number of pins/
dimension
4
2.50 min.
(Reinforcing plate)
0.50±0.07
0.50±0.03
A
Automation Controls Business Unit
Number of pins/
dimension
2
4.00
3.36
1.50
0.50
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
4.50
5.00
6.00
7.00
8.00
9.00
10.00
14.00
16.00
17.00
18.00
19.00
22.00
23.00
27.00
3.86
4.36
5.36
6.36
7.36
8.36
9.36
13.36
15.36
16.36
17.36
18.36
21.36
22.36
26.36
2.00
2.50
3.50
4.50
5.50
6.50
7.50
11.50
13.50
14.50
15.50
16.50
19.50
20.50
24.50
1.00
1.50
2.50
3.50
4.50
5.50
6.50
10.50
12.50
13.50
14.50
15.50
18.50
19.50
23.50
A
B
C
industrial.panasonic.com/ac/e/
D
AYF53
Y5BW RECOMMENDED FPC DIMENSIONS
(Finished thickness: t = 0.3±0.03)
The conductive parts should be based by Ni plating and then Au plating.
Notches type
(A+2)±0.05
A±0.03
0.50±0.03 (Pitch) 0.35±0.03
0.50
3
4
6
8
10
12
14
22
26
28
30
32
38
40
48
1.00
1.50
2.50
3.50
4.50
5.50
6.50
10.50
12.50
13.50
14.50
15.50
18.50
19.50
23.50
R0.20R
R0
.25
ma
x.
0.20
*1
Not interfere
conductor
2.50 min.
(Reinforcing plate)
x.
ma
.25
R0
*1
0.70±0.05 0.30±0.03
.20
R0
0.80±0.05
1.30±0.10
1.50 min.
(Conductor
exposed area)
1.00±0.07
Number of pins/
dimension
2
Cutting direction (*2)
(*2) Cut FPC from the copper foil side
to the reinforcing plate side.
A
EMBOSSED TAPE DIMENSIONS (Unit: mm) (Common for respective contact type)
• Specifications for taping
Tape I
Tape II
(A±0.3)
(A±0.3)
(C)
(B)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(B)
(1.75)
(D±1)
(1.75)
Taping reel
Embossed carrier tape
380 dia.
(2.0)
(4.0)
(2.0)
(4.0)
Leading direction after packaging
Top cover tape
8.0
(8.0)
Embossed mounting-hole
Label
1.5
.1
+0 0.0
50
1.
0 +00.1
.0
dia
a.
di
.
• Y5B Dimension table (Unit: mm)
Number of pins
4 to 10
12 to 30
32 to 34
40 to 50
Type of taping
Tape I
Tape I
Tape II
Tape II
A
16.0
24.0
32.0
44.0
B
7.5
11.5
14.2
20.2
C
–
–
28.4
40.4
D
17.4
25.4
33.4
45.4
Quantity per reel
5,000
5,000
5,000
5,000
A
16.0
24.0
32.0
44.0
B
7.5
11.5
14.2
20.2
C
–
–
28.4
40.4
D
17.4
25.4
33.4
45.4
Quantity per reel
5,000
5,000
5,000
5,000
• Y5BW Dimension table (Unit: mm)
Number of pins
2 to 8
10 to 28
30 to 32
38 to 48
Type of taping
Tape I
Tape I
Tape II
Tape II
• Connector orientation with respect to embossed tape feeding direction
Type
Direction
of tape progress
Panasonic Corporation
Y5B
Automation Controls Business Unit
Y5BW
industrial.panasonic.com/ac/e/
ACCTB1E 201204-T
AYF53
NOTES
1. Recommended PC board and metal
mask patterns
Connectors are mounted with high pitch
density, intervals of 0.3 mm or 0.5 mm.
In order to reduce solder bridges and
other issues make sure the proper levels
of solder is used.
The figures to the right are recommended
metal mask patterns. Please use them as
a reference.
• Y5B/Y5BW
0.80±0.03
Recommended PC board pattern
(mounting layout)
(TOP VIEW)
0.40±0.03
1.00±0.03
0.80±0.03
3.30±0.03
0.50±0.03
0.30±0.03
2. Precautions for insertion/removal of
FPC
Do not apply an excessive load to the
lever in the opening direction beyond its
open position; otherwise, the lever may
be deformed or removed.
Do not open/close the lever without an
FPC inserted; otherwise, the terminals
may be deformed, and the FPC insertion
force may increase.
Do not apply an excessive load to the
lever in a direction perpendicular to the
lever rotation axis or in the lever opening
direction; otherwise, the terminals may
be deformed, and the lever may be
removed.
1.00±0.03
Recommended metal mask pattern
0.31±0.01
Metal mask thickness: Here, 120µm
(Terminal portion opening area ratio: 31.8%)
(Soldering terminal portion opening area ratio: 100%)
0.50±0.01
0.40±0.01
1.00±0.01
ACCTB1E 201204-T
1.00±0.01
0.80±0.01
3.10±0.01
0.25±0.01
These connectors are of the back lock
type, which has the FPC insertion section
on the opposite side of the lever.
Carefully place the FPC in the insertion
position or the lever opening/closing
position. Otherwise, a contact failure or
connector breakage may occur.
These connectors have top and bottom
double contacts. Do not insert an FPC
upside down. Inserting an FPC in a
direction opposite to that you intended
may cause an operation failure or
malfunction.
Fully open the lever to insert an FPC.
Completely insert the FPC horizontally.
An FPC inserted at an excessive angle to
the board may cause the deformation of
metal parts, FPC insertion failures, and
FPC circuit breakages.
Insert the FPC to the full depth of the
connector without altering the angle.
Panasonic Corporation
Automation Controls Business Unit
To close the lever, turn down the lever by
pressing the entire lever or both sides of
the lever with fingers tips.
If pressure to the lever is applied
unevenly, such as to an edge only, it may
deform or break. Also, make sure that the
lever is closed completely. Not doing so
will cause a faulty connection.
Avoid applying an excessive load to the
top of the lever during or after closing the
lever. Otherwise, the terminals may be
deformed.
When opening the lever to remove the
FPC, ensure that the lever will not go over
the initial position; otherwise, the lever
may be removed.
Remove the FPC at parallel with the lever
fully opened. If the lever is closed, or if
the FPC is forcedly pulled, the product or
FPC may break.
If a lever is accidentally detached during
the handling of a connector, do not use
the connector any longer.
After an FPC is inserted, carefully handle
it so as not to apply excessive stress to
the base of the FPC.
3. Cautions for using Y5BW
The holding contacts cannot be used as
conductors.
The holding contacts are located on both
ends of the contacts, and the shape of
the soldered portions is the same as that
of the other contacts. Use caution to
ensure connect identification.
Please refer to the latest product
specifications when designing your
product.
industrial.panasonic.com/ac/e/
Notes on Using FPC Connectors (Common)
PC board design
Design the recommended foot pattern in
order to secure the mechanical strength
in the soldered areas of the terminal.
FPC and equipment design
Design the FPC based with
recommended dimensions to ensure the
required connector performance.
When back lock type is used, secure
enough space for closing the lever and
for open-close operation of the lever.
Due to the FPC size, weight, or the
reaction force of the routed FPC.
Carefully check the equipment design
and take required measures to prevent
the FPC from being removed due to a fall,
vibration, or other impact.
Connector mounting
Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
Soldering
1) Manual soldering.
• Due to the connector’s compact size, if
an excessive amount of solder is applied
during manual soldering, the solder may
creep up near the contact points, or
solder interference may cause imperfect
contact.
• Make sure that the soldering iron tip is
heated within the temperature and time
limits indicated in the specifications.
• Flux from the solder wire may adhere to
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any flux before use.
• Be aware that a load applied to the
connector terminals while soldering may
displace the contact.
• Thoroughly clean the iron tip.
2) Reflow soldering
• Screen-printing is recommended for
printing paste solder.
• To achieve the appropriate soldering
state, make sure that the reflow
temperature, PC board foot pattern,
window size and thickness of metal mask
are recommended condition.
• Note that excess solder on the terminals
prevents complete insertion of the FPC,
and that excess solder on the soldering
terminals prevents the lever from rotating.
Terminal
Paste solder
• Consult us when using a screen-printing
thickness other than that recommended.
• Depending on the size of the connector
being used, self alignment may not be
possible. Accordingly, carefully position
the terminal with the PC board pattern.
• The recommended reflow temperature
profile is given in the figure below
Recommended reflow temperature
profile
Upper limit (Soldering heat resistance)
Lower limit (Solder wettability)
Temperature
260°C
230°C
180°C
Peak temperature
Preheating
220°C
200°C
25 sec.
150°C
60 to 120 sec.
70 sec.
Time
• The temperature is measured on the
surface of the PC board near the
connector terminal.
• Certain solder and flux types may cause
serious solder creeping. Solder and flux
characteristics should be taken into
consideration when setting the reflow
soldering conditions.
• When performing reflow soldering on
the back of the PC board after reflow
soldering the connector, secure the
connector using, for example, an
adhesive. (Double reflow soldering on the
same side is possible)
3) Reworking on a soldered portion
• Finish reworking in one operation.
• For reworking of the solder bridge, use
a soldering iron with a flat tip. Do not add
flux, otherwise the flux may creep to the
contact parts.
• Use a soldering iron whose tip
temperature is within the temperature
range specified in the specifications.
Do not drop or handle the
connector carelessly. Otherwise, the
terminals may become deformed due
to excessive force or applied
solderability may be during reflow
degrade.
Don’t open/close the lever or insert/
remove an FPC until the connector is
soldered. Forcibly applied external
pressure on the terminals can weaken
the adherence of the terminals to the
molded part or cause the terminals to
lose their evenness. In addition, do
not insert an FPC into the connector
before soldering the connector.
When cutting or bending the PC
board after mounting the connector,
be careful that the soldered sections
are subjected to excessive force.
The soldered areas should not be subjected to force.
Other Notes
When coating the PC board after
soldering the connector (to prevent the
deterioration of insulation), perform the
coating in such a way so that the coating
does not get on the connector.
The connectors are not meant to be used
for switching.
Please refer to the latest product
specifications when designing your
product.
PC board foot pattern
ACCTB13E 201204-T
Panasonic Corporation
Automation Controls Business Unit
industrial.panasonic.com/ac/e/